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Infineon Technologies TC275TP64F200NDCLXUMA1
- Part No.:
- TC275TP64F200NDCLXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
TC275TP64F200NDCLXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,092
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Product details
Overview
TC275TP64F200NDCLXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores (two TC1.6P super-scalar and one TC1.6E scalar), 4 MB program flash, 384 KB data flash, 200 MHz max clock frequency, and integrated safety features including lockstep core pairs, ECC-protected memories, and Safety Management Unit (SMU). It targets automotive powertrain and chassis control systems requiring ASIL-D compliance.
For engineers reviewing the TC275TP64F200NDCLXUMA1 datasheet, TC275TP64F200NDCLXUMA1 pinout, TC275TP64F200NDCLXUMA1 application, or TC275TP64F200NDCLXUMA1 equivalent, key selection considerations include dual-core lockstep configuration, 64-channel DMA with safety monitoring, ERAY and Ethernet interface support, and hardware security module (HSM) availability in compatible variants.
Technical Context
The TC275TP64F200NDCLXUMA1 implements a heterogeneous multi-core architecture: two high-performance TC1.6P cores (200 MHz, FPU, MAC, ICACHE/DCACHE) and one power-efficient TC1.6E core (200 MHz, PSPR/DSPR, ICACHE), all binary-compatible. Core pairs operate in lockstep for fault detection, with SMU managing safety alarms and MTU performing memory built-in self-test.
On-chip peripherals include four ASCLIN channels with LIN v2.1 support up to 50 MBaud, ERAY controller, 10/100 Mbps Ethernet MAC, QSPI, VADC/DSADC converters, and 64-channel DMA with scatter-gather and safety supervision. All embedded SRAM and NVM are protected by single-bit error correction and double-bit error detection (SECDED) ECC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Three-core TriCore™: two TC1.6P (200 MHz, FPU, 2×MAC/cycle) + one TC1.6E (200 MHz, code-compatible) |
| Flash Memory | 4 MB PFLASH + 384 KB DFLASH (EEPROM emulation); all ECC-protected for ASIL-D compliance |
| RAM | 120 KB DSPR + 32 KB PSPR + 16 KB ICACHE + 8 KB DCACHE + 32 KB LMU; ECC-protected |
| Clock System | Internal PLL supports 200 MHz core clock; backup clock source and 12 MHz oscillator included |
| Safety Features | Lockstep CPU pairs, SMU, MTU (MBIST/ECC init), IOM (I/O monitoring), HSM optional in family |
| Peripherals | 4× ASCLIN (LIN v2.1), ERAY, ETH (MII/RMII), QSPI, VADC/DSADC, 64-channel DMA with safety supervision |
| Package & Pin Count | LQFP-176 package; 176-pin footprint with dedicated safety, debug (JTAG/DAP), and high-speed I/O routing |
Pinout & Package
TC275TP64F200NDCLXUMA1 is housed in a 176-pin LQFP package (16 × 16 mm, 0.4 mm pitch) with exposed thermal pad. Pin functions are defined per Infineon's TC275x LQFP176 Pin Configuration (Data Sheet Section 2.1.1), supporting dual-voltage I/O (5 V / 3.3 V switchable), LVDS, and safety-critical signal routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 / VDDP_1 | Core Power Supply | 1.3 V supply pins for CPU and logic domains; require local decoupling for noise immunity |
| VDDA_0 / VDDA_1 | Analog Power Supply | 3.3 V analog supply for ADCs and voltage references; isolated to minimize digital coupling |
| TRST, TCK, TMS, TDO, TDI | JTAG Debug Interface | IEEE 1149.1-compliant boundary scan and debug access; supports real-time trace and secure programming |
| ERAY_TXD0 / ERAY_RXD0 | ERAY Communication Channel | Differential pair for deterministic, fault-tolerant automotive network communication (up to 10 Mbit/s) |
| ETH_MDIO / ETH_MDC | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC bus for PHY register configuration and status monitoring |
| ASCLIN0_TX / ASCLIN0_RX | LIN Serial Interface | Hardware-supported LIN 2.1 transceiver interface; enables slave node auto-synchronization and checksum handling |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Multi-Core | Two TC1.6P + one TC1.6E cores enable parallel real-time task partitioning while maintaining binary compatibility and shared memory coherency |
| ASIL-D Ready Memory Subsystem | All on-chip RAM and Flash use SECDED ECC; MTU provides runtime memory test and initialization for ISO 26262 compliance |
| Integrated Safety Monitoring | SMU monitors CPU lockstep mismatches, watchdog timeouts, and peripheral errors; triggers safe state transitions via configurable alarm actions |
| Hardware LIN Support | Four ASCLIN modules implement full LIN 2.1 protocol stack in hardware-including sync field detection, checksum, and sleep/wake handling-reducing CPU load |
| Deterministic High-Speed Buses | 64-bit SRI crossbar enables concurrent CPU, DMA, and peripheral access without arbitration bottlenecks; SPB isolates low-bandwidth peripherals |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines under varying temperature and load conditions. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions across lockstepped TC1.6P cores with cycle-accurate timing guarantees. Use Value: Dual-core lockstep + ECC memory + SMU enable certified fault detection and fail-safe torque reduction within <5 ms latency. |
Use Scenario: Closed-loop motor torque control, sensor fusion (torque, angle, current), and assist characteristic adaptation in steer-by-wire systems. IC Role / Device Role / Timing Role: Real-time executor of motor control algorithms (FOC/PID) and safety monitor for torque path integrity using TC1.6E + TC1.6P pair. Use Value: Integrated DSADC (16-bit, 1 MSps) and PWM units with dead-time insertion reduce external component count and improve loop stability. |
| Brake Control Module (BCM) | Vehicle Domain Controller |
|
Use Scenario: ABS/EBD/ESC actuation coordination with hydraulic pressure modulation and wheel speed analysis across four wheels. IC Role / Device Role / Timing Role: Central safety controller managing distributed brake commands via ERAY and CAN FD, with redundant core execution. Use Value: ERAY interface ensures deterministic <100 µs message latency and fault containment; HSM option secures firmware updates. |
Use Scenario: Consolidated control of lighting, HVAC, and body electronics with OTA update capability and functional safety isolation. IC Role / Device Role / Timing Role: Application processor running AUTOSAR Classic + adaptive middleware; uses PFLASH for dual-bank secure boot and DFLASH for parameter storage. Use Value: 4 MB PFLASH + 384 KB DFLASH enables A/B firmware swapping and EEPROM-like wear leveling without external memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC277TP128F200NDCXUMA1 | BGA-292 package; 128 KB RAM; adds Ethernet PHY interface and enhanced HSM; no LQFP option | Targeted at higher-integration domain controllers requiring PHY-level Ethernet and stronger crypto acceleration | Select when board space allows BGA and PHY integration eliminates external transceiver cost/complexity |
| TC234LP32F200NACXUMA1 | LQFP-144; single TC1.6P core; 2 MB PFLASH; no ERAY; lower temp grade (–40°C to 125°C vs. –40°C to 150°C) | Suitable for mid-tier ADAS sensors or gateway modules where ASIL-B suffices and ERAY is unused | Choose for cost-sensitive designs needing proven AURIX toolchain but reduced core count and feature set |
Compared with TC275TP64F200NDCLXUMA1, TC277 offers higher integration (PHY, HSM) at BGA-only form factor, while TC234 reduces cost and complexity for ASIL-B applications-neither matches its LQFP-176 ASIL-D balance of safety, I/O count, and package accessibility.
Availability
TC275TP64F200NDCLXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake control modules, and vehicle domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for TC275TP64F200NDCLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC2xx family-designed specifically for automotive safety-critical applications demanding ASIL-D compliance, real-time determinism, and hardware-based functional safety mechanisms.
FAQ
What is the maximum operating temperature range for TC275TP64F200NDCLXUMA1?
The TC275TP64F200NDCLXUMA1 is rated for operation from –40 °C to +150 °C ambient temperature, validated per AEC-Q100 Grade 0 qualification. This extended range supports placement near powertrain heat sources without derating, and thermal design must ensure PCB copper pour and airflow maintain junction temperature below 175 °C under worst-case load.
Does TC275TP64F200NDCLXUMA1 include an integrated Ethernet PHY?
No, TC275TP64F200NDCLXUMA1 integrates only the Ethernet MAC layer (MII/RMII interface); it requires an external PHY chip for physical layer signaling. The ETH interface supports 10/100 Mbps operation with IEEE 802.3-compliant timing, and MDIO/MDC signals allow full PHY register control and status monitoring.
Is hardware security module (HSM) available on this specific variant?
TC275TP64F200NDCLXUMA1 does not integrate the Hardware Security Module (HSM); HSM is available only on selected TC27x variants such as TC277 and TC29x. For secure boot and cryptographic acceleration in this part, external secure elements or software-based crypto libraries (with appropriate certification evidence) must be used.
How many independent LIN channels does TC275TP64F200NDCLXUMA1 support?
The device supports four independent ASCLIN modules, each configurable as a LIN master or slave with full hardware LIN 2.1 protocol handling-including automatic sync field detection, checksum generation/verification, and sleep/wake frame processing-enabling simultaneous control of multiple LIN subnetworks without CPU intervention.
TC275TP64F200NDCLXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 112
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 40x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC275TP64F200NDCLXUMA1 FAQ
1.How can I place an order for TC275TP64F200NDCLXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC275TP64F200NDCLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC275TP64F200NDCLXUMA1 reliable?
The price and inventory of TC275TP64F200NDCLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC275TP64F200NDCLXUMA1 is usually 5 days.
3.What payment methods are accepted for TC275TP64F200NDCLXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC275TP64F200NDCLXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC275TP64F200NDCLXUMA1?
TC275TP64F200NDCLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC275TP64F200NDCLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC275TP64F200NDCLXUMA1?
For technical support, including TC275TP64F200NDCLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC275TP64F200NDCLXUMA1 requirements.
6.How does Aetrix verify that TC275TP64F200NDCLXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC275TP64F200NDCLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC275TP64F200NDCLXUMA1 meets industry standards.
7.What is the process for return or replacement of TC275TP64F200NDCLXUMA1?
All TC275TP64F200NDCLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC275TP64F200NDCLXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC275TP64F200NDCLXUMA1 part is unused and in its original packaging.
Return procedure for TC275TP64F200NDCLXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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