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Infineon Technologies TC275T64F200NDCKXUMA1
- Part No.:
- TC275T64F200NDCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
TC275T64F200NDCKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:987
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Product details
Overview
TC275T64F200NDCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores: two high-performance TC1.6P (200 MHz) and one power-efficient TC1.6E (200 MHz), 4 MB program flash, 384 KB data flash for EEPROM emulation, ECC-protected memories, and integrated safety features including lockstep shadow cores and Safety Management Unit (SMU). It targets automotive real-time control applications such as engine management and ADAS domain controllers.
For engineers reviewing the TC275T64F200NDCKXUMA1 datasheet, TC275T64F200NDCKXUMA1 pinout, TC275T64F200NDCKXUMA1 application, or TC275T64F200NDCKXUMA1 equivalent, key selection considerations include dual-core lockstep capability, ASCLIN-based LIN v2.1 support up to 50 MBaud, ERAY interface compliance, and functional safety certification per ISO 26262 ASIL-D.
Technical Context
The TC275T64F200NDCKXUMA1 implements a deterministic real-time architecture with three tightly coupled TriCore CPUs sharing a 64-bit SRI crossbar interconnect, enabling concurrent access to ECC-protected PFLASH/DFLASH and SRAM resources. Its safety subsystem includes SMU, MTU (memory test unit), and hardware I/O Monitor (IOM) for runtime fault detection.
It integrates six ASCLIN channels supporting LIN physical layer compliance (J2602, v2.1), an ERAY controller for deterministic automotive networking, and a QSPI interface for external flash expansion. Clocking relies on a configurable PLL with backup oscillator and temperature-compensated 12 MHz internal RC oscillator.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Three TriCore CPUs: two TC1.6P (200 MHz, super-scalar, FPU, MAC), one TC1.6E (200 MHz, scalar, code-compatible) |
| Flash Memory | 4 MB PFLASH + 384 KB DFLASH (EEPROM-emulation capable, ECC-protected) |
| SRAM | 120 KB DSPR + 32 KB PSPR + 32 KB LMU + cache (ICACHE/DCACHE), all ECC-protected |
| Safety Features | Lockstep shadow cores (TC1.6P & TC1.6E), SMU, MTU, IOM, and ISO 26262 ASIL-D ready design |
| Communication Interfaces | 6× ASCLIN (LIN v2.1/J2602), 1× ERAY, 1× QSPI, 1× Ethernet (MII/RMII), 1× I²C, JTAG/DAP debug |
| Package & Pin Count | LQFP-176 package with 176 pins, including 5 V-tolerant I/O, LVDS-capable pads, and dedicated safety monitoring pins |
| Operating Temperature | −40 °C to +125 °C ambient, qualified for automotive under AEC-Q100 Grade 1 |
Pinout & Package
LQFP-176 package with exposed thermal pad; 176-pin configuration supports full peripheral routing, safety monitoring signals (e.g., SMU_ALARM, ERRN), and dual-voltage I/O (3.3 V core / 5 V tolerant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and internal logic; requires low-noise regulation and decoupling |
| VDDP_3V3 | I/O Power Supply | 3.3 V supply for digital I/O banks; supports 5 V-tolerant operation on designated pins |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Connects to 12–20 MHz crystal; enables precise clock generation for PLL and system timing |
| ERAY_TX / ERAY_RX | ERAY Transceiver Interface | Differential pair for deterministic automotive time-triggered communication (up to 10 Mbit/s) |
| ASCLIN0_TX / ASCLIN0_RX | LIN Physical Layer Interface | Direct connection to LIN transceiver; supports baud rates up to 50 MBaud with hardware LIN protocol handling |
| SMU_ALARM | Safety Monitor Output | Open-drain signal indicating detected safety violation; used for system-level fail-safe response |
Key Features
| Feature | Design Value |
|---|---|
| Triple-Core Lockstep Support | Enables ASIL-D compliance via independent lockstep pairs for both TC1.6P and TC1.6E cores |
| ECC-Protected Memory Subsystem | Full ECC coverage across PFLASH, DFLASH, SRAM, caches, and register files prevents silent data corruption |
| Hardware LIN Protocol Acceleration | ASCLIN modules handle LIN header checksum, response timing, and error recovery without CPU intervention |
| Integrated Safety Monitoring | SMU monitors clock, voltage, temperature, and memory integrity; triggers safe state transition on fault |
| ERAY Time-Triggered Network Interface | Supports synchronized communication across ECUs with guaranteed latency and jitter < 1 µs |
Applications
| Engine Control Unit (ECU) | Brake Control Module |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and exhaust gas recirculation control in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary real-time controller executing safety-critical engine algorithms with sub-microsecond interrupt latency. Use Value: Dual-lockstep TC1.6P cores ensure ASIL-D compliance while 4 MB PFLASH accommodates complex calibration maps and OTA update partitions. |
Use Scenario: Closed-loop pressure modulation and wheel-speed-based ABS/EBD actuation in hydraulic brake systems. IC Role / Device Role / Timing Role: Safety-certified domain controller managing CAN/ERAY communication, sensor fusion, and solenoid driver sequencing. Use Value: Integrated SMU and IOM enable continuous self-test of I/O and memory, meeting ASIL-D diagnostic coverage requirements for brake-by-wire. |
| ADAS Domain Controller | Electric Power Steering (EPS) |
Use Scenario: Sensor data aggregation (radar, camera) and decision-making for lane-keeping assist and automatic emergency braking. IC Role / Device Role / Timing Role: High-bandwidth processing node interfacing with QSPI-connected radar processors and Ethernet-connected cameras. Use Value: 64-bit SRI crossbar enables concurrent DMA transfers from multiple peripherals without bus contention, sustaining >1 Gbps aggregate throughput. |
Use Scenario: Torque assist calculation, motor phase control, and steering angle feedback processing in column-assist EPS systems. IC Role / Device Role / Timing Role: Real-time torque vectoring controller with hardware-accelerated motor control loops and safety shutdown paths. Use Value: On-chip DSADC with 16-bit resolution and 1 MSps sampling rate enables precise current sensing for field-oriented control (FOC) of brushless motors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC277TP128F200NNCKXUMA1 | BGA-292 package, 128 KB RAM, no LQFP option; adds Ethernet MAC with TSN support | Targeted at centralized gateway/ADAS fusion units requiring multi-gigabit interconnect | Select when board space allows BGA and Ethernet TSN synchronization is required |
| TC234LP32F200NACKXUMA1 | LQFP-144, single TC1.6P core (200 MHz), 2 MB PFLASH, no ERAY, reduced ASCLIN count (4) | Suitable for cost-sensitive body control modules or simpler powertrain functions | Select for ASIL-B applications where triple-core redundancy and ERAY are unnecessary |
Compared with TC275T64F200NDCKXUMA1, the TC277 offers higher integration for networked gateways but lacks LQFP packaging flexibility, while the TC234 reduces safety scope and peripheral count-making it appropriate only for lower-ASIL domains.
Availability
TC275T64F200NDCKXUMA1 is available at Aetrix Electronics and suitable for automotive engine control, brake systems, ADAS domain controllers, and electric power steering requiring stable component supply across long production lifecycles.
Supply support for TC275T64F200NDCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.
The AURIX™ TC27x product line is designed specifically for automotive safety-critical applications demanding ASIL-D compliance, deterministic real-time performance, and integrated functional safety mechanisms.
FAQ
What safety certifications does TC275T64F200NDCKXUMA1 support?
The TC275T64F200NDCKXUMA1 is designed to meet ISO 26262 ASIL-D requirements at the hardware level. It includes lockstep CPU cores, SMU, MTU, ECC-protected memories, and hardware I/O monitoring. Certification documentation-including FMEDA reports and safety manuals-is provided by Infineon and validated for use in safety-related automotive systems.
Does TC275T64F200NDCKXUMA1 support over-the-air (OTA) firmware updates?
Yes-its 4 MB PFLASH supports dual-bank partitioning, enabling secure in-field updates with rollback capability. The HSM (Hardware Security Module) variant provides cryptographic acceleration (AES-128/256, SHA-256) and secure boot verification, though this specific part number (NDCKXUMA1) does not include HSM; HSM-enabled variants are marked with "H" suffix (e.g., TC275H…).
Can TC275T64F200NDCKXUMA1 operate without an external crystal?
Yes-it includes an internal 12 MHz RC oscillator with ±2% accuracy over temperature and voltage, sufficient for non-critical timing or boot-up. However, for ASIL-D-compliant clock domains (e.g., ERAY, LIN), an external crystal (12–20 MHz) is mandatory to meet jitter and stability requirements specified in the datasheet Section 3.11.
What debug interfaces are supported on TC275T64F200NDCKXUMA1?
The device supports JTAG and DAP (Debug Access Port) interfaces for boundary scan, flash programming, and real-time debugging. DAP is preferred for production programming and high-speed trace capture via SWO (Serial Wire Output), while JTAG remains compatible with legacy tools. Both interfaces support secure debug authentication when enabled in the HSM variant.
TC275T64F200NDCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 112
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 40x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC275T64F200NDCKXUMA1 FAQ
1.How can I place an order for TC275T64F200NDCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC275T64F200NDCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC275T64F200NDCKXUMA1 reliable?
The price and inventory of TC275T64F200NDCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC275T64F200NDCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC275T64F200NDCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC275T64F200NDCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC275T64F200NDCKXUMA1?
TC275T64F200NDCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC275T64F200NDCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC275T64F200NDCKXUMA1?
For technical support, including TC275T64F200NDCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC275T64F200NDCKXUMA1 requirements.
6.How does Aetrix verify that TC275T64F200NDCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC275T64F200NDCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC275T64F200NDCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC275T64F200NDCKXUMA1?
All TC275T64F200NDCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC275T64F200NDCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC275T64F200NDCKXUMA1 part is unused and in its original packaging.
Return procedure for TC275T64F200NDCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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