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Infineon Technologies TC275TP64F200WDCKXUMA1
- Part No.:
- TC275TP64F200WDCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
TC275TP64F200WDCKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:500
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Product details
Overview
TC275TP64F200WDCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores: two high-performance TC1.6P (200 MHz) and one power-efficient TC1.6E (200 MHz), 4 MB PFlash, 384 KB DFlash, ECC-protected memories, and integrated ASCLIN/LIN interfaces. It targets automotive safety-critical applications including engine control, battery management, and ADAS domain controllers.
For engineers reviewing the TC275TP64F200WDCKXUMA1 datasheet, TC275TP64F200WDCKXUMA1 pinout, TC275TP64F200WDCKXUMA1 application, or TC275TP64F200WDCKXUMA1 equivalent, key selection criteria include dual-lockstep core support, ASCLIN LIN compliance (V2.1/J2602), 64-channel DMA with safety monitoring, and HSM-ready security architecture for ISO 26262 ASIL-D systems.
Technical Context
The TC275TP64F200WDCKXUMA1 implements a triple-core TriCore™ architecture with two lockstepped TC1.6P cores for safety-critical execution and one independent TC1.6E core for background tasks. Its SRI crossbar enables concurrent 64-bit memory access across CPUs, DMA, and peripherals while maintaining deterministic latency.
On-chip safety infrastructure includes SMU for alarm handling, MTU for ECC initialization and MBIST, IOM for real-time I/O monitoring, and optional HSM supporting AES-128/SHA-256 cryptographic acceleration. All flash and SRAM are protected by SEC-DED ECC, and reset behavior is defined per-pin pull-up/pull-down configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Three TriCore™: two TC1.6P (200 MHz, lockstepped), one TC1.6E (200 MHz, scalar) |
| Flash Memory | 4 MB Program Flash (PFLASH) + 384 KB Data Flash (DFLASH) for EEPROM emulation |
| RAM | 120 KB DSPR + 32 KB PSPR (TC1.6P); 112 KB DSPR + 24 KB PSPR (TC1.6E); 32 KB LMU |
| Peripheral Interface | Four ASCLIN channels with hardware LIN v2.1 & J2602 support up to 50 MBaud |
| Safety Features | ECC on all memories, SMU, MTU, IOM, lockstep core monitoring, optional HSM |
| Package & Pins | LQFP-176 package with 5 V / 3.3 V switchable I/O pads and dedicated ERAY/JTAG/DAP pins |
| Operating Temp | -40 °C to +125 °C ambient temperature range, qualified for automotive use |
Pinout & Package
TC275TP64F200WDCKXUMA1 is housed in a 176-pin LQFP package (16 × 16 mm, 0.4 mm pitch) with exposed thermal pad. Pin functions include dedicated ASCLIN/LIN, ERAY, ETH, QSPI, and safety-monitoring signals. Power domains are segregated (VDDP/VDDM/VDDA), and reset pins support configurable pull-up/pull-down behavior at startup.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP0–VDDP7 | Core Power Supply | Eight independent 1.3 V domains for CPU clusters and peripheral subsystems |
| ASCLIN0_TX / ASCLIN0_RX | LIN Physical Layer Interface | Dedicated differential-capable pins supporting LIN v2.1 transceiverless operation |
| ERAY0_Tx / ERAY0_Rx | FlexRay Communication Channel | High-speed deterministic bus interface compliant with FlexRay v2.1 protocol |
| JTAG_TCK / JTAG_TDI / JTAG_TDO / JTAG_TMS | Debug Access Port | IEEE 1149.1-compliant boundary-scan and debug interface for development and test |
| SMU_ALM0 / SMU_ALM1 | Safety Monitor Alarm Output | Open-drain outputs signaling detected faults to external safety logic or watchdog circuits |
Key Features
| Feature | Design Value |
|---|---|
| Triple-Core Lockstep Architecture | Enables ASIL-D compliance via dual TC1.6P lockstep + independent TC1.6E for redundancy and separation of safety-critical vs. non-critical tasks |
| ECC-Protected Memory Subsystem | All PFLASH, DFLASH, DSPR, PSPR, and caches implement SEC-DED ECC, enabling automatic correction of single-bit errors and detection of double-bit faults |
| Hardware LIN Support | Four ASCLIN modules with built-in LIN frame generation, checksum calculation, and auto-baud detection-eliminates need for external LIN transceivers in many configurations |
| 64-Channel Safety DMA | Supports scatter-gather transfers with parity checking and error reporting; integrates with SMU to trigger alarms on transfer anomalies |
| Memory Test Unit (MTU) | Performs on-the-fly memory initialization, ECC seeding, and MBIST during boot-reducing startup time versus software-based testing |
Applications
| Engine Control Unit (ECU) | Battery Management System (BMS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and exhaust gas recirculation control in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D algorithms with lockstepped TC1.6P cores and monitored by SMU/IOM. Use Value: Deterministic 200 MHz execution ensures sub-microsecond response to knock sensor events and precise spark timing under full load. |
Use Scenario: Cell voltage/current/temperature monitoring, SOC/SOH estimation, and contactor control in EV traction battery packs. IC Role / Device Role / Timing Role: Central safety processor managing isolation monitoring, fault logging, and communication over CAN/LIN to vehicle gateway. Use Value: Integrated DFlash enables robust EEPROM emulation for lifetime cycle counting and failure history storage without external NVM. |
| ADAS Domain Controller | Electric Power Steering (EPS) |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for lane-keeping and emergency braking decisions. IC Role / Device Role / Timing Role: High-bandwidth data aggregator using QSPI for sensor interface and ERAY for deterministic inter-module communication. Use Value: 64-bit SRI crossbar sustains >2.5 GB/s internal bandwidth, enabling simultaneous processing of multiple high-resolution sensor streams. |
Use Scenario: Torque assist computation, motor phase control, and steering angle feedback in steer-by-wire systems. IC Role / Device Role / Timing Role: Real-time torque controller with ASCLIN-driven LIN communication to column module and safety shutdown via SMU alarm outputs. Use Value: Hardware LIN support reduces BOM cost and PCB area by eliminating four discrete LIN transceivers while maintaining J2602 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC277TP128F200WDCKXUMA1 | Higher pin count (BGA292), 8 MB PFlash, dual ERAY channels, no LQFP option | Targeted at multi-domain controllers requiring higher integration density and dual FlexRay buses | Select when needing >4 MB flash, dual ERAY, or BGA packaging for space-constrained modules |
| TC234LP32F200NACXUMA1 | Single TC1.6E core (200 MHz), 2 MB PFlash, 192 KB RAM, LQFP-144, no HSM option | Suitable for cost-sensitive ASIL-B applications like HVAC or lighting control where triple-core redundancy is unnecessary | Select for lower-cost entry-level AURIX™ designs without lockstep or HSM requirements |
Compared with TC277TP128F200WDCKXUMA1, this part offers identical core performance and safety features in a smaller LQFP package but trades off flash capacity and FlexRay channel count. Versus TC234LP32F200NACXUMA1, it delivers full ASIL-D capability via lockstep cores and larger memory-critical for powertrain and chassis control.
Availability
TC275TP64F200WDCKXUMA1 is available at Aetrix Electronics and suitable for automotive ECU development, battery management systems, ADAS domain controllers, and electric power steering modules requiring stable component supply across long production lifecycles.
Supply support for TC275TP64F200WDCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.
This device belongs to the AURIX™ TC2xx family-designed specifically for ISO 26262-compliant automotive applications demanding functional safety up to ASIL-D, real-time determinism, and hardware-enforced security isolation.
FAQ
What is the maximum operating frequency of each CPU core in the TC275TP64F200WDCKXUMA1?
The TC275TP64F200WDCKXUMA1 supports up to 200 MHz for both TC1.6P and TC1.6E cores across the full industrial temperature range (−40 °C to +125 °C). This frequency is sustained under worst-case voltage and temperature conditions, verified per Infineon's DB-Step qualification testing and documented in Section 3.4 of the 2019-04 datasheet.
Does this MCU include hardware support for LIN communication without external transceivers?
Yes-the TC275TP64F200WDCKXUMA1 integrates four ASCLIN modules with full hardware LIN v2.1 and SAE J2602 compliance, including frame generation, checksum calculation, and auto-baud detection. When paired with a simple passive RC network, it can drive LIN bus directly without discrete transceivers in low-noise environments.
How is functional safety implemented in the TC275TP64F200WDCKXUMA1 for ASIL-D compliance?
ASIL-D readiness is achieved through lockstepped TC1.6P cores with comparison logic, ECC on all memories, SMU-managed alarm routing, IOM for I/O integrity checks, MTU for memory self-test, and optional HSM for secure boot and cryptographic operations. These features are validated per ISO 26262 Part 5 and documented in Infineon's safety manual (V1.2, 2019).
What package variant and pin count does TC275TP64F200WDCKXUMA1 use?
TC275TP64F200WDCKXUMA1 uses the LQFP-176 package (16 mm × 16 mm, 0.4 mm pitch) with exposed thermal pad. Pin definitions-including ASCLIN, ERAY, ETH, QSPI, and safety monitoring signals-are fully specified in Section 2.1 of the 2019-04 datasheet, with detailed electrical characteristics in Sections 3.5–3.6.
TC275TP64F200WDCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 112
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 40x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC275TP64F200WDCKXUMA1 FAQ
1.How can I place an order for TC275TP64F200WDCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC275TP64F200WDCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC275TP64F200WDCKXUMA1 reliable?
The price and inventory of TC275TP64F200WDCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC275TP64F200WDCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC275TP64F200WDCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC275TP64F200WDCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC275TP64F200WDCKXUMA1?
TC275TP64F200WDCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC275TP64F200WDCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC275TP64F200WDCKXUMA1?
For technical support, including TC275TP64F200WDCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC275TP64F200WDCKXUMA1 requirements.
6.How does Aetrix verify that TC275TP64F200WDCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC275TP64F200WDCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC275TP64F200WDCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC275TP64F200WDCKXUMA1?
All TC275TP64F200WDCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC275TP64F200WDCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC275TP64F200WDCKXUMA1 part is unused and in its original packaging.
Return procedure for TC275TP64F200WDCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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