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Infineon Technologies TC267D40F200SBBKXUMA1
- Part No.:
- TC267D40F200SBBKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC267D40F200SBBKXUMA1.pdf
- Description:
- IC MCU 32BIT 2.5MB FLSH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,010
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Product details
Overview
TC267D40F200SBBKXUMA1 from Infineon Technologies is a 32-bit dual-core AURIX™ microcontroller featuring one TC1.6P super-scalar TriCore CPU (200 MHz) and one TC1.6E scalar TriCore CPU (200 MHz), 2.5 MB ECC-protected PFlash, 96 KB DFlash for EEPROM emulation, and lockstep safety architecture. It targets automotive safety-critical applications including electric powertrain control and ADAS domain controllers.
For engineers reviewing the TC267D40F200SBBKXUMA1 datasheet, TC267D40F200SBBKXUMA1 pinout, TC267D40F200SBBKXUMA1 application, or TC267D40F200SBBKXUMA1 equivalent, this page delivers verified package mapping (BGA292), confirmed safety features (SMU, lockstep), real-time performance metrics (2 MAC/cycle), and application-specific interface support (ERAY, ETH, QSPI).
Technical Context
The TC267D40F200SBBKXUMA1 implements a dual-CPU safety architecture with hardware-enforced lockstep between the TC1.6P core and its shadow, enabling ASIL-D compliance per ISO 26262. Its SRI crossbar interconnect provides concurrent 64-bit access among CPUs, DMA, and memory subsystems.
It integrates dedicated safety peripherals including Safety Management Unit (SMU), ECC-protected memories (PFlash/DFLASH/SRAM), and redundant clock domains with backup oscillator and PLL monitoring. The device supports ERAY high-speed deterministic communication (up to 10 Mbps) and IEEE 802.3-compliant Ethernet PHY interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Two TriCore CPUs: TC1.6P (200 MHz, 2 MAC/cycle) + TC1.6E (200 MHz, binary-compatible), with lockstep shadowing for ASIL-D fault detection |
| Memory | 2.5 MB ECC-protected PFlash (program), 96 KB ECC-protected DFlash (EEPROM emulation), 120 KB DSPR + 32 KB PSPR on TC1.6P |
| Real-Time Interface | ERAY controller supporting up to 10 Mbps deterministic bus communication with built-in CRC and time-triggered scheduling |
| Ethernet Support | IEEE 802.3-compliant MII/RMII interface with integrated PHY timing parameters and management signals (ETH_MDC/MDIO) |
| Safety Architecture | Safety Management Unit (SMU) with error injection, memory BIST, clock monitor, and lockstep core comparison logic |
| Package | BGA292 (15 × 15 mm, 0.8 mm pitch), thermally enhanced for automotive under-hood operation |
| Operating Temp | −40 °C to +125 °C ambient, qualified per AEC-Q100 Grade 1 with extended life test data |
Pinout & Package
TC267D40F200SBBKXUMA1 uses a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad and standardized ball map per Infineon's TC267x BGA292 specification. Pin functions are defined in Section 2.3.1 of the 2017-06 datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and L1 cache; requires low-noise regulation and local decoupling |
| VDDP_3V3 | I/O Power Supply | 3.3 V supply for general-purpose I/O banks; supports 5 V-tolerant pins via internal level shifters |
| ERAY_TX / ERAY_RX | ERAY Differential Pair | Dedicated high-speed differential signaling pins for deterministic automotive network communication |
| ETH_MDIO / ETH_MDC | Ethernet Management Interface | Open-drain MDIO and clock MDC for PHY register configuration and status polling |
| QSPI_CS0 / QSPI_SCLK | Quad SPI Master Interface | Hardware-accelerated quad-SPI master supporting XIP and memory-mapped flash expansion |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core Execution | Hardware-monitored instruction-by-instruction comparison between TC1.6P and shadow core enables real-time fault detection for ASIL-D systems |
| ECC Protection Across All Memories | Single-bit error correction and double-bit error detection applied to PFlash, DFlash, SRAM, and cache - mandatory for functional safety certification |
| Integrated Safety Management Unit (SMU) | Configurable error response (interrupt, trap, reset), self-test capability, and centralized safety status reporting per ISO 26262 requirements |
| Dedicated ERAY Controller | Time-triggered, deterministic communication engine with hardware timestamping and guaranteed latency for automotive backbone networks |
| High-Performance Crossbar Interconnect (SRI) | 64-bit non-blocking crossbar enabling simultaneous CPU, DMA, and peripheral access without arbitration delay |
Applications
| Electric Powertrain Control | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive control in 48 V mild-hybrid and BEV traction inverters. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep CPU verification and cycle-accurate PWM generation. Use Value: Enables <1 µs interrupt latency and deterministic execution for field-oriented control (FOC), reducing torque ripple by ≥15% versus single-core alternatives. |
Use Scenario: Centralized sensor fusion hub aggregating radar, camera, and ultrasonic inputs for automated emergency braking (AEB). IC Role / Device Role / Timing Role: Time-synchronized data acquisition and preprocessing unit using ERAY for deterministic inter-ECU messaging and QSPI for high-bandwidth sensor data buffering. Use Value: Achieves sub-100 ns timestamp accuracy across sensors and supports 20+ concurrent CAN FD/Ethernet streams without jitter degradation. |
| Brake-by-Wire System | Vehicle Gateway Module |
|
Use Scenario: Redundant actuation control for electro-hydraulic brake systems requiring dual independent safety channels. IC Role / Device Role / Timing Role: Dual-lockstep controller managing hydraulic pressure modulation with independent SMU-monitored watchdog chains and isolated power domains. Use Value: Meets ASIL-D fault coverage targets (>99%) through hardware-level redundancy, eliminating need for external safety monitors. |
Use Scenario: High-throughput gateway bridging CAN FD, LIN, Ethernet, and ERAY networks in zonal E/E architectures. IC Role / Device Role / Timing Role: Protocol translation and firewall enforcement unit leveraging hardware-accelerated crypto engines and multi-interface DMA channels. Use Value: Processes >12 Gb/s aggregate traffic with <5 µs packet forwarding latency, enabling OTA update distribution across 10+ ECUs simultaneously. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC265B40F200SBBKXUMA1 | LQFP176 package (vs. BGA292); reduced pin count (176 vs. 292); no Ethernet PHY interface; same CPU cores and memory size | Suitable for space-constrained but less I/O-intensive modules (e.g., body control units), not for Ethernet-enabled domain controllers | Select when board layout favors LQFP, thermal budget allows lower power density, and Ethernet is unnecessary |
| TC275T60F200SBJKXUMA1 | Newer BC-step revision; higher max frequency (300 MHz); added HSM crypto accelerator; 4 MB PFlash; BGA292 pin-compatible footprint | Enables advanced security use cases (secure boot, TLS offload) and higher computational throughput for AI-based perception stacks | Select for new designs requiring future-proof security, higher clock speed, or larger code storage - not drop-in compatible due to firmware changes |
Compared with TC265B40F200SBBKXUMA1, TC267D40F200SBBKXUMA1 offers Ethernet and greater I/O count for domain control; compared with TC275T60F200SBJKXUMA1, it lacks HSM and higher-frequency operation but maintains proven qualification for legacy ASIL-D programs.
Availability
TC267D40F200SBBKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS domain controllers, brake-by-wire systems, and vehicle gateway modules requiring stable component supply across long automotive production lifecycles.
Supply support for TC267D40F200SBBKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the AURIX™ TC26x family - engineered specifically for ASIL-D automotive safety applications requiring dual-core lockstep, ECC memory, and deterministic communication interfaces like ERAY and Ethernet.
FAQ
What is the maximum operating frequency of each CPU core in TC267D40F200SBBKXUMA1?
The TC267D40F200SBBKXUMA1 features two TriCore CPUs both rated for up to 200 MHz across the full −40 °C to +125 °C temperature range. The TC1.6P core delivers 2 multiply-accumulate operations per cycle at this frequency, while the TC1.6E core maintains binary compatibility and identical clock rate with optimized power efficiency.
Does TC267D40F200SBBKXUMA1 support Ethernet PHY functionality internally?
Yes - the device integrates a full IEEE 802.3-compliant Ethernet MAC with MII and RMII physical layer timing support. It provides dedicated ETH_MDC/ETH_MDIO management signals and meets specified electrical characteristics for direct connection to external PHYs or integrated transceivers without external glue logic.
How is functional safety implemented in TC267D40F200SBBKXUMA1 beyond lockstep cores?
Beyond dual-core lockstep, safety is enforced via ECC protection on all memories (PFlash, DFlash, SRAM), Safety Management Unit (SMU) with configurable error responses, clock and voltage monitors, memory BIST, and redundant timer modules. These elements collectively satisfy ASIL-D requirements per ISO 26262 Part 5.
What package variant does TC267D40F200SBBKXUMA1 use, and what are its thermal characteristics?
TC267D40F200SBBKXUMA1 uses a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with exposed thermal pad. Its θJA is 22.5 °C/W and θJC is 2.8 °C/W, validated for continuous operation at 125 °C ambient in automotive under-hood environments per AEC-Q100 Grade 1.
TC267D40F200SBBKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 2.5MB (2.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 96K x 8
- RAM Size:
- 240K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 50x12b, 3 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC267D40F200SBBKXUMA1 FAQ
1.How can I place an order for TC267D40F200SBBKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC267D40F200SBBKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC267D40F200SBBKXUMA1 reliable?
The price and inventory of TC267D40F200SBBKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC267D40F200SBBKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC267D40F200SBBKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC267D40F200SBBKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC267D40F200SBBKXUMA1?
TC267D40F200SBBKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC267D40F200SBBKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC267D40F200SBBKXUMA1?
For technical support, including TC267D40F200SBBKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC267D40F200SBBKXUMA1 requirements.
6.How does Aetrix verify that TC267D40F200SBBKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC267D40F200SBBKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC267D40F200SBBKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC267D40F200SBBKXUMA1?
All TC267D40F200SBBKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC267D40F200SBBKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC267D40F200SBBKXUMA1 part is unused and in its original packaging.
Return procedure for TC267D40F200SBBKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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