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Infineon Technologies TC267D40F200SBCKXUMA1
- Part No.:
- TC267D40F200SBCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC267D40F200SBCKXUMA1.pdf
- Description:
- IC MCU 32BIT 2.5MB FLSH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,831
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Product details
Overview
TC267D40F200SBCKXUMA1 from Infineon Technologies is a 32-bit dual-core AURIX™ microcontroller featuring two TriCore™ CPUs (TC1.6P at up to 200 MHz and TC1.6E), 2.5 MB ECC-protected PFlash, 96 KB DFlash for EEPROM emulation, 48-channel safety DMA, and integrated Safety Management Unit (SMU). It targets automotive safety-critical applications including electric powertrain control and ADAS domain controllers.
For engineers reviewing the TC267D40F200SBCKXUMA1 datasheet, TC267D40F200SBCKXUMA1 pinout, TC267D40F200SBCKXUMA1 application, or TC267D40F200SBCKXUMA1 equivalent, this page delivers verified package mapping (BGA292), confirmed dual-core timing architecture, functional safety features (lockstep, ECC, SMU), and real-world use context in ISO 26262 ASIL-D systems.
Technical Context
The TC267 implements a lockstepped dual-CPU architecture: the primary TC1.6P core runs at up to 200 MHz with 120 KB DSPR, 32 KB PSPR, and 16 KB ICache; its shadow TC1.6E core provides binary-compatible redundancy. Both cores share a 64-bit SRI crossbar, ECC-protected memories, and synchronized interrupt handling.
It integrates safety-critical peripherals including ERAY (flexible high-speed automotive bus), Ethernet MAC (10/100 Mbit/s), multiple ASCLIN/SCI interfaces, DSADC (12-bit, 1.5 MSps), and hardware-based SMU with error injection and monitoring logic - all compliant with ISO 26262 ASIL-D requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual TriCore™: TC1.6P (200 MHz, 120 KB DSPR) + TC1.6E (200 MHz, 72 KB DSPR), lockstepped for ASIL-D compliance |
| Flash Memory | 2.5 MB Program Flash (PFlash) with ECC protection; 96 KB Data Flash (DFLASH) for EEPROM emulation |
| Operating Voltage | 3.3 V supply with 5 V-tolerant I/O pads; supports external and single-supply modes per datasheet Section 3.15 |
| ADC Performance | DSADC: 12-bit resolution, 1.5 MSps sampling rate, oversampling up to 16× for enhanced SNR in motor current sensing |
| Safety Features | SMU with error injection, ECC on all SRAM/Flash, lockstep CPU monitoring, safe DMA, and ASCLIN/ERAY safety channels |
| Communication Interfaces | ERAY (2x), Ethernet (MII/RMII), 12x ASCLIN, 4x SPI (QSPI), I²C, CAN FD (via ASC+GTM), and JTAG/DAP debug |
Pinout & Package
TC267D40F200SBCKXUMA1 is housed in a 292-ball BGA package (package code SBCK) with 0.8 mm ball pitch, designed for automotive PCB layouts requiring thermal and EMI robustness. Pin assignment follows the TC267 BGA292 variant defined in Section 2.3.1 of the datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and L1 caches; requires low-noise regulation for stable 200 MHz operation |
| VDDP_3V3 | I/O & Peripheral Power | 3.3 V supply for GPIOs, ASCLIN, QSPI, and Ethernet PHY interface; tolerant to 5 V input on select pins |
| ERAY0_TX / ERAY0_RX | ERAY Channel 0 Interface | Differential high-speed automotive bus pair supporting deterministic communication up to 10 MBd for X-by-Wire systems |
| ETH_MDIO / ETH_MDC | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC signals for PHY configuration and status monitoring in automotive Ethernet networks |
| TRSTN / TCK / TMS / TDI / TDO | JTAG Debug Port | Standard 5-pin boundary-scan interface supporting flash programming, real-time debugging, and safety verification |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core Architecture | TC1.6P primary core continuously monitored by binary-compatible TC1.6E shadow core, enabling real-time fault detection per ISO 26262 ASIL-D |
| ECC-Protected Memory Subsystem | All embedded Flash and SRAM include hardware ECC (SEC-DED), eliminating silent data corruption in safety-critical code/data storage |
| Integrated Safety Management Unit (SMU) | Dedicated hardware block for monitoring CPU lockstep divergence, memory errors, clock failures, and watchdog timeouts - no software overhead |
| High-Performance DSADC | 12-bit delta-sigma ADC with 1.5 MSps throughput and programmable oversampling, optimized for precise motor phase current measurement |
| Automotive-Grade Communication Stack | Native ERAY controller + Ethernet MAC + CAN FD-capable ASCLIN, enabling centralized domain controller architectures without external protocol bridges |
Applications
| Electric Powertrain Control | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive control in 400–800 V BEV platforms. IC Role / Device Role / Timing Role: Primary safety MCU executing ASIL-D motor control algorithms with sub-1 µs interrupt latency and deterministic DSADC sampling. Use Value: Lockstep CPU execution and ECC memory ensure fail-safe shutdown within <100 ms upon fault detection, meeting ISO 26262 requirement for propulsion systems. |
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for L2+ automated driving functions. IC Role / Device Role / Timing Role: Central domain controller managing time-synchronized data ingestion via ERAY and Ethernet, with hardware-accelerated CRC and timestamping. Use Value: Integrated ERAY + Ethernet + ASCLIN eliminates external bus bridges, reducing BOM cost and interconnect latency by >30% versus multi-chip solutions. |
| Brake-by-Wire System | Chassis Domain Controller |
|
Use Scenario: Redundant electro-hydraulic brake actuation with dual independent control paths. IC Role / Device Role / Timing Role: ASIL-D certified MCU running parallel brake control tasks on lockstepped cores, with SMU-monitored safe state transitions. Use Value: Hardware-enforced separation between primary and backup control threads prevents common-cause failures, satisfying ASIL-D decomposition requirements. |
Use Scenario: Integrated suspension, steering, and stability control coordination across distributed ECUs. IC Role / Device Role / Timing Role: High-bandwidth gateway MCU routing time-critical CAN FD, ERAY, and Ethernet traffic with hardware QoS prioritization. Use Value: On-chip 64-bit SRI crossbar enables concurrent access to PFlash, DFlash, and peripherals - sustaining >800 MB/s aggregate bandwidth under full load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC264T128F200NACXUMA1 | LQFP144 package (144-pin), reduced memory (1.5 MB PFlash, 64 KB DFlash), no Ethernet MAC, single ERAY channel | Suitable for cost-sensitive ASIL-B/C body control modules where Ethernet and dual ERAY are unnecessary | Select when footprint, thermal budget, or BOM cost constrain use of BGA292 and full peripheral set |
| TC275T128F200NACXUMA1 | Higher integration: 4 MB PFlash, 128 KB DFlash, dual Ethernet MACs, additional GTM timers, and extended temperature range (−40°C to 150°C) | Targeted at next-gen zonal controllers requiring higher memory density and extended junction temperature operation | Choose for future-proofing in high-compute domains where memory scalability and thermal headroom are critical |
Compared with TC267D40F200SBCKXUMA1, TC264 offers lower cost and simpler packaging but sacrifices Ethernet, second ERAY, and memory capacity; TC275 extends memory and thermal capability at higher price and pin count - making TC267 the optimal balance for ASIL-D powertrain and domain controllers requiring proven BGA292 reliability.
Availability
TC267D40F200SBCKXUMA1 is available at Aetrix Electronics and suitable for automotive powertrain control, ADAS domain management, brake-by-wire systems, and chassis domain controllers requiring stable component supply across long production lifecycles.
Supply support for TC267D40F200SBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The AURIX™ TC26x product line was engineered specifically for ISO 26262 ASIL-D automotive applications - emphasizing functional safety, real-time determinism, and integration of automotive-specific peripherals like ERAY and DSADC.
FAQ
What is the maximum operating frequency of the TC267D40F200SBCKXUMA1 CPU cores?
The TC267D40F200SBCKXUMA1 features two TriCore™ CPUs: the TC1.6P core operates at up to 200 MHz across the full industrial temperature range (−40°C to 125°C), and the TC1.6E shadow core also supports 200 MHz operation. This frequency is guaranteed with proper 1.3 V core supply regulation and thermal management per datasheet Section 3.4.
Does TC267D40F200SBCKXUMA1 support Ethernet communication?
Yes, TC267D40F200SBCKXUMA1 integrates a full IEEE 802.3-compliant Ethernet MAC supporting both MII and RMII physical layer interfaces. It includes dedicated ETH_MDC/ETH_MDIO management signals, transmit/receive FIFOs, and hardware timestamping - validated for automotive Ethernet deployments up to 100 Mbit/s.
How is functional safety implemented in TC267D40F200SBCKXUMA1?
Functional safety is implemented via hardware-enforced mechanisms: lockstep CPU execution with continuous comparison, ECC on all embedded memories (PFlash, DFlash, SRAM), a dedicated Safety Management Unit (SMU) with error injection and monitoring, safe DMA channels, and ASIL-D-certified peripheral interfaces including ERAY and DSADC - all documented in the safety manual and ISO 26262 certification report.
What package type and ball pitch does TC267D40F200SBCKXUMA1 use?
TC267D40F200SBCKXUMA1 uses a 292-ball BGA package with 0.8 mm ball pitch (package code SBCK), as specified in Section 2.3.1 of the datasheet. The mechanical outline and solder mask design comply with JEDEC MO-275, and thermal pad layout supports automotive-grade reflow profiles.
TC267D40F200SBCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 2.5MB (2.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 96K x 8
- RAM Size:
- 240K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 50x12b, 3 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC267D40F200SBCKXUMA1 FAQ
1.How can I place an order for TC267D40F200SBCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC267D40F200SBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC267D40F200SBCKXUMA1 reliable?
The price and inventory of TC267D40F200SBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC267D40F200SBCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC267D40F200SBCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC267D40F200SBCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC267D40F200SBCKXUMA1?
TC267D40F200SBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC267D40F200SBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC267D40F200SBCKXUMA1?
For technical support, including TC267D40F200SBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC267D40F200SBCKXUMA1 requirements.
6.How does Aetrix verify that TC267D40F200SBCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC267D40F200SBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC267D40F200SBCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC267D40F200SBCKXUMA1?
All TC267D40F200SBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC267D40F200SBCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC267D40F200SBCKXUMA1 part is unused and in its original packaging.
Return procedure for TC267D40F200SBCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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