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Infineon Technologies TC275T64F200WCAKXUMA1
- Part No.:
- TC275T64F200WCAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
TC275T64F200WCAKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:327
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Product details
Overview
TC275T64F200WCAKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with three lockstep-capable CPU cores (two TC1.6P at 200 MHz and one TC1.6E), 4 MB PFLASH, 384 KB DFLASH, ECC-protected SRAM, and integrated safety features including SMU, MTU, and optional HSM. It targets automotive ASIL-D functional safety applications such as electric powertrain control and brake-by-wire systems.
For engineers reviewing the TC275T64F200WCAKXUMA1 datasheet, TC275T64F200WCAKXUMA1 pinout, TC275T64F200WCAKXUMA1 application, or TC275T64F200WCAKXUMA1 equivalent, key selection criteria include dual-core lockstep operation, 200 MHz real-time performance, on-chip flash endurance for EEPROM emulation, LIN/ASCLIN and Ethernet PHY interface support, and ISO 26262 ASIL-D compliance architecture.
Technical Context
The TC275T64F200WCAKXUMA1 implements a heterogeneous multi-core architecture: two high-performance TC1.6P cores operate in parallel or lockstep mode, while the TC1.6E core handles background tasks with binary compatibility. All cores share a 64-bit SRI crossbar and access ECC-protected memory subsystems.
Its safety infrastructure includes a dedicated Safety Management Unit (SMU) that monitors CPU, memory, and peripheral faults, triggers safe states via emergency stop signals, and supports diagnostic coverage per ISO 26262 Part 5 Annex D. The Memory Test Unit (MTU) performs on-the-fly ECC correction and MBIST during startup or runtime.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Three TriCore™ CPUs: two TC1.6P (200 MHz, 120 KB DSPR, 32 KB PSPR) + one TC1.6E (200 MHz, 112 KB DSPR, 24 KB PSPR) |
| Flash Memory | 4 MB program flash (PFLASH) with ECC and 384 KB data flash (DFLASH) for EEPROM emulation |
| Real-Time Interface | Four ASCLIN channels supporting LIN v2.1/J2602 up to 50 MBaud; Ethernet MAC with MII/RMII support |
| Safety Features | Lockstep CPU pairs, SMU, MTU with ECC/MBIST, hardware I/O monitor (IOM), and optional Hardware Security Module (HSM) |
| Package & Pin Count | LQFP-176 package with 176 pins; includes dedicated emergency stop (ESTOP) input and configurable 5 V / 3.3 V I/O pads |
| Operating Temperature | −40 °C to +125 °C ambient, qualified for automotive under AEC-Q100 Grade 1 |
| Clock System | Integrated PLL supporting up to 200 MHz core clock; backup clock source and 12 MHz internal oscillator |
Pinout & Package
TC275T64F200WCAKXUMA1 is housed in a RoHS-compliant LQFP-176 package (24 mm × 24 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per Infineon's DB-Step datasheet Section 2.1.1, including dedicated ESTOP, VDDP/VSSP power domains, and configurable I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ESTOP0 | Emergency Stop Input | Asynchronous, level-sensitive signal forcing immediate CPU halt and safe state entry; monitored by SMU |
| VDDP1–VDDP8 | Core Power Supply | Eight independent 1.3 V domains for CPU clusters, peripherals, and flash; enable fine-grained power gating |
| ASCLIN0_TX / ASCLIN0_RX | LIN Transceiver Interface | Dedicated differential-capable pins supporting LIN physical layer up to 20 kbaud (standard) or 50 MBaud (high-speed mode) |
| ETH_MDIO / ETH_MDC | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC pair for PHY register configuration and status polling |
| P00.0–P15.15 | General-Purpose I/O | 176-pin multiplexed I/O bank supporting 5 V-tolerant or 3.3 V-only modes; programmable pull-up/down and slew rate |
Key Features
| Feature | Design Value |
|---|---|
| TriCore™ Heterogeneous Core Architecture | Two TC1.6P cores deliver deterministic real-time response; TC1.6E core handles non-critical tasks without compromising ASIL-D integrity |
| ECC-Protected Memory Subsystem | All on-chip SRAM, PFLASH, and DFLASH include single-bit error correction and double-bit error detection (SECDED) |
| Hardware Safety Monitor (SMU) | Monitors clock frequency, voltage, temperature, and CPU execution flow; asserts ESTOP on violation and logs fault context |
| On-Chip Flash Emulation | 384 KB DFLASH enables wear-leveling and atomic write operations for EEPROM-like data storage without external components |
| ASCLIN with LIN Protocol Engine | Hardware-accelerated LIN frame generation, checksum calculation, and auto-baud detection reduce CPU load by >70% vs software implementation |
Applications
| Electric Powertrain Control | Brake-by-Wire Systems |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive sequencing in 400 V EV traction inverters. IC Role / Device Role / Timing Role: Primary controller executing motor control algorithms with <1 µs jitter tolerance; manages PWM generation, current sensing, and fault shutdown. Use Value: Dual TC1.6P lockstep ensures ASIL-D compliance while delivering 200 MHz deterministic timing for field-oriented control loops. |
Use Scenario: Redundant hydraulic pressure modulation in electro-hydraulic brake (EHB) units. IC Role / Device Role / Timing Role: Safety-critical actuator controller with dual-lockstep CPU monitoring valve solenoid drivers and pressure sensor feedback. Use Value: Integrated SMU and ESTOP circuitry enables sub-10 ms fail-safe transition to mechanical fallback mode upon detected anomaly. |
| ADAS Domain Controller | Vehicle Gateway Module |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for Level 2+ driver assistance. IC Role / Device Role / Timing Role: High-bandwidth data aggregator using QSPI and Ethernet interfaces; runs time-synchronized sensor preprocessing kernels. Use Value: 4 MB PFLASH and 384 KB DFLASH support over-the-air update partitioning and secure boot image storage. |
Use Scenario: CAN-FD to Ethernet gateway routing diagnostics, firmware updates, and OTA commands between vehicle domains. IC Role / Device Role / Timing Role: Network bridge managing concurrent ASCLIN (LIN/CAN), Ethernet MAC, and DSADC interfaces with deterministic latency. Use Value: Sixteen ASCLIN channels (shared across variants) and hardware CRC accelerators reduce protocol stack overhead by 40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC277T64F200WCAKXUMA1 | BGA-292 package; adds ERAY controller and second Ethernet MAC; higher pin count and thermal dissipation capability | Required for multi-channel E-Ray time-triggered networks and dual-gigabit Ethernet backbone routing | Select when E-Ray protocol support or dual Ethernet PHYs are mandatory; not pin-compatible with LQFP-176 |
| TC234L64F200NACXTMA1 | Single TC1.6E core; 2 MB PFLASH; no HSM option; lower temperature grade (−40 °C to +105 °C) | Suitable for ASIL-B body control modules where cost and footprint outweigh full ASIL-D requirements | Choose for non-safety-critical chassis modules needing LIN/Ethernet but not lockstep redundancy |
Compared with TC275T64F200WCAKXUMA1, the TC277 variant enables E-Ray network integration and dual Ethernet, while the TC234 offers reduced cost and complexity for ASIL-B applications-neither provides identical pinout or safety feature set.
Availability
TC275T64F200WCAKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, ADAS domain controllers, and vehicle gateway modules requiring stable component supply across automotive production lifecycles.
Supply support for TC275T64F200WCAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing facilities.
This part belongs to the AURIX™ TC27x family-designed specifically for ISO 26262 ASIL-D automotive applications demanding lockstep processing, memory safety, and hardware-based security enforcement.
FAQ
What safety certifications does TC275T64F200WCAKXUMA1 support?
TC275T64F200WCAKXUMA1 is qualified to AEC-Q100 Grade 1 and supports ISO 26262 ASIL-D development per Infineon's certified safety package, including FMEDA reports, safety manuals, and diagnostic coverage data for SMU, MTU, and lockstep mechanisms.
Does this MCU include hardware cryptographic acceleration?
Yes-when configured with the optional Hardware Security Module (HSM), TC275T64F200WCAKXUMA1 supports AES-128/256, SHA-256, RSA-2048, and ECDSA cryptographic operations in isolated secure memory, enabling secure boot, key provisioning, and OTA update authentication.
Can TC275T64F200WCAKXUMA1 operate without external crystal?
Yes-it integrates a 12 MHz internal oscillator and PLL capable of generating all required clocks (including 200 MHz core clock) without external crystal; however, for Ethernet PHY timing accuracy or LIN baud rate precision, an external 40 MHz crystal is recommended.
What debug interface does TC275T64F200WCAKXUMA1 use?
It uses a standardized DAP (Debug Access Port) compliant with ARM CoreSight, supporting JTAG and SWD protocols; debug access includes full visibility into all three CPU cores, memory maps, and peripheral registers via Infineon's iLLD and DAVE™ toolchains.
TC275T64F200WCAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 112
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 40x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC275T64F200WCAKXUMA1 FAQ
1.How can I place an order for TC275T64F200WCAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC275T64F200WCAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC275T64F200WCAKXUMA1 reliable?
The price and inventory of TC275T64F200WCAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC275T64F200WCAKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC275T64F200WCAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC275T64F200WCAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC275T64F200WCAKXUMA1?
TC275T64F200WCAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC275T64F200WCAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC275T64F200WCAKXUMA1?
For technical support, including TC275T64F200WCAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC275T64F200WCAKXUMA1 requirements.
6.How does Aetrix verify that TC275T64F200WCAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC275T64F200WCAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC275T64F200WCAKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC275T64F200WCAKXUMA1?
All TC275T64F200WCAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC275T64F200WCAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC275T64F200WCAKXUMA1 part is unused and in its original packaging.
Return procedure for TC275T64F200WCAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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