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Infineon Technologies TC275T64F200WDCKXUMA1
- Part No.:
- TC275T64F200WDCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
TC275T64F200WDCKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:499
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Product details
Overview
TC275T64F200WDCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores (two TC1.6P super-scalar and one TC1.6E scalar), 4 MB program flash, 384 KB data flash for EEPROM emulation, 200 MHz max clock frequency, and integrated Safety Management Unit (SMU) and Memory Test Unit (MTU). It targets automotive safety-critical applications including engine control units and battery management systems.
For engineers reviewing the TC275T64F200WDCKXUMA1 datasheet, TC275T64F200WDCKXUMA1 pinout, TC275T64F200WDCKXUMA1 application, or TC275T64F200WDCKXUMA1 equivalent, key selection criteria include ASCLIN LIN support up to 50 MBaud, lockstep core configuration, ECC-protected memory architecture, and compliance with ISO 26262 ASIL-D requirements.
Technical Context
The TC275T64F200WDCKXUMA1 implements a dual-lockstep safety architecture: one TC1.6P core operates in lockstep with its shadow, while the TC1.6E core also runs in lockstep mode. Its 64-bit SRI crossbar enables concurrent access between CPUs, DMA, and peripherals without arbitration bottlenecks.
It integrates four ASCLIN modules supporting hardware LIN protocol (V1.3/V2.0/V2.1/J2602) at up to 50 MBaud, and includes an optional Hardware Security Module (HSM) for secure boot and cryptographic acceleration. All embedded NVM and SRAM are protected by ECC, and the MTU supports on-the-fly memory initialization and MBIST.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Three TriCore™: two TC1.6P (200 MHz, DSP/FPU, 120 KB DSPR) + one TC1.6E (200 MHz, code-compatible, 112 KB DSPR) |
| Flash Memory | 4 MB PFLASH + 384 KB DFLASH for EEPROM emulation; all ECC-protected |
| Clock Frequency | Up to 200 MHz across full industrial temperature range (−40°C to +125°C) |
| Safety Features | Lockstep CPU pairs, SMU, MTU, IOM, ECC on all memories, ISO 26262 ASIL-D ready |
| Communication Interfaces | 4× ASCLIN (LIN V2.1/J2602, up to 50 MBaud), QSPI, ETH (MII/RMII), ERAY, I²C, JTAG/DAP |
| Package & Pins | LQFP-176 package with 176 leads; 5 V/3.3 V switchable I/Os, LVDSH/LVDSM high-speed pads |
| Power Supply | 1.3 V core, 3.3 V I/O, 5 V tolerant pins; EVR integrated voltage regulator |
Pinout & Package
TC275T64F200WDCKXUMA1 is housed in a RoHS-compliant LQFP-176 package (24 × 24 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per Infineon's TC275x LQFP176 Pin Configuration (Data Sheet Section 2.1.1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1.3 | Core Power Supply | 1.3 V supply for CPU cores and internal logic; requires low-noise decoupling |
| VDDIO_3.3 | I/O Power Supply | 3.3 V supply for general-purpose I/O banks; supports 5 V-tolerant operation on selected pins |
| OSC_IN / OSC_OUT | External Crystal Interface | Connects to 1–40 MHz crystal; feeds main PLL and backup clock paths |
| ASCLIN0_TX / ASCLIN0_RX | LIN Transceiver Interface | Dedicated pins for hardware LIN bus communication (V2.1 compliant, 50 MBaud max) |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC interface for PHY register access |
| TRSTN / TCK / TMS / TDI / TDO | JTAG Debug Interface | Standard 5-pin JTAG port for boundary scan, flash programming, and real-time debugging |
Key Features
| Feature | Design Value |
|---|---|
| TriCore™ Multi-Core Architecture | Dual TC1.6P + TC1.6E cores enable real-time task partitioning: safety-critical tasks on lockstepped TC1.6P, background tasks on TC1.6E |
| Hardware LIN Support | Four ASCLIN modules with built-in LIN frame generation, checksum calculation, and auto-baud detection-eliminates software overhead |
| ECC-Protected Memory Subsystem | All PFLASH, DFLASH, SRAM, caches, and registers use SEC-DED ECC; MTU enables runtime memory self-test and initialization |
| Safety Monitoring Units | SMU monitors clock, reset, voltage, and watchdog faults; IOM validates digital I/O integrity via loopback and pattern checking |
| High-Speed Interconnect | 64-bit SRI crossbar allows simultaneous CPU, DMA, and peripheral access with deterministic latency-critical for time-triggered AUTOSAR stacks |
Applications
| Engine Control Unit (ECU) | Battery Management System (BMS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and exhaust gas recirculation control in ICE powertrains. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D software partitions with lockstep core validation and memory ECC. Use Value: Enables deterministic sub-microsecond interrupt response and fault containment via SMU-triggered safe state activation. |
Use Scenario: Cell voltage monitoring, thermal management, and SOC/SOH estimation in high-voltage traction batteries. IC Role / Device Role / Timing Role: Central safety processor managing isolation monitoring, fault logging, and HV contactor control per ISO 6469. Use Value: DFLASH EEPROM emulation provides wear-leveling and atomic write capability for critical calibration and event logs. |
| Electric Power Steering (EPS) | Advanced Driver Assistance (ADAS) Domain Controller |
|
Use Scenario: Torque assist computation, motor position feedback, and fail-operational torque limiting in steer-by-wire systems. IC Role / Device Role / Timing Role: Dual-lockstep TC1.6P cores execute safety-critical motor control loops; TC1.6E handles CAN FD communication and diagnostics. Use Value: Integrated EVR and 200 MHz clock ensure stable timing margins for 10 kHz FOC motor control with <1 µs jitter. |
Use Scenario: Sensor fusion preprocessing (radar/camera inputs), path planning, and actuator command arbitration in L2+ ADAS systems. IC Role / Device Role / Timing Role: High-bandwidth SRI interconnect routes radar data from QSPI-connected MMICs to TC1.6P cores for real-time FFT processing. Use Value: 4 MB PFLASH stores multiple neural network models; HSM accelerates secure OTA update verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC277T64F200WDCXUMA1 | BGA-292 package (vs. LQFP-176); adds Ethernet MAC, additional ASCLIN and QSPI channels | Higher I/O density and Ethernet connectivity required for gateway or domain controller roles | Select when board space permits BGA and 100BASE-T1 or multi-protocol routing is needed |
| TC234L64F200NACXUMA1 | Single TC1.6E core (no lockstep TC1.6P); 2 MB PFLASH; no HSM; LQFP-144 package | Cost-sensitive ASIL-B applications like HVAC or lighting control where full ASIL-D redundancy is unnecessary | Choose for non-safety-critical subsystems needing TriCore compatibility but lower BOM cost |
Compared with TC275T64F200WDCKXUMA1, the TC277 variant offers higher integration for networking-intensive roles, while the TC234 provides a streamlined, lower-cost entry point for ASIL-B designs-neither matches the TC275's balanced blend of lockstep safety, LIN performance, and LQFP accessibility.
Availability
TC275T64F200WDCKXUMA1 is available at Aetrix Electronics and suitable for engine control units, battery management systems, electric power steering modules, and ADAS domain controllers requiring stable component supply, long-term automotive lifecycle support, and ASIL-D certification readiness.
Supply support for TC275T64F200WDCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, security controllers, and automotive MCUs, headquartered in Munich with global R&D and manufacturing facilities.
The AURIX™ TC27x product line was designed specifically for ISO 26262-compliant automotive safety applications-including powertrain, chassis, and ADAS-delivering deterministic real-time performance, hardware-based safety mechanisms, and scalable multi-core architectures.
FAQ
What is the maximum operating temperature range for TC275T64F200WDCKXUMA1?
The TC275T64F200WDCKXUMA1 is rated for continuous operation from −40°C to +125°C ambient temperature, validated per AEC-Q100 Grade 1 qualification. This range supports under-hood deployment in modern ICE and hybrid powertrains where junction temperatures may exceed 150°C under transient load conditions.
Does TC275T64F200WDCKXUMA1 include hardware cryptographic acceleration?
Yes-selected variants of the TC275T64F200WDCKXUMA1 integrate an optional Hardware Security Module (HSM) supporting AES-128/256, SHA-256, RSA-2048, and ECC-256. The HSM operates independently of the main TriCore cores and provides secure key storage, trusted boot, and OTA update authentication.
How many LIN channels does TC275T64F200WDCKXUMA1 support, and what protocols are implemented?
The device integrates four ASCLIN modules, each capable of full hardware LIN 2.1 and SAE J2602 protocol handling-including automatic sync field detection, checksum generation (classic/enhanced), and slave node response timing. All four channels support up to 50 MBaud and operate concurrently without CPU intervention.
Is external RAM required for TC275T64F200WDCKXUMA1-based designs?
No-TC275T64F200WDCKXUMA1 includes 4 MB on-chip PFLASH, 384 KB DFLASH, and over 256 KB of embedded SRAM (including DSPR/PSPR/Cache), eliminating need for external RAM in most automotive ECU implementations. External memory interfaces (e.g., QSPI, EBIM) are optional for expansion only.
TC275T64F200WDCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 112
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 40x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC275T64F200WDCKXUMA1 FAQ
1.How can I place an order for TC275T64F200WDCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC275T64F200WDCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC275T64F200WDCKXUMA1 reliable?
The price and inventory of TC275T64F200WDCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC275T64F200WDCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC275T64F200WDCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC275T64F200WDCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC275T64F200WDCKXUMA1?
TC275T64F200WDCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC275T64F200WDCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC275T64F200WDCKXUMA1?
For technical support, including TC275T64F200WDCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC275T64F200WDCKXUMA1 requirements.
6.How does Aetrix verify that TC275T64F200WDCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC275T64F200WDCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC275T64F200WDCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC275T64F200WDCKXUMA1?
All TC275T64F200WDCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC275T64F200WDCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC275T64F200WDCKXUMA1 part is unused and in its original packaging.
Return procedure for TC275T64F200WDCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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