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Infineon Technologies TC277T64F200SCAKXUMA1
- Part No.:
- TC277T64F200SCAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC277T64F200SCAKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:478
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Product details
Overview
TC277T64F200SCAKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores (two TC1.6P super-scalar and one TC1.6E scalar), 4 MB program flash, 384 KB data flash for EEPROM emulation, 200 MHz max clock frequency, and integrated Safety Management Unit (SMU) and Memory Test Unit (MTU). It targets automotive safety-critical applications including engine control, transmission control, and ADAS domain controllers.
For engineers reviewing the TC277T64F200SCAKXUMA1 datasheet, TC277T64F200SCAKXUMA1 pinout, TC277T64F200SCAKXUMA1 application, or TC277T64F200SCAKXUMA1 equivalent, key selection criteria include ASCLIN LIN support up to 50 MBaud, lockstep core configuration, ECC-protected memory architecture, and HSM availability in select variants.
Technical Context
The TC277T64F200SCAKXUMA1 implements a triple-core TriCore architecture with two high-performance TC1.6P cores (200 MHz, dual MAC/FPU, ICACHE/DCACHE) and one power-efficient TC1.6E core (200 MHz, binary-compatible, PSPR/DSPR). All cores operate within -40°C to 125°C ambient temperature range and support lockstep shadowing for ISO 26262 ASIL-D compliance.
Its on-chip memory subsystem includes 4 MB PFLASH with ECC, 384 KB DFLASH for EEPROM emulation, 32 KB LMU, and boot ROM. Peripheral integration includes four ASCLIN channels with hardware LIN v2.1/J2602 support, 64-channel DMA, and ERAY interface - all accessible via 64-bit SRI crossbar and 32-bit SPB interconnect.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | TriCore™ TC1.6P ×2 + TC1.6E ×1, all supporting lockstep operation for functional safety |
| Max Clock Frequency | 200 MHz across full industrial temperature range (−40 °C to +125 °C) |
| Flash Memory | 4 MB program flash (PFLASH) with ECC protection; 384 KB data flash (DFLASH) for EEPROM emulation |
| SRAM | 120 KB DSPR + 32 KB PSPR (TC1.6P); 112 KB DSPR + 24 KB PSPR (TC1.6E); 32 KB LMU |
| Peripheral Interface | 4× ASCLIN with hardware LIN v2.1/J2602 support up to 50 MBaud; ERAY controller; Ethernet MAC (MII/RMII) |
| Safety Features | SMU, MTU (MBIST/ECC initialization), IOM, and optional Hardware Security Module (HSM) |
| Package | BGA292 (15 mm × 15 mm, 0.8 mm pitch), RoHS-compliant, lead-free |
Pinout & Package
TC277T64F200SCAKXUMA1 is housed in a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad. Pin functions are defined per Infineon's TC277x BGA292 pin configuration (DS Section 2.2.1), supporting 5 V / 3.3 V switchable I/Os, LVDSH/LVDSM differential interfaces, and dedicated ERAY/ETH/ASCLIN signal groups.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and internal logic; requires low-noise regulation |
| VDDP_3V3 | I/O Power Supply | 3.3 V supply for general-purpose I/O banks; supports 5 V tolerant pins in switchable mode |
| ERAY_TXD0 / ERAY_RXD0 | Ethernet Ring Communication | Dedicated differential pair for E-Ray time-triggered network communication (ASIL-D capable) |
| ETH_MDIO / ETH_MDC | PHY Management Interface | IEEE 802.3-compliant MDIO/MDC signals for external Ethernet PHY configuration |
| ASCLIN0_TX / ASCLIN0_RX | LIN Bus Transceiver Interface | Hardware-accelerated LIN v2.1 physical layer signaling at up to 50 MBaud |
| TRSTN / TCK / TMS / TDI / TDO | JTAG Debug Interface | Standard 5-pin JTAG port supporting boundary scan, flash programming, and real-time debugging |
Key Features
| Feature | Design Value |
|---|---|
| Triple TriCore CPU Architecture | Two TC1.6P (200 MHz, dual MAC/FPU) + one TC1.6E (200 MHz, code-compatible) enables parallel real-time task partitioning |
| ECC-Protected Memory Subsystem | Full ECC coverage on PFLASH, DFLASH, SRAM, caches, and register files ensures single-bit error correction and double-bit error detection |
| Hardware LIN Acceleration | Four ASCLIN modules with built-in LIN protocol handling (v1.3/v2.0/v2.1/J2602) reduce CPU load and guarantee timing-critical frame generation |
| Safety-Certified Peripherals | SMU monitors peripheral health; MTU performs runtime memory tests; IOM validates I/O integrity - all qualified for ISO 26262 ASIL-D |
| Time-Triggered Network Support | Integrated ERAY controller with deterministic latency (< 2 µs jitter) and fault-tolerant ring topology for distributed automotive control |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock detection in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions across lockstepped TC1.6P cores. Use Value: 200 MHz deterministic execution, ECC memory, and SMU enable certified compliance with ISO 26262 Part 6 requirements for powertrain control. |
Use Scenario: Clutch actuation, gear shift scheduling, and torque converter lock-up control in automatic transmissions. IC Role / Device Role / Timing Role: Central domain controller managing CAN FD communication with vehicle network and real-time PWM outputs to solenoids. Use Value: Four ASCLIN channels support LIN-based sensor feedback (e.g., position sensors), while ERAY provides synchronized actuator coordination across multi-module systems. |
| ADAS Domain Controller | Electric Power Steering (EPS) |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for lane-keeping and emergency braking decisions. IC Role / Device Role / Timing Role: High-bandwidth data aggregator using 64-channel DMA and 4 MB PFLASH for firmware updates over CAN FD or Ethernet. Use Value: 64-bit SRI crossbar enables concurrent access to PFLASH, DFLASH, and peripherals without bus contention during high-throughput sensor streaming. |
Use Scenario: Closed-loop motor control for assist torque generation with torque sensor feedback and fail-safe redundancy. IC Role / Device Role / Timing Role: Dual-lockstep TC1.6P core executes motor control algorithms while TC1.6E handles diagnostics and communication stacks. Use Value: Integrated HSCT (High-Speed Capture Timer) and PWM units deliver sub-microsecond timing resolution for field-oriented control (FOC) of brushless motors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC277T64F200WCKXUMA1 | Same die, but WCKXUMA1 suffix indicates wafer-level chip-scale package (WLCSP) - not BGA292; different thermal and mechanical characteristics | Targeted for space-constrained modules where BGA292 footprint is prohibitive; unsuitable for standard PCB reflow profiles | Select only when board layout constraints mandate WLCSP and thermal validation confirms performance under target ambient conditions |
| TC275T64F200NCKXUMA1 | Lower memory configuration: 2 MB PFLASH, 128 KB DFLASH, no HSM option; same BGA292 package and pinout | Cost-optimized for non-safety-critical body electronics (e.g., HVAC, lighting) where ASIL-B suffices and full 4 MB flash is unnecessary | Choose when application does not require ASIL-D certification, full DFLASH EEPROM emulation, or hardware security acceleration |
Compared with TC277T64F200SCAKXUMA1, the TC277T64F200WCKXUMA1 offers identical functionality in a different package incompatible with standard BGA assembly, while the TC275T64F200NCKXUMA1 reduces flash capacity and safety features - making it suitable only for lower-ASIL applications with relaxed memory and security requirements.
Availability
TC277T64F200SCAKXUMA1 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, ADAS domain controllers, and electric power steering systems requiring stable component supply, long-term lifecycle support, and automotive-grade qualification.
Supply support for TC277T64F200SCAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, headquartered in Munich.
This device belongs to the AURIX™ TC27x family - engineered specifically for ISO 26262-compliant automotive applications demanding ASIL-D functional safety, real-time determinism, and hardware-based security acceleration.
FAQ
What is the maximum operating temperature range for TC277T64F200SCAKXUMA1?
The TC277T64F200SCAKXUMA1 is rated for operation from −40 °C to +125 °C ambient temperature, validated per AEC-Q100 Grade 1 requirements. This range applies to all core functions, memory subsystems, and peripherals including ASCLIN, ERAY, and Ethernet interfaces, with full 200 MHz performance maintained across the entire span.
Does TC277T64F200SCAKXUMA1 include hardware cryptographic acceleration?
Yes - this variant includes an optional Hardware Security Module (HSM) supporting AES-128/256, SHA-256, RSA-2048, and ECDSA. The HSM operates independently of the main TriCore CPUs, enabling secure boot, key provisioning, and OTA update authentication without compromising real-time application performance.
How many LIN channels does TC277T64F200SCAKXUMA1 support?
The device integrates four ASCLIN modules, each configurable as a LIN transceiver interface supporting LIN specification versions 1.3, 2.0, 2.1, and J2602. Each channel delivers hardware-based frame generation, checksum calculation, and synchronization break detection - eliminating software overhead for LIN communication.
Is TC277T64F200SCAKXUMA1 pin-compatible with other TC27x devices?
Yes - it shares the BGA292 package and pinout with other TC277x variants (e.g., TC277T32F200, TC277T64F180), enabling hardware reuse across performance tiers. However, memory size, clock speed, and feature enablement (e.g., HSM presence) differ, requiring firmware and configuration adjustments despite mechanical compatibility.
TC277T64F200SCAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 60x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC277T64F200SCAKXUMA1 FAQ
1.How can I place an order for TC277T64F200SCAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC277T64F200SCAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC277T64F200SCAKXUMA1 reliable?
The price and inventory of TC277T64F200SCAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC277T64F200SCAKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC277T64F200SCAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC277T64F200SCAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC277T64F200SCAKXUMA1?
TC277T64F200SCAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC277T64F200SCAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC277T64F200SCAKXUMA1?
For technical support, including TC277T64F200SCAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC277T64F200SCAKXUMA1 requirements.
6.How does Aetrix verify that TC277T64F200SCAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC277T64F200SCAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC277T64F200SCAKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC277T64F200SCAKXUMA1?
All TC277T64F200SCAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC277T64F200SCAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC277T64F200SCAKXUMA1 part is unused and in its original packaging.
Return procedure for TC277T64F200SCAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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