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Infineon Technologies TC267D40F200NBCLXUMA1

Part No.:
TC267D40F200NBCLXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
292-LFBGA
Datasheet:
AetrixTC267D40F200NBCLXUMA1.pdf
Description:
IC MCU 32BIT 2.5MB FLSH 292LFBGA
Quantity:
Payment:
Payment
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Inventory:2,522

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Product details

Overview

TC267D40F200NBCLXUMA1 from Infineon Technologies is a 32-bit dual-core AURIX™ microcontroller featuring one TC1.6P super-scalar TriCore CPU (200 MHz) and one TC1.6E scalar TriCore CPU (200 MHz), 2.5 MB ECC-protected PFlash, 96 KB DFlash for EEPROM emulation, and BGA292 package. It integrates safety-critical functions including lockstep shadow core, Safety Management Unit (SMU), and ECC-protected 48-channel DMA - designed for automotive powertrain and chassis control systems requiring ASIL-D compliance.

For engineers reviewing the TC267D40F200NBCLXUMA1 datasheet, TC267D40F200NBCLXUMA1 pinout, TC267D40F200NBCLXUMA1 application, or TC267D40F200NBCLXUMA1 equivalent, key selection criteria include dual-core real-time determinism, on-chip flash ECC coverage, ERAY/ETH/ASCLIN interface count, BGA292 thermal performance, and SMU-configurable fault reaction behavior.

Technical Context

The TC267D40F200NBCLXUMA1 implements a lockstepped TC1.6P core with full instruction-level redundancy and hardware-assisted safety checking via SMU. Its SRI crossbar enables concurrent access to PFlash, DFlash, and DSPR/PSPR memories across both CPUs while maintaining temporal isolation for safety partitions.

It supports multiple clock domains: a 200 MHz PLL-driven core clock, independent 100 MHz ETH/ERAY clocks, and configurable 5 V / 3.3 V I/O pads with programmable pull-up/down reset behavior. The device includes dedicated safety peripherals - DSADC (2× 16-bit sigma-delta ADCs), HSCT (high-speed capture timers), and ERAY controller - all accessible under SMU supervision.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Two TriCore CPUs: TC1.6P (200 MHz, super-scalar, lockstepped) + TC1.6E (200 MHz, scalar, binary-compatible)
Memory 2.5 MB ECC-protected PFlash + 96 KB DFlash (EEPROM emulation) + 120 KB DSPR + 32 KB PSPR + 16 KB ICACHE
Safety Features Lockstep shadow core, SMU with configurable fault response, ECC on all SRAM/Flash, safe DMA with channel protection
Interfaces ERAY (2x), Ethernet (MII/RMII), ASCLIN (12x), QSPI (2x), I²C (2x), DSADC (2x), HSCT (6x), VADC (1x)
Package BGA292 (15 × 15 mm, 0.8 mm pitch, RoHS-compliant)
Operating Temp –40 °C to +125 °C (automotive grade, AEC-Q100 qualified)
Power Supply 1.3 V core, 3.3 V I/O (5 V tolerant on selected pins), integrated EVR with external bypass support

Pinout & Package

TC267D40F200NBCLXUMA1 uses a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad, optimized for automotive ECU thermal dissipation and high-pin-count routing. Pin definitions follow the TC267 BGA292 variant layout per Infineon's Data Sheet Section 2.3.1.

Pin/Terminal Circuit Role Design Meaning
VDDP_1.3V Core Power Supply 1.3 V supply input for CPU, cache, and internal logic; requires low-ESR ceramic decoupling near ball
VDDIO_3.3V I/O Power Supply 3.3 V supply for digital I/O banks; supports 5 V tolerance on ASCLIN/QSPI/ERAY pins per configuration
OSC_IN / OSC_OUT Crystal Oscillator Interface Connects to 20 MHz ±50 ppm crystal; enables PLL-based clock tree with jitter < 50 ps RMS
ERAY_TX0 / ERAY_RX0 FlexRay Channel 0 Transceiver Interface Differential pair supporting 10 Mbit/s FlexRay protocol; integrated termination and bus wake-up detection
ETH_MDIO / ETH_MDC Ethernet Management Interface IEEE 802.3-compliant MDIO/MDC for PHY register access; operates at ≤2.5 MHz with slew-rate control
BOOT_MODE[1:0] Boot Configuration Pins Strapped at power-on to select boot source: PFlash, DFlash, or external SPI Flash (QSPI0)

Key Features

Feature Design Value
Lockstep Core Architecture Hardware-enforced instruction-by-instruction comparison between TC1.6P and its shadow core, triggering SMU fault interrupt on mismatch
ECC Protection Coverage Full ECC (SEC-DED) on all embedded memories: PFlash, DFlash, DSPR, PSPR, ICACHE, DCACHE, and peripheral registers
DSADC Precision Timing Two independent 16-bit sigma-delta ADCs with 100 ns sampling window control and synchronized trigger from HSCT or PWM units
ERAY Protocol Offload Dedicated ERAY controller with 64-message RAM, CRC acceleration, and time-triggered communication scheduling without CPU intervention
Safe DMA Engine 48-channel DMA with address range checking, transfer size validation, and SMU-monitored error reporting per channel

Applications

Engine Control Unit (ECU) Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel engines.

IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D software partitions; provides deterministic sub-1 µs interrupt latency for spark/fuel actuation.

Use Value: Dual-core lockstep ensures fault-free execution of critical control loops; DSADC+HSCT enables precise cylinder pressure sensing and crankshaft position tracking.

Use Scenario: Torque assist calculation, motor phase current regulation, and steering angle feedback processing in 12 V/48 V EPS systems.

IC Role / Device Role / Timing Role: Main MCU managing motor FOC algorithm, CAN FD communication with vehicle network, and functional safety monitoring.

Use Value: Integrated ERAY and ASCLIN interfaces enable redundant communication paths; BGA292 thermal design sustains 125 °C ambient operation during peak torque events.

Brake-by-Wire System Vehicle Domain Controller

Use Scenario: Pressure modulation, wheel speed fusion, and fail-operational braking coordination in electro-hydraulic brake systems.

IC Role / Device Role / Timing Role: Safety-certified controller running ISO 26262 ASIL-D software; performs sensor diagnostics, actuator validation, and emergency fallback logic.

Use Value: SMU-configurable fault responses (e.g., controlled shutdown or limp-home mode); ECC-protected DFlash stores calibrated brake maps with wear compensation.

Use Scenario: Centralized aggregation of ADAS sensor data (camera, radar), path planning, and actuator command distribution across zonal ECUs.

IC Role / Device Role / Timing Role: High-bandwidth domain processor interfacing via Ethernet (100BASE-T1) and QSPI to external memory and accelerators.

Use Value: SRI crossbar delivers >2 GB/s interconnect bandwidth; dual-core architecture isolates safety-critical motion planning from non-safety middleware tasks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TC264T100F200NACXTMA1 LQFP144 package (vs. BGA292); reduced peripheral set: no Ethernet, only 1 ERAY channel, 1.5 MB PFlash Suitable for cost-sensitive body control modules where thermal density and Ethernet are not required Select when board space allows LQFP and system safety target is ASIL-B/C, not ASIL-D
TC275T100F200NACXTMA1 Higher integration: 4 MB PFlash, 128 KB DFlash, added HSM security module, same BGA292 footprint Required for secure boot, OTA updates, and cryptographic key management in connected vehicle gateways Choose when AUTOSAR SecOC, TLS offload, or HSM-based key storage are mandatory

Compared with TC264T100F200NACXTMA1, TC267D40F200NBCLXUMA1 delivers higher thermal margin and Ethernet/ERAY redundancy for ASIL-D powertrain; versus TC275T100F200NACXTMA1, it trades HSM and extra flash for lower cost and identical safety architecture - ideal for non-connected, high-integrity control nodes.

Availability

TC267D40F200NBCLXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake-by-wire modules, and vehicle domain controllers requiring stable component supply across extended automotive production lifecycles.

Supply support for TC267D40F200NBCLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive MCUs, and security solutions, headquartered in Munich.

The AURIX™ TC26x product line was engineered specifically for ASIL-D automotive safety applications - emphasizing hardware-based fault containment, deterministic real-time execution, and end-to-end memory/data path integrity for powertrain and chassis control.

FAQ

What is the maximum operating frequency of each CPU core in the TC267D40F200NBCLXUMA1?

The TC267D40F200NBCLXUMA1 features two independent TriCore CPUs: the TC1.6P super-scalar core runs at up to 200 MHz across the full –40 °C to +125 °C temperature range, and the TC1.6E scalar core also operates at up to 200 MHz with binary compatibility. Both cores maintain full performance without derating under automotive thermal conditions.

Does TC267D40F200NBCLXUMA1 support Ethernet communication, and what PHY interface modes are available?

Yes, TC267D40F200NBCLXUMA1 integrates a full IEEE 802.3-compliant Ethernet MAC with MII and RMII interface support. It supports 10/100 Mbps operation, includes dedicated ETH_MDC/ETH_MDIO for PHY register access, and provides reference clock outputs for external PHY synchronization - enabling time-sensitive networking in automotive domain controllers.

How is functional safety implemented in TC267D40F200NBCLXUMA1 beyond lockstep execution?

Beyond lockstep CPU cores, TC267D40F200NBCLXUMA1 implements safety via the Safety Management Unit (SMU), which monitors voltage, temperature, clock stability, and memory errors. It enforces ECC on all memories, provides safe DMA with channel-level protection, and supports configurable fault reactions (reset, interrupt, or safe state assertion) - all certified to ISO 26262 ASIL-D requirements.

What flash memory types and capacities are integrated, and how is EEPROM emulation handled?

The device integrates 2.5 MB of ECC-protected Program Flash (PFlash) and 96 KB of Data Flash (DFLASH). DFLASH is specifically architected for EEPROM emulation: it supports byte-wise write/erase with wear leveling managed by the built-in Flash API (FEE), enabling reliable parameter storage with >100k erase cycles and data retention >20 years at 125 °C.

TC267D40F200NBCLXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
292-LFBGA
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, WDT
Number of I/O:
169
Program Memory Size:
2.5MB (2.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
240K x 8
Voltage - Supply (Vcc/Vdd):
3.3V, 5V
Data Converters:
A/D 50x12b, 3 x Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC267D40F200NBCLXUMA1 FAQ

1.How can I place an order for TC267D40F200NBCLXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC267D40F200NBCLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC267D40F200NBCLXUMA1 reliable?

The price and inventory of TC267D40F200NBCLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC267D40F200NBCLXUMA1 is usually 5 days.

3.What payment methods are accepted for TC267D40F200NBCLXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC267D40F200NBCLXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC267D40F200NBCLXUMA1?

TC267D40F200NBCLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC267D40F200NBCLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC267D40F200NBCLXUMA1?

For technical support, including TC267D40F200NBCLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC267D40F200NBCLXUMA1 requirements.

6.How does Aetrix verify that TC267D40F200NBCLXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC267D40F200NBCLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC267D40F200NBCLXUMA1 meets industry standards.

7.What is the process for return or replacement of TC267D40F200NBCLXUMA1?

All TC267D40F200NBCLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC267D40F200NBCLXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC267D40F200NBCLXUMA1 part is unused and in its original packaging.

Return procedure for TC267D40F200NBCLXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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