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Infineon Technologies TC275TP64F200WCAKXUMA1

Part No.:
TC275TP64F200WCAKXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixTC275TP64F200WCAKXUMA1.pdf
Description:
IC MCU 32BIT 4MB FLASH 176LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:181

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Product details

Overview

TC275TP64F200WCAKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores (two TC1.6P super-scalar and one TC1.6E scalar), 200 MHz max clock frequency, 4 MB embedded PFlash with ECC, 384 KB DFlash for EEPROM emulation, and integrated Safety Management Unit (SMU) for ASIL-D automotive safety compliance. It targets engine control units, transmission control, and battery management systems requiring real-time deterministic execution and functional safety.

For engineers reviewing the TC275TP64F200WCAKXUMA1 datasheet, TC275TP64F200WCAKXUMA1 pinout, TC275TP64F200WCAKXUMA1 application, or TC275TP64F200WCAKXUMA1 equivalent, key selection criteria include triple-core lockstep capability, on-chip HSM support, 64-channel DMA with safe transfer, ERAY and Ethernet interface timing, and LQFP176 package compatibility with automotive-grade thermal and ESD robustness.

Technical Context

The TC275TP64F200WCAKXUMA1 implements a heterogeneous multi-core architecture: two high-performance TC1.6P cores operate at up to 200 MHz with dual MAC/FPU pipelines and 16 KB ICACHE/8 KB DCACHE, while the TC1.6E core provides binary-compatible low-power execution. All cores feature lockstepped shadow pairs for ASIL-D fault detection.

Its memory subsystem includes 4 MB ECC-protected PFlash, 384 KB DFlash with wear-leveling support, 32 KB LMU, and scratchpad RAMs (up to 120 KB DSPR total). Peripheral integration includes four ASCLIN channels with LIN v2.1, ERAY controller, 10/100 Ethernet MAC, and hardware I/O Monitor (IOM) for pin-level safety checking.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Architecture Three TriCore™ CPUs: two TC1.6P (200 MHz, dual-MAC/FPU) + one TC1.6E (200 MHz, code-compatible, low-power)
Flash Memory 4 MB PFlash with ECC protection; 384 KB DFlash usable for EEPROM emulation with wear leveling
Max Clock Frequency 200 MHz across full industrial temperature range (−40°C to 125°C ambient)
Safety Features Lockstep shadow cores, SMU, MTU (MBIST/ECC initialization), IOM, and optional Hardware Security Module (HSM)
Package & Pins LQFP176 package with 176 leads; supports 5 V / 3.3 V switchable I/O pads and LVDSM/LVDSH interfaces
Communication Interfaces 4× ASCLIN (LIN v2.1 compliant), ERAY, 10/100 Ethernet MAC, QSPI, MSC, I²C, JTAG/DAP debug
Real-Time Capabilities 64-channel DMA with safety monitoring, deterministic interrupt latency ≤ 100 ns, cross-bar interconnect (SRI) for parallel bus access

Pinout & Package

TC275TP64F200WCAKXUMA1 is housed in a RoHS-compliant LQFP176 package (24 mm × 24 mm, 0.5 mm pitch) with exposed thermal pad, rated for automotive AEC-Q100 Grade 1 operation (−40°C to +125°C).

Pin/Terminal Circuit Role Design Meaning
VDDP_1.3 Core Power Supply 1.3 V supply for CPU cores and internal logic; requires tight regulation (±3%) and local decoupling
VDDP_3.3 I/O Power Supply 3.3 V supply for general-purpose I/O banks; supports 5 V tolerant operation on select pins
ERAY_TXD0 / ERAY_RXD0 ERAY Serial Interface Differential pair for FlexRay communication; requires 100 Ω termination and controlled impedance routing
ETH_MDIO / ETH_MDC Ethernet Management Interface Open-drain MDIO and push-pull MDC signals for PHY register access per IEEE 802.3 standard
ASCLIN0_TX / ASCLIN0_RX LIN/UART Serial Interface Asynchronous serial channel supporting LIN v2.1 frame handling and automatic checksum generation
TRSTN / TCK / TMS / TDI / TDO JTAG Debug Interface Standard 5-pin boundary-scan interface for programming, debugging, and structural test

Key Features

Feature Design Value
Triple-Core Lockstep TC1.6P primary core + dedicated shadow core + TC1.6E core with independent lockstep - enables ASIL-D decomposition per ISO 26262
ECC-Protected Memory Subsystem All PFlash, DFlash, SRAM, caches, and registers protected by SEC-DED ECC - eliminates single-bit faults and detects double-bit errors
Hardware Safety Monitor (SMU) Configurable watchdog timers, clock monitor, voltage monitor, and error injection test mode - meets FMEDA requirements for safety mechanisms
On-Chip HSM Option Optional Hardware Security Module supporting AES-128/256, SHA-256, RSA-2048, and secure boot with key provisioning - enables secure OTA updates
ASCLIN with LIN Acceleration Hardware LIN frame generation, sync-break detection, and auto-baud rate adjustment - reduces CPU load by >90% vs. software LIN stack

Applications

Engine Control Unit (ECU) Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel powertrains.

IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions with lockstep verification and memory ECC.

Use Value: Deterministic 200 MHz execution ensures sub-microsecond response to crank/cam sensor interrupts; PFlash ECC prevents corruption of calibration maps during field operation.

Use Scenario: Torque assist calculation, motor phase control, and fault reaction in steer-by-wire systems.

IC Role / Device Role / Timing Role: Dual-core lockstep master controller managing torque loop (≤100 µs cycle) and safety supervisor functions simultaneously.

Use Value: 64-channel DMA offloads ADC sampling and PWM update tasks; ERAY interface synchronizes with other chassis ECUs at <1 µs jitter.

Battery Management System (BMS) Advanced Driver Assistance (ADAS) Domain Controller

Use Scenario: Cell voltage/temperature monitoring, SOC/SOH estimation, and contactor control in high-voltage traction batteries.

IC Role / Device Role / Timing Role: Safety-certified data acquisition and decision engine interfacing with isolated ADCs and galvanically separated CAN/ERAY networks.

Use Value: DFlash emulates EEPROM for logging 100k+ charge cycles with wear leveling; SMU triggers safe shutdown within 5 ms on overvoltage detection.

Use Scenario: Sensor fusion preprocessing (radar/vision), path planning, and actuator command arbitration in Level 2+ ADAS platforms.

IC Role / Device Role / Timing Role: Real-time co-processor handling time-critical sensor input buffering and CAN FD message scheduling alongside main SoC.

Use Value: Cross-bar interconnect enables concurrent access to PFlash, DFlash, and LMU without bus contention; Ethernet MAC supports time-sensitive networking (TSN) packet timestamping.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-core automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TC277TP128F200WCKXUMA1 BGA292 package; 128 KB RAM; adds second Ethernet MAC and enhanced HSM with PKA engine Required for domain controllers needing dual Ethernet ports and cryptographic acceleration Select when board layout allows BGA and system demands higher network throughput or secure boot performance
TC234LP32F200NACXUMA1 LQFP144 package; dual-core only (one TC1.6P + one TC1.6E); 2 MB PFlash; no Ethernet or ERAY Suitable for cost-sensitive ASIL-B applications like HVAC or body control modules Choose for simplified safety certification scope and reduced PCB layer count where Ethernet/ERAY are unnecessary

Compared with TC277TP128F200WCKXUMA1, this part trades BGA density and dual Ethernet for LQFP manufacturability and proven thermal performance in constrained ECU enclosures; versus TC234LP32F200NACXUMA1, it delivers full ASIL-D capability via triple-core lockstep and safety peripherals essential for powertrain use.

Availability

TC275TP64F200WCAKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, and battery management systems requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 qualification.

Supply support for TC275TP64F200WCAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D centers and wafer fabs in Dresden and Villach.

This device belongs to the AURIX™ TC2xx family-designed specifically for automotive safety-critical applications demanding ASIL-D compliance, real-time determinism, and integrated functional safety mechanisms.

FAQ

What is the maximum operating temperature for TC275TP64F200WCAKXUMA1?

The TC275TP64F200WCAKXUMA1 is qualified per AEC-Q100 Grade 1, supporting continuous operation from −40°C to +125°C ambient temperature. Its thermal design includes an exposed pad for PCB heat sinking and internal thermal monitoring via the integrated temperature sensor (±2°C accuracy), enabling dynamic clock throttling if junction temperature exceeds 150°C.

Does TC275TP64F200WCAKXUMA1 support secure boot and cryptographic operations?

Yes-when configured with the optional Hardware Security Module (HSM), it supports secure boot with SHA-256 hash verification, AES-128/256 encryption/decryption, RSA-2048 signature validation, and true random number generation. The HSM operates independently of the main TriCore CPUs and isolates keys in tamper-resistant memory.

How does the ERAY interface differ from CAN FD in TC275TP64F200WCAKXUMA1?

The ERAY controller implements the FlexRay protocol (ISO 17458), offering deterministic time-triggered communication with configurable static/dynamic segments, up to 10 Mbit/s data rate, and built-in fault-tolerant dual-channel operation. Unlike CAN FD's event-triggered arbitration, ERAY guarantees bounded latency and synchronized node startup-critical for x-by-wire and active suspension systems.

Can TC275TP64F200WCAKXUMA1 be used without the Hardware Security Module (HSM)?

Yes-the HSM is an optional silicon feature; TC275TP64F200WCAKXUMA1 functions fully without it, supporting standard boot modes, Flash programming, and all peripheral interfaces. However, ASIL-D safety goals requiring secure boot, encrypted firmware updates, or runtime attestation require HSM-enabled variants (e.g., TC275TP64F200WCAKXUMA1 with HSM option enabled in mask ROM).

TC275TP64F200WCAKXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
176-LQFP
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, WDT
Number of I/O:
112
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
472K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b, 6 x Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC275TP64F200WCAKXUMA1 FAQ

1.How can I place an order for TC275TP64F200WCAKXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC275TP64F200WCAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC275TP64F200WCAKXUMA1 reliable?

The price and inventory of TC275TP64F200WCAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC275TP64F200WCAKXUMA1 is usually 5 days.

3.What payment methods are accepted for TC275TP64F200WCAKXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC275TP64F200WCAKXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC275TP64F200WCAKXUMA1?

TC275TP64F200WCAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC275TP64F200WCAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC275TP64F200WCAKXUMA1?

For technical support, including TC275TP64F200WCAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC275TP64F200WCAKXUMA1 requirements.

6.How does Aetrix verify that TC275TP64F200WCAKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC275TP64F200WCAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC275TP64F200WCAKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC275TP64F200WCAKXUMA1?

All TC275TP64F200WCAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC275TP64F200WCAKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC275TP64F200WCAKXUMA1 part is unused and in its original packaging.

Return procedure for TC275TP64F200WCAKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC275TP64F200WCAKXUMA1 Tags

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