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Infineon Technologies TC277T64F200NDCKXUMA2

Part No.:
TC277T64F200NDCKXUMA2
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
292-LFBGA
Datasheet:
AetrixTC277T64F200NDCKXUMA2.pdf
Description:
IC MCU 32BIT 4MB FLASH 292LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:997

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Product details

Overview

TC277T64F200NDCKXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three lockstep-capable CPU cores (two TC1.6P @ 200 MHz + one TC1.6E @ 200 MHz), 4 MB ECC-protected program flash, 384 KB data flash for EEPROM emulation, and integrated hardware safety mechanisms including SMU, MTU, and optional HSM. It targets ASIL-D automotive powertrain and chassis control systems requiring functional safety certification.

For engineers reviewing the TC277T64F200NDCKXUMA2 datasheet, TC277T64F200NDCKXUMA2 pinout, TC277T64F200NDCKXUMA2 application, or TC277T64F200NDCKXUMA2 equivalent, key selection criteria include dual-core lockstep configuration, 200 MHz real-time execution, on-chip safety monitoring (SMU/IOM/MTU), and automotive-grade BGA292 packaging with 5 V/3.3 V switchable I/O support.

Technical Context

The TC277 implements a heterogeneous multi-core architecture: two high-performance TC1.6P cores handle deterministic real-time tasks with 200 MHz operation, 120 KB DSPR, and dual MAC/FPU; the third TC1.6E core provides power-efficient background processing at identical clock speed but reduced cache and buffer resources. All cores share a 64-bit SRI crossbar and are supported by ECC-protected memory subsystems.

Safety-critical operation is enabled by hardware-level redundancy: lockstep shadow cores for both TC1.6P and TC1.6E configurations, Safety Management Unit (SMU) for alarm aggregation, Memory Test Unit (MTU) with MBIST and ECC initialization, and Hardware I/O Monitor (IOM) for digital pin integrity verification - all compliant with ISO 26262 ASIL-D requirements.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Architecture Three TriCore™ CPUs: two TC1.6P (200 MHz, 120 KB DSPR, 32 KB PSPR) + one TC1.6E (200 MHz, 112 KB DSPR, 24 KB PSPR)
Flash Memory 4 MB PFLASH (ECC-protected) + 384 KB DFLASH (EEPROM emulation capable)
Real-Time Performance 2 MAC operations/cycle + fully pipelined FPU; supports deterministic <1 µs interrupt latency
Safety Features Lockstep shadow cores, SMU, MTU (MBIST/ECC init), IOM, and optional HSM for secure boot/crypto
I/O Voltage Support 5 V / 3.3 V switchable pads (selectable per port group), plus dedicated 3.3 V-only and LVDSH/LVDSM interfaces
Package & Pin Count BGA292 package with 292 terminals; includes dedicated JTAG/DAP debug, ERAY, ETH, QSPI, and ASCLIN interfaces
Operating Temperature -40 °C to +125 °C ambient; qualified for automotive engine bay and transmission control environments

Pinout & Package

TC277T64F200NDCKXUMA2 uses a 292-ball BGA package (15 × 15 mm, 0.8 mm pitch) with thermal pad. Pin functions are defined in Section 2.2 of the DC-Step datasheet (V1.2, 2019-04), supporting multiple I/O voltage domains, safety-redundant signal routing, and dedicated high-speed interface balls (ERAY, ETH, QSPI).

Pin/Terminal Circuit Role Design Meaning
VDDP_1P3 Core Power Supply 1.3 V supply for CPU cores and internal logic; requires low-noise regulation and decoupling per datasheet layout guidelines
VDDP_3V3 I/O Power Supply 3.3 V supply for general-purpose I/O banks; supports 5 V-tolerant switching via internal level shifters
TCK/TMS/TDO/TDI JTAG Debug Interface IEEE 1149.1-compliant boundary scan and debug access; enables full-core visibility and flash programming
ERAY_TX0/ERAY_RX0 FlexRay Communication Dedicated differential pair for FlexRay protocol (up to 10 Mbit/s); integrated transceiver biasing and fault detection
ETH_MDIO/ETH_MDC Ethernet Management IEEE 802.3 MDIO/MDC interface for PHY configuration and status monitoring in automotive Ethernet applications
QSPI_SCLK/QSPI_IO0–3 Quad SPI Interface High-speed external flash or sensor interface supporting up to 80 MHz clock and dual/quad mode transfers

Key Features

Feature Design Value
Heterogeneous Triple-Core Lockstep Two TC1.6P cores operate in lockstep for ASIL-D fault detection; TC1.6E core runs independently for non-safety tasks
ECC-Protected Memory Subsystem All embedded SRAM, Flash, and caches include single-bit error correction and double-bit error detection (SECDED)
Hardware Safety Monitoring SMU aggregates alarms from MTU, IOM, and peripheral watchdogs; triggers safe state transitions within defined timing windows
Flexible I/O Voltage Configuration Per-port group selection between 3.3 V and 5 V logic levels enables mixed-voltage system integration without external level shifters
Integrated FlexRay & Ethernet Interfaces Dedicated ERAY and ETH peripherals meet AUTOSAR-compliant timing and diagnostics requirements for domain controllers

Applications

Engine Control Unit (ECU) Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines under extreme thermal stress.

IC Role / Device Role / Timing Role: Primary safety-certified controller executing ASIL-D software partitions with lockstep core validation and memory ECC.

Use Value: Deterministic 200 MHz execution ensures sub-microsecond response to crankshaft position interrupts and closed-loop torque actuation.

Use Scenario: Torque overlay, motor position control, and assist-level modulation in steer-by-wire systems with redundant sensing.

IC Role / Device Role / Timing Role: Dual-lockstep TC1.6P cores manage safety-critical torque path; TC1.6E handles CAN FD communication and diagnostics.

Use Value: Integrated IOM validates GPIO integrity during steering angle feedback loops, preventing undetected open-circuit faults.

Brake Control Module (BCM) Vehicle Domain Controller

Use Scenario: ABS/EBD/ESC actuation coordination across four wheel channels with fail-operational redundancy.

IC Role / Device Role / Timing Role: SMU-monitored lockstep cores execute brake pressure algorithms while MTU performs periodic RAM/Flash self-tests.

Use Value: On-chip 384 KB DFLASH enables robust EEPROM emulation for calibration storage without external components.

Use Scenario: Centralized vehicle networking hub integrating CAN FD, FlexRay, and 100BASE-T1 Ethernet for zonal architecture.

IC Role / Device Role / Timing Role: Dedicated ERAY and ETH peripherals handle time-triggered communication; QSPI interfaces external AI accelerator memory.

Use Value: BGA292 package provides sufficient ball count for simultaneous high-speed interface routing with controlled impedance traces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TC275T64F200NACXUMA1 Same TriCore architecture but with 2 MB PFLASH, no optional HSM, and LQFP176 package (176-pin) Limited memory and no hardware security module; suitable for ASIL-B braking or lighting modules Select when cost-sensitive LQFP packaging and reduced flash capacity meet functional safety scope
TC297TP128F200NACXUMA1 Enhanced variant with 8 MB PFLASH, dual HSM, and extended temperature range (−40 °C to +150 °C) Targeted at next-gen electric drivetrain inverters requiring higher memory density and extended thermal margin Choose for future-proofing in high-power traction inverter designs where thermal derating is critical

Compared with TC277T64F200NDCKXUMA2, the TC275 offers lower cost and simpler packaging but sacrifices DFLASH capacity and HSM capability; the TC297 delivers greater memory headroom and thermal resilience at higher unit cost and larger footprint.

Availability

TC277T64F200NDCKXUMA2 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, and brake control modules requiring stable component supply across long production lifecycles.

Supply support for TC277T64F200NDCKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, headquartered in Munich.

The AURIX™ TC27x product line was designed specifically for ISO 26262 ASIL-D automotive applications, emphasizing functional safety, real-time determinism, and multi-bus connectivity in powertrain and chassis domains.

FAQ

What is the maximum operating frequency of each CPU core in the TC277T64F200NDCKXUMA2?

The TC277T64F200NDCKXUMA2 features two TC1.6P cores and one TC1.6E core, all rated for 200 MHz operation across the full industrial temperature range (−40 °C to +125 °C). This frequency is guaranteed under specified VDDP_1P3 (1.3 V ±3%) and VDDP_3V3 (3.3 V ±5%) supply conditions, with appropriate thermal management per the datasheet's thermal resistance limits.

Does this microcontroller include built-in hardware security features beyond basic flash protection?

Yes - the TC277T64F200NDCKXUMA2 includes an optional Hardware Security Module (HSM) supporting AES-128/256, SHA-256, RSA-2048, and TRNG. When enabled, the HSM isolates cryptographic operations from the main TriCore cores, provides secure boot verification, and manages key lifecycles in tamper-resistant memory, meeting EVITA Full and UNECE R155 compliance requirements.

How does the Safety Management Unit (SMU) interact with other safety peripherals like MTU and IOM?

The SMU acts as the central safety arbiter: it receives fault signals from MTU (memory test failures), IOM (I/O pin integrity violations), peripheral watchdogs, and lockstep mismatch detectors. Based on configurable alarm priorities and masking, the SMU triggers defined safe states - such as core reset, bus isolation, or safe output assertion - within programmable time windows aligned to ASIL-D timing constraints.

Can the TC277T64F200NDCKXUMA2 support both CAN FD and FlexRay simultaneously in the same application?

Yes - the device integrates six ASCLIN channels (supporting CAN FD up to 5 Mbit/s) and two dedicated ERAY controllers. These operate independently with separate clock domains and DMA channels, enabling concurrent high-speed CAN FD communication (e.g., body domain) and time-triggered FlexRay (e.g., powertrain domain) without resource contention or timing interference.

TC277T64F200NDCKXUMA2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
292-LFBGA
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, POR, WDT
Number of I/O:
169
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
472K x 8
Voltage - Supply (Vcc/Vdd):
1.17V ~ 5.5V
Data Converters:
A/D 60x12b SAR, Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC277T64F200NDCKXUMA2 FAQ

1.How can I place an order for TC277T64F200NDCKXUMA2 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC277T64F200NDCKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC277T64F200NDCKXUMA2 reliable?

The price and inventory of TC277T64F200NDCKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC277T64F200NDCKXUMA2 is usually 5 days.

3.What payment methods are accepted for TC277T64F200NDCKXUMA2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC277T64F200NDCKXUMA2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC277T64F200NDCKXUMA2?

TC277T64F200NDCKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC277T64F200NDCKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC277T64F200NDCKXUMA2?

For technical support, including TC277T64F200NDCKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC277T64F200NDCKXUMA2 requirements.

6.How does Aetrix verify that TC277T64F200NDCKXUMA2 is sourced from the original manufacturer or authorized distributors?

All TC277T64F200NDCKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC277T64F200NDCKXUMA2 meets industry standards.

7.What is the process for return or replacement of TC277T64F200NDCKXUMA2?

All TC277T64F200NDCKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC277T64F200NDCKXUMA2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC277T64F200NDCKXUMA2 part is unused and in its original packaging.

Return procedure for TC277T64F200NDCKXUMA2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC277T64F200NDCKXUMA2 Tags

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