Infineon Technologies TC275TP64F200NDCKXUMA1
- Part No.:
- TC275TP64F200NDCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
TC275TP64F200NDCKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 176LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,752
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Product details
Overview
TC275TP64F200NDCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores: two high-performance TC1.6P (up to 200 MHz) and one power-efficient TC1.6E (up to 200 MHz), 4 MB program flash, 384 KB data flash for EEPROM emulation, and integrated Safety Management Unit (SMU) for ASIL-D automotive safety compliance. It targets engine control units, battery management systems, and ADAS domain controllers.
For engineers reviewing the TC275TP64F200NDCKXUMA1 datasheet, TC275TP64F200NDCKXUMA1 pinout, TC275TP64F200NDCKXUMA1 application, or TC275TP64F200NDCKXUMA1 equivalent, key selection criteria include dual-lockstep core support, ECC-protected memory hierarchy, ERAY and Ethernet interface timing, and functional safety certification per ISO 26262.
Technical Context
The TC275TP64F200NDCKXUMA1 implements a deterministic real-time architecture with three independent TriCore CPUs sharing a 64-bit SRI crossbar interconnect, enabling concurrent access to PFLASH, DFLASH, and SRAM resources. Its SMU monitors clock, voltage, temperature, and memory integrity via dedicated watchdogs and error injection logic.
It integrates dual-phase-locked loops (PLL and ERAY_PLL), supporting independent clock domains for application cores (up to 200 MHz), peripheral bus (SPB), and high-speed communication interfaces including ERAY, Ethernet (MII/RMII), and QSPI. All on-chip memories feature full ECC protection with automatic correction and lockstep error reporting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Three TriCore CPUs: two TC1.6P (200 MHz, DSP+FPU) + one TC1.6E (200 MHz, code-compatible, low-power) |
| Flash Memory | 4 MB PFLASH (ECC-protected, 128-bit wide) + 384 KB DFLASH (EEPROM-emulation capable) |
| RAM | 120 KB DSPR + 32 KB PSPR (TC1.6P); 112 KB DSPR + 24 KB PSPR (TC1.6E); all ECC-protected |
| Safety Features | Lockstep shadow cores, SMU with ASIL-D support, MTU with MBIST, IOM for I/O monitoring |
| Communication Interfaces | ERAY (2 channels), Ethernet (MII/RMII), QSPI (master/slave), 4× ASCLIN (LIN v2.1/J2602), I²C, CAN FD |
| Package & Pin Count | LQFP-176 package with 176 pins, 5 V/3.3 V switchable I/Os and LVDS-capable pads |
| Operating Temperature | −40 °C to +125 °C ambient, qualified for automotive under AEC-Q100 Grade 1 |
Pinout & Package
TC275TP64F200NDCKXUMA1 is housed in a 24 × 24 mm LQFP-176 package with exposed thermal pad, RoHS-compliant lead finish, and moisture sensitivity level (MSL) 3. Pin functions are defined per Infineon's TC275x LQFP176 Pin Configuration (Data Sheet Section 2.1.1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and cache; requires low-noise regulation and local decoupling |
| VDDP_3V3 | I/O Power Supply | 3.3 V supply for general-purpose I/Os; supports 5 V-tolerant operation on selected pins |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Connects to external 20–40 MHz crystal; enables internal PLL generation of 200 MHz system clock |
| ERAY_TX0 / ERAY_RX0 | FlexRay Channel 0 Transceiver Interface | Differential pair for high-integrity automotive network communication; supports up to 10 Mbit/s |
| ETH_MDC / ETH_MDIO | IEEE 802.3 Management Interface | Serial interface for configuring PHY registers; operates at ≤ 2.5 MHz with open-drain drive |
| TRSTN / TCK / TMS / TDI / TDO | JTAG Debug Interface | Standard 5-pin boundary-scan interface for programming, debugging, and structural test |
Key Features
| Feature | Design Value |
|---|---|
| Dual-lockstep CPU redundancy | Enables ASIL-D compliance by comparing outputs of primary and shadow TC1.6P cores in real time |
| ECC-protected memory subsystem | Full single-bit error correction and double-bit error detection across PFLASH, DFLASH, and all SRAM blocks |
| Hardware Security Module (HSM) | Optional embedded secure co-processor supporting AES-128/256, SHA-256, RSA-2048, and key provisioning |
| ERAY and Ethernet coexistence | Dedicated ERAY_PLL and ETH clock domains allow simultaneous high-reliability FlexRay and deterministic Ethernet traffic |
| ASCLIN with LIN hardware acceleration | On-the-fly LIN header checksum generation, auto-resynchronization, and slave node wake-up detection |
Applications
| Engine Control Unit (ECU) | Battery Management System (BMS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection control, and exhaust gas recirculation in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary application controller executing ASAM-MCD2 MC-compliant firmware with sub-1 µs interrupt latency. Use Value: Dual-lockstep TC1.6P cores ensure fault-detection coverage >99% for critical actuator commands per ISO 26262 Part 6 Annex D. |
Use Scenario: Cell voltage monitoring, thermal runaway prevention, and SOC/SOH estimation in EV traction batteries. IC Role / Device Role / Timing Role: Safety-critical host processor interfacing with isolated ADCs and digital isolators via SPI and CAN FD. Use Value: ECC-protected DFLASH enables robust EEPROM emulation for lifetime logging of cell degradation metrics without wear leveling overhead. |
| ADAS Domain Controller | Electric Power Steering (EPS) |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for lane-keeping and emergency braking. IC Role / Device Role / Timing Role: High-bandwidth data aggregator using QSPI to offload raw sensor frames to external LPDDR, while running safety monitor on lockstepped core. Use Value: 64-channel DMA with scatter-gather capability moves >200 MB/s of sensor data without CPU intervention, preserving real-time scheduling headroom. |
Use Scenario: Torque assist calculation, motor phase control, and steering angle feedback in steer-by-wire architectures. IC Role / Device Role / Timing Role: Real-time torque controller with <5 µs loop closure using HSCT timers and PWM output with dead-time insertion. Use Value: Integrated HSCT (High-Speed Capture and Trigger) unit achieves 1 ns resolution for precise motor current sampling synchronization with gate driver signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC277TP128F200WCKXUMA1 | BGA292 package, 128 KB RAM, no HSM option, higher pin count but same core configuration | Preferred for space-constrained PCB layouts requiring higher I/O density and thermal performance | Select when board area is constrained and BGA assembly capability exists; not drop-in compatible due to package and pinout mismatch |
| S32K344WAT0VLQY | ARM Cortex-R5F-based, 4 MB flash, 2 MB RAM, ASIL-D certified, but lacks native ERAY and TriCore toolchain compatibility | Used in gateway modules where AUTOSAR Adaptive stack and Ethernet/IP routing dominate over legacy FlexRay | Choose when migrating to ARM-based AUTOSAR Adaptive platforms; requires full software re-architecture and toolchain transition |
Compared with TC275TP64F200NDCKXUMA1, the TC277 variant offers greater I/O and memory scalability in BGA form, while the S32K344 provides ARM ecosystem alignment at the cost of TriCore-specific safety IP and ERAY integration.
Availability
TC275TP64F200NDCKXUMA1 is available at Aetrix Electronics and suitable for engine control units, battery management systems, and ADAS domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for TC275TP64F200NDCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, headquartered in Munich.
The AURIX™ TC27x product line was designed specifically for ASIL-D automotive safety applications, integrating lockstep cores, hardware safety monitors, and communication peripherals compliant with FlexRay, CAN FD, and Ethernet standards.
FAQ
What is the maximum operating frequency of the TC275TP64F200NDCKXUMA1 CPU cores?
The TC275TP64F200NDCKXUMA1 features two TC1.6P cores and one TC1.6E core, each rated for up to 200 MHz across the full industrial temperature range (−40 °C to +125 °C). This frequency is sustained under worst-case voltage and temperature conditions with proper power supply decoupling and thermal management per Infineon's layout guidelines.
Does TC275TP64F200NDCKXUMA1 include hardware support for AUTOSAR OS and MCAL drivers?
Yes - Infineon provides certified AUTOSAR 4.x-compliant MCAL drivers (including DIO, PORT, ICU, GPT, PWM, ADC, CAN, LIN, ETH, and ERAY) and supports AUTOSAR OS v4.3+ via its AURIX Development Studio (ADS) toolchain. These drivers are validated for ASIL-B/D configurations and integrate with leading RTOS and configuration tools.
How is functional safety (ISO 26262) implemented in this microcontroller?
Functional safety is implemented through hardware-enforced mechanisms: lockstep CPU pairs with comparator logic, SMU with configurable safety alarms, ECC on all memories, MTU for memory self-test, and IOM for I/O pin integrity checking. These elements collectively enable ASIL-D compliance when used per Infineon's Safety Manual and FMEDA reports.
Can TC275TP64F200NDCKXUMA1 operate with a single external crystal?
Yes - it uses a single external crystal (20–40 MHz) connected to OSC_IN/OSC_OUT to feed the internal PLL, which generates the 200 MHz system clock. The backup clock circuitry supports an optional 32.768 kHz watch crystal for RTC operation, but the main clock tree relies solely on the primary crystal and PLL.
TC275TP64F200NDCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 112
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 40x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC275TP64F200NDCKXUMA1 FAQ
1.How can I place an order for TC275TP64F200NDCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC275TP64F200NDCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC275TP64F200NDCKXUMA1 reliable?
The price and inventory of TC275TP64F200NDCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC275TP64F200NDCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC275TP64F200NDCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC275TP64F200NDCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC275TP64F200NDCKXUMA1?
TC275TP64F200NDCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC275TP64F200NDCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC275TP64F200NDCKXUMA1?
For technical support, including TC275TP64F200NDCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC275TP64F200NDCKXUMA1 requirements.
6.How does Aetrix verify that TC275TP64F200NDCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC275TP64F200NDCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC275TP64F200NDCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC275TP64F200NDCKXUMA1?
All TC275TP64F200NDCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC275TP64F200NDCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC275TP64F200NDCKXUMA1 part is unused and in its original packaging.
Return procedure for TC275TP64F200NDCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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