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Infineon Technologies TC277T64F200SDCKXUMA1
- Part No.:
- TC277T64F200SDCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC277T64F200SDCKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
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Product details
Overview
TC277T64F200SDCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores (two TC1.6P super-scalar and one TC1.6E scalar), 4 MB program flash, 384 KB data flash, 200 MHz max clock frequency, and integrated Safety Management Unit (SMU) and Memory Test Unit (MTU). It targets automotive safety-critical applications including electric powertrain control and ADAS domain controllers.
For engineers reviewing the TC277T64F200SDCKXUMA1 datasheet, TC277T64F200SDCKXUMA1 pinout, TC277T64F200SDCKXUMA1 application, or TC277T64F200SDCKXUMA1 equivalent, key selection criteria include ASCLIN LIN support up to 50 MBaud, lockstep core redundancy, ECC-protected memory hierarchy, and BGA292 package compatibility with automotive-grade thermal and EMI requirements.
Technical Context
The TC277T64F200SDCKXUMA1 implements a dual-lockstep architecture: one TC1.6P core operates in lockstep with its shadow for functional safety, while the TC1.6E core supports low-power background tasks. Its SRI crossbar enables concurrent 64-bit data transfers between CPUs, DMA, and memories.
It integrates hardware safety mechanisms including SMU for alarm monitoring, MTU for memory initialization and MBIST, and IOM for real-time digital I/O integrity checking - all compliant with ISO 26262 ASIL-D requirements for automotive control systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Three TriCore™: two TC1.6P (200 MHz, 2×MAC/cycle, FPU) + one TC1.6E (200 MHz, code-compatible, low-power) |
| Flash Memory | 4 MB PFLASH + 384 KB DFLASH (EEPROM emulation); both ECC-protected for ASIL-D compliance |
| RAM | 120 KB DSPR + 32 KB PSPR (TC1.6P); 112 KB DSPR + 24 KB PSPR (TC1.6E); all SRAM ECC-protected |
| Clock System | Integrated PLL supporting 200 MHz core clock; backup clock source; 12 MHz internal oscillator |
| Peripheral Interface | 4× ASCLIN with hardware LIN v2.1/J2602 support up to 50 MBaud; ERAY, ETH, QSPI, MSC, I²C |
| Safety Features | SMU, MTU, IOM, lockstep shadow cores, ECC on all memories, safe DMA controller |
| Package | BGA292 (15 × 15 mm, 0.8 mm pitch), RoHS-compliant, automotive-grade (-40°C to 125°C) |
Pinout & Package
TC277T64F200SDCKXUMA1 uses a 292-pin BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad. Pin functions are defined per Infineon's TC277x BGA292 pin configuration (DS Section 2.2.1), including dedicated VDD, VSS, JTAG/DAP debug, ASCLIN, ERAY, ETH, QSPI, and safety monitor pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP1–VDDP12 | Core Power Supply | 12 independent 1.3 V domains for voltage domain isolation and fault containment |
| VSSP1–VSSP12 | Core Ground | Dedicated ground returns per power domain to minimize coupling and ensure signal integrity |
| TCK/TMS/TDO/TDI/nTRST | JTAG Debug Interface | IEEE 1149.1-compliant boundary scan and debug access; supports real-time trace via DAP |
| ERAY_TX0/ERAY_RX0 | FlexRay Channel 0 | Differential high-speed deterministic bus interface (10 Mbit/s) for safety-critical vehicle networks |
| ETH_MDC/ETH_MDIO | Ethernet Management | IEEE 802.3-compliant MDIO/MDC interface for PHY configuration and status monitoring |
Key Features
| Feature | Design Value |
|---|---|
| Dual-lockstep CPU redundancy | One TC1.6P core and its shadow operate synchronously with comparison logic to detect transient faults - required for ASIL-D path coverage |
| ECC-protected memory subsystem | All PFLASH, DFLASH, SRAM, cache, and register files include single-bit error correction and double-bit error detection |
| Hardware I/O Monitor (IOM) | Real-time scanning of GPIO states against expected patterns to detect stuck-at or short-circuit failures |
| Memory Test Unit (MTU) | On-chip MBIST engine enabling automated RAM/ROM self-tests during startup and runtime without software overhead |
| ASCLIN with LIN hardware acceleration | Dedicated LIN frame generation, checksum calculation, and auto-baud detection offloads CPU and ensures timing-critical compliance |
Applications
| Electric Powertrain Control | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive control in 400 V/800 V BEV platforms. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep core verification and cycle-accurate PWM timing. Use Value: Enables <1 µs interrupt latency and deterministic execution for field-oriented control (FOC), reducing torque ripple by ≥15% vs. non-lockstep MCUs. |
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for L2+ autonomous driving. IC Role / Device Role / Timing Role: Central domain MCU managing time-synchronized data ingestion via QSPI, ERAY, and Ethernet interfaces with hardware timestamping. Use Value: Supports ≤2 µs inter-peripheral synchronization jitter across 4+ sensor channels, meeting ISO 21448 SOTIF timing constraints. |
| Brake-by-Wire System | Vehicle Gateway Module |
|
Use Scenario: Redundant electro-hydraulic brake actuation with dual-channel pressure feedback and fail-operational logic. IC Role / Device Role / Timing Role: Safety-critical controller running dual independent ASIL-D software partitions on lockstepped TC1.6P cores with SMU-monitored watchdog chains. Use Value: Achieves <100 ms end-to-end fault detection and response time, satisfying FMEDA-derived ASIL-D diagnostic coverage targets. |
Use Scenario: High-bandwidth CAN FD/Ethernet gateway bridging body, chassis, and infotainment domains in zonal architectures. IC Role / Device Role / Timing Role: Protocol translation engine using hardware-accelerated ASCLIN (CAN FD) and ETH MAC with zero-copy DMA buffering. Use Value: Sustains 20+ Mbps aggregate throughput across 3 CAN FD channels and 100BASE-TX Ethernet with <50 µs packet latency variance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC275T64F200NACXUMA1 | Same core architecture but 2 MB PFLASH, no HSM, BGA292 pin-compatible | Limited to ASIL-B/C applications lacking hardware security or full ASIL-D memory protection | Select when cost-sensitive designs omit secure boot or cryptographic acceleration needs |
| S32K344W0MLT1 | NXP S32K3 series: Arm Cortex-M7 + M33 lockstep, 4 MB flash, no TriCore ISA | Requires toolchain and software re-architecture; lacks native LIN hardware acceleration | Choose only if existing NXP ecosystem integration or AUTOSAR Classic/Adaptive stack alignment outweighs performance loss |
Compared with TC275T64F200NACXUMA1, this part adds HSM and full DFLASH ECC for secure over-the-air updates; versus S32K344W0MLT1, it delivers higher deterministic throughput for LIN/ERAY co-processing without software abstraction overhead.
Availability
TC277T64F200SDCKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS domain controllers, brake-by-wire systems, and vehicle gateway modules requiring stable component supply across automotive production lifecycles.
Supply support for TC277T64F200SDCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC27x family - engineered specifically for ISO 26262 ASIL-D automotive safety applications, emphasizing lockstep processing, memory safety, and deterministic real-time performance in powertrain and chassis systems.
FAQ
What is the maximum operating temperature range for TC277T64F200SDCKXUMA1?
The TC277T64F200SDCKXUMA1 is qualified for operation from −40 °C to +125 °C ambient temperature, validated per AEC-Q100 Grade 1 requirements. Its thermal design supports sustained 200 MHz core operation within this range using the specified PCB layout and copper pour guidelines in the hardware design manual.
Does TC277T64F200SDCKXUMA1 include hardware cryptographic acceleration?
Yes - this variant includes an optional Hardware Security Module (HSM) supporting AES-128/256, SHA-256, RSA-2048, and ECDSA-256. The HSM operates independently of the main TriCore cores and provides secure key storage, trusted boot, and OTA update authentication per EVITA Full standard.
How many ASCLIN channels support LIN protocol in hardware?
All four ASCLIN channels support LIN v2.1 and J2602 in hardware, including automatic baud rate detection, LIN header checksum generation, and response timeout handling. Each channel can operate simultaneously as master or slave, enabling multi-node LIN cluster management without CPU intervention.
Is external memory interface (EMIF) available on this package?
No - the TC277T64F200SDCKXUMA1 does not implement an external memory interface. All memory resources are integrated: 4 MB PFLASH, 384 KB DFLASH, and up to 288 KB on-chip SRAM. External expansion is supported only via QSPI (for serial NOR/NAND) and Ethernet (for remote storage).
TC277T64F200SDCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 60x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC277T64F200SDCKXUMA1 FAQ
1.How can I place an order for TC277T64F200SDCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC277T64F200SDCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC277T64F200SDCKXUMA1 reliable?
The price and inventory of TC277T64F200SDCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC277T64F200SDCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC277T64F200SDCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC277T64F200SDCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC277T64F200SDCKXUMA1?
TC277T64F200SDCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC277T64F200SDCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC277T64F200SDCKXUMA1?
For technical support, including TC277T64F200SDCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC277T64F200SDCKXUMA1 requirements.
6.How does Aetrix verify that TC277T64F200SDCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC277T64F200SDCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC277T64F200SDCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC277T64F200SDCKXUMA1?
All TC277T64F200SDCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC277T64F200SDCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC277T64F200SDCKXUMA1 part is unused and in its original packaging.
Return procedure for TC277T64F200SDCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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