Infineon Technologies TC275TP64F200WDCLXUMA1
- Part No.:
- TC275TP64F200WDCLXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
TC275TP64F200WDCLXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 176LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TC275TP64F200WDCLXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with three CPU cores: two high-performance TC1.6P (200 MHz) and one power-efficient TC1.6E (200 MHz), 4 MB PFlash, 384 KB DFlash, ECC-protected memories, and integrated Safety Management Unit (SMU). It targets automotive ASIL-D safety-critical applications including engine control, transmission, and battery management systems.
For engineers reviewing the TC275TP64F200WDCLXUMA1 datasheet, TC275TP64F200WDCLXUMA1 pinout, TC275TP64F200WDCLXUMA1 application, or TC275TP64F200WDCLXUMA1 equivalent, key selection considerations include dual-lockstep core support, 64-channel DMA with safety monitoring, ERAY and Ethernet interfaces, and hardware security module (HSM) availability in select variants.
Technical Context
The TC275TP64F200WDCLXUMA1 implements a triple-core TriCore architecture with two lockstepped TC1.6P cores for functional safety and one independent TC1.6E core for background tasks. All cores operate up to 200 MHz across -40°C to 125°C ambient temperature and feature integrated FPU, MAC units, and scratchpad RAM (up to 120 KB DSPR per TC1.6P).
It integrates safety-critical subsystems including SMU, MTU (memory test unit with ECC/MBIST), IOM (I/O monitor), and optional HSM. Peripheral connectivity includes four ASCLIN channels with LIN v2.1 support, ERAY controller, 10/100 Ethernet MAC, QSPI, and 5 V-tolerant I/O with configurable pull-up/down reset behavior.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | TriCore™ TC1.6P ×2 (lockstepped) + TC1.6E ×1; binary-compatible, 200 MHz max at full temp range |
| Flash Memory | 4 MB Program Flash (PFlash) + 384 KB Data Flash (DFLASH) for EEPROM emulation; ECC-protected |
| RAM | 120 KB DSPR + 32 KB PSPR per TC1.6P core; 112 KB DSPR + 24 KB PSPR on TC1.6E; all SRAM ECC-protected |
| Safety Features | SMU, MTU (ECC/MBIST), IOM, lockstep core monitoring, and optional Hardware Security Module (HSM) |
| Communication Interfaces | ERAY, 10/100 Ethernet MAC, 4× ASCLIN (LIN v2.1 compliant), QSPI, I²C, JTAG/DAP debug |
| Package & Pin Count | LQFP-176 package with 176 pins; 5 V-tolerant I/O, configurable reset pull behavior per pin group |
| Operating Temperature | -40°C to +125°C ambient; qualified per AEC-Q100 Grade 1 with extended life test coverage |
Pinout & Package
TC275TP64F200WDCLXUMA1 is housed in a 176-pin LQFP package (24 mm × 24 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per I/O group (e.g., ASC0–ASC3, ETH, ERAY, QSPI) and support multiple alternate functions via port control registers.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 / VDDP_1 | Core Power Supply | 1.3 V supply for CPU cores and internal logic; requires low-noise regulation and local decoupling |
| VDDIO_0 / VDDIO_1 | I/O Power Supply | 3.3 V or 5 V selectable supply for GPIO banks; enables mixed-voltage interface compatibility |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Connects to external 10–20 MHz crystal; feeds main PLL and backup clock paths for timing redundancy |
| ETH_TXD0–ETH_TXD3 / ETH_RXD0–ETH_RXD3 | Ethernet PHY Interface | MII/RMII-compliant signals for 10/100 Mbps Ethernet; supports IEEE 802.3u with integrated MAC |
| ERAY_TxD / ERAY_RxD | FlexRay Communication | Dedicated differential transceiver pins for deterministic, fault-tolerant automotive network (up to 10 Mbit/s) |
| ASCLIN0_TX / ASCLIN0_RX | LIN Bus Interface | Hardware-accelerated LIN v2.1 transceiver pins; supports auto-baud detection and slave node wake-up |
Key Features
| Feature | Design Value |
|---|---|
| Triple-core lockstep configuration | Enables ASIL-D compliance by pairing TC1.6P cores in lockstep while dedicating TC1.6E to non-safety tasks |
| ECC-protected memory subsystem | All PFlash, DFlash, and SRAM include single-bit error correction and double-bit error detection (SECDED) |
| Integrated Safety Management Unit (SMU) | Monitors clock, reset, voltage, and core exceptions; triggers safe state entry on violation with configurable response |
| Hardware I/O Monitor (IOM) | Real-time digital I/O integrity checking via loopback, pattern generation, and stuck-at-fault detection |
| ASCLIN with LIN v2.1 support | Four independent serial channels with hardware LIN frame handling, checksum calculation, and sleep/wake protocol |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions with lockstep core validation. Use Value: Deterministic 200 MHz execution, ECC memory, and SMU enable ISO 26262-compliant fault detection within <50 µs latency. |
Use Scenario: Torque assist calculation, motor position feedback, and fail-safe torque reduction during steering actuation. IC Role / Device Role / Timing Role: Dual-lockstep TC1.6P cores manage safety-critical torque path; TC1.6E handles CAN/LIN gateway functions. Use Value: Integrated ERAY and ASCLIN support multi-bus vehicle networking while maintaining ASIL-D diagnostic coverage. |
| Battery Management System (BMS) | Advanced Driver Assistance (ADAS) Domain Controller |
|
Use Scenario: Cell voltage/temperature monitoring, SOC/SOH estimation, and contactor control in high-voltage traction batteries. IC Role / Device Role / Timing Role: Safety monitor for isolation barriers and HV interlock circuits using IOM and SMU-triggered safe states. Use Value: DFlash-based EEPROM emulation stores calibration data with wear leveling; ECC prevents silent corruption of critical BMS parameters. |
Use Scenario: Sensor fusion preprocessing (radar/camera inputs), path planning, and actuator command arbitration in L2+ systems. IC Role / Device Role / Timing Role: High-bandwidth SRI bus enables concurrent access to PFlash, DFlash, and DMA buffers for real-time data streaming. Use Value: 64-channel DMA with scatter-gather and safety-checking transfers offloads CPU from sensor data movement, reducing jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar tri-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC277TP128F200NDCXUMA1 | BGA292 package, 128 KB RAM per core, 8 MB PFlash, adds PCIe interface and enhanced HSM | Targeted at domain controllers requiring higher bandwidth and cryptographic acceleration | Select when PCIe host capability or >4 MB flash is required; not pin-compatible with LQFP-176 |
| TC234LP32F200NACXUMA1 | Dual-core (TC1.6P + TC1.6E), 2 MB PFlash, 200 MHz, LQFP-144, no Ethernet or ERAY | Cost-optimized ECU for ASIL-B/C applications without deterministic networking | Choose for non-networked body control modules where Ethernet/ERAY are unnecessary and footprint is constrained |
Compared with TC275TP64F200WDCLXUMA1, TC277 offers higher memory and PCIe but requires BGA rework, while TC234 reduces cost and complexity at the expense of safety networking and flash capacity - making TC275 the balanced choice for ASIL-D ECU designs needing ERAY/Ethernet in LQFP form.
Availability
TC275TP64F200WDCLXUMA1 is available at Aetrix Electronics and suitable for automotive engine control, electric power steering, and battery management systems requiring stable component supply across long production lifecycles.
Supply support for TC275TP64F200WDCLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC2xx family - engineered specifically for ISO 26262-compliant automotive safety applications, integrating lockstep cores, memory protection, and hardware safety monitors from silicon level.
FAQ
What is the maximum operating frequency and temperature range for TC275TP64F200WDCLXUMA1?
The TC275TP64F200WDCLXUMA1 operates at up to 200 MHz across the full industrial temperature range of -40°C to +125°C ambient. This rating is validated per AEC-Q100 Grade 1 and includes derating margins for sustained operation under thermal stress in engine bay environments.
Does TC275TP64F200WDCLXUMA1 include hardware support for AUTOSAR OS and MCAL drivers?
Yes - Infineon provides certified AUTOSAR Basic Software (BSW) modules including MCAL drivers for ASCLIN, ETH, ERAY, DADC, and SMU, fully compatible with TC275TP64F200WDCLXUMA1's register map and safety mechanisms per AUTOSAR 4.3 specification.
How is functional safety (ASIL-D) implemented in this microcontroller?
ASIL-D compliance is achieved through hardware-enforced redundancy: lockstep CPU pairs, ECC on all memories, SMU-monitored clock/reset domains, IOM for I/O integrity, and MTU for periodic memory self-tests - all documented in Infineon's FMEDA report and ISO 26262 TÜV-certified safety manual.
Is the Hardware Security Module (HSM) included in TC275TP64F200WDCLXUMA1?
No - the HSM is not integrated into TC275TP64F200WDCLXUMA1. It is available only in selected TC277 variants (e.g., TC277TP128F200NDCXUMA1). This part relies on software-based crypto libraries and secure boot via BROM with SHA-256 signature verification.
TC275TP64F200WDCLXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 112
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 40x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC275TP64F200WDCLXUMA1 FAQ
1.How can I place an order for TC275TP64F200WDCLXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC275TP64F200WDCLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC275TP64F200WDCLXUMA1 reliable?
The price and inventory of TC275TP64F200WDCLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC275TP64F200WDCLXUMA1 is usually 5 days.
3.What payment methods are accepted for TC275TP64F200WDCLXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC275TP64F200WDCLXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC275TP64F200WDCLXUMA1?
TC275TP64F200WDCLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC275TP64F200WDCLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC275TP64F200WDCLXUMA1?
For technical support, including TC275TP64F200WDCLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC275TP64F200WDCLXUMA1 requirements.
6.How does Aetrix verify that TC275TP64F200WDCLXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC275TP64F200WDCLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC275TP64F200WDCLXUMA1 meets industry standards.
7.What is the process for return or replacement of TC275TP64F200WDCLXUMA1?
All TC275TP64F200WDCLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC275TP64F200WDCLXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC275TP64F200WDCLXUMA1 part is unused and in its original packaging.
Return procedure for TC275TP64F200WDCLXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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