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Infineon Technologies TC277T64F200SDCKXUMA2
- Part No.:
- TC277T64F200SDCKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC277T64F200SDCKXUMA2.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
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Product details
Overview
TC277T64F200SDCKXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores (two TC1.6P super-scalar and one TC1.6E scalar), 200 MHz max clock frequency, 4 MB embedded PFlash with ECC, 384 KB DFlash for EEPROM emulation, and integrated Safety Management Unit (SMU) and optional Hardware Security Module (HSM). It targets automotive safety-critical applications including electric powertrain control and ADAS domain controllers.
For engineers reviewing the TC277T64F200SDCKXUMA2 datasheet, TC277T64F200SDCKXUMA2 pinout, TC277T64F200SDCKXUMA2 application, or TC277T64F200SDCKXUMA2 equivalent, key selection criteria include ASCLIN/LIN support up to 50 MBaud, lockstep core configuration, ERAY/ETH interface availability, and functional safety compliance per ISO 26262 ASIL-D.
Technical Context
The TC277T64F200SDCKXUMA2 implements a heterogeneous multi-core architecture: dual high-performance TC1.6P cores operate in lockstep for safety-critical tasks, while the TC1.6E core handles background processing. All cores share a 64-bit SRI crossbar interconnect and access ECC-protected on-chip memories.
It integrates dedicated safety hardware including SMU, MTU (Memory Test Unit), IOM (I/O Monitor), and optional HSM for secure boot and cryptographic acceleration. Peripheral subsystems include four ASCLIN channels with LIN v2.1 support, ERAY controller, Ethernet MAC (MII/RMII), QSPI, and VADC/DSADC converters - all designed for deterministic real-time response in automotive ECUs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Three-core TriCore™: two TC1.6P (200 MHz, lockstep-capable) + one TC1.6E (200 MHz, binary-compatible) |
| Flash Memory | 4 MB PFlash (ECC-protected) + 384 KB DFlash (EEPROM emulation) |
| RAM | 120 KB DSPR + 32 KB PSPR + 16 KB ICACHE + 8 KB DCACHE + 32 KB LMU |
| Clock System | Internal PLL supporting 200 MHz core clock; backup clock source and MHz oscillator included |
| Safety Features | SMU, MTU, IOM, lockstep core monitoring, ECC on all SRAM/Flash, ASIL-D ready design |
| Communication Interfaces | 4× ASCLIN (LIN v2.1 up to 50 MBaud), ERAY, Ethernet (MII/RMII), QSPI, I²C, JTAG/DAP |
| Package | BGA292 (15 mm × 15 mm, 0.8 mm pitch, RoHS-compliant) |
Pinout & Package
TC277T64F200SDCKXUMA2 is housed in a 292-ball BGA package (15 mm × 15 mm, 0.8 mm ball pitch) with thermal pad. Pin functions are defined across multiple banks supporting I/O multiplexing, power domains (VDDP/VDDN/VDDA), and dedicated safety-related signals (e.g., SMU_ALARM, ESM_OUT).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0–VDDP_7 | Core Power Supply | Eight independent 1.3 V supply pins for CPU/peripheral domains; enable localized decoupling and fault isolation |
| VSSP_0–VSSP_7 | Core Ground | Dedicated ground returns paired with VDDP pins to minimize switching noise coupling into sensitive logic |
| ERAY_TXD / ERAY_RXD | ERAY Bus Interface | Differential transmit/receive pins for deterministic, fault-tolerant automotive network communication (up to 10 Mbit/s) |
| ETH_MDIO / ETH_MDC | Ethernet Management | Open-drain MDIO and push-pull MDC pins compliant with IEEE 802.3 for PHY register access and configuration |
| SMU_ALARM | Safety Monitor Output | Active-low open-drain signal indicating SMU-detected fault condition requiring system-level fail-safe response |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Core Pairing | Hardware-enforced dual-core lockstep (TC1.6P + shadow) enables real-time comparison and error detection for ASIL-D compliance |
| ECC Protection | End-to-end ECC on all embedded Flash and SRAM blocks ensures data integrity without software overhead |
| ASCLIN with LIN Support | Four hardware-accelerated ASCLIN modules support LIN v2.1 frame handling, checksum calculation, and auto-wake-up at 50 MBaud |
| Memory Test Unit (MTU) | On-chip MBIST and initialization engine performs automated memory self-test during startup and runtime diagnostics |
| Hardware Security Module (HSM) | Optional tamper-resistant co-processor supporting AES-128/256, SHA-256, RSA-2048, and secure boot key management |
Applications
| Electric Powertrain Control | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive sequencing in 48 V mild-hybrid systems. IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262 ASIL-D motor control algorithms with lockstep core verification. Use Value: Deterministic 200 MHz execution and ECC-protected 4 MB PFlash ensure reliable firmware updates and runtime fault containment. |
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for L2+ autonomous driving functions. IC Role / Device Role / Timing Role: Central compute node managing time-synchronized data ingestion via ERAY/Ethernet and ASCLIN-based sensor interfaces. Use Value: 64-channel DMA and SRI crossbar enable concurrent high-bandwidth transfers without CPU intervention. |
| Brake-by-Wire System | Vehicle Gateway ECU |
|
Use Scenario: Redundant actuator control and pressure monitoring in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Dual-lockstep TC1.6P cores execute fail-operational braking logic with SMU-triggered safe state transition. Use Value: Integrated IOM and MTU provide continuous I/O and memory health monitoring required for ASIL-D certification. |
Use Scenario: Secure protocol translation between CAN FD, LIN, and Ethernet domains in zonal architecture gateways. IC Role / Device Role / Timing Role: High-throughput bridge processor using QSPI for external flash expansion and HSM for secure OTA update validation. Use Value: Optional HSM enables AES-GCM decryption and ECDSA signature verification for authenticated firmware delivery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC275T64F200NACXUMA1 | Same core architecture but lacks HSM and has reduced DFlash (192 KB vs. 384 KB); BGA292 package identical | No hardware crypto acceleration; unsuitable for secure boot or OTA signing workflows | Select when cost-sensitive designs omit security requirements but retain ASIL-D timing and memory needs |
| S32K344UAT0VLQY | NXP S32K3 series with Arm Cortex-M7/M33 cores; supports ASIL-D but uses different safety architecture (no lockstep TriCore) | Requires adaptation of AUTOSAR BSW stack and toolchain; no native TriCore compiler or AURIX-specific peripherals | Choose for Arm ecosystem alignment or where existing NXP design infrastructure reduces integration effort |
Compared with TC275T64F200NACXUMA1, this part adds HSM and doubles DFlash for robust EEPROM emulation; versus S32K344UAT0VLQY, it delivers deterministic TriCore real-time performance and native AURIX safety IP without architectural porting effort.
Availability
TC277T64F200SDCKXUMA2 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS domain controllers, brake-by-wire systems, and vehicle gateway ECUs requiring stable component supply and long-term automotive lifecycle support.
Supply support for TC277T64F200SDCKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, headquartered in Munich.
This device belongs to the AURIX™ TC27x family - engineered specifically for ISO 26262-compliant automotive safety applications demanding high computational throughput, hardware redundancy, and integrated functional safety mechanisms.
FAQ
What is the maximum operating temperature range for TC277T64F200SDCKXUMA2?
The TC277T64F200SDCKXUMA2 is qualified for operation from −40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This rating applies across all core frequencies up to 200 MHz and includes full functionality of PFlash, DFlash, and peripheral units within the specified thermal envelope.
Does TC277T64F200SDCKXUMA2 support JTAG debugging in production mode?
Yes - JTAG interface remains accessible in production mode via dedicated TCK/TMS/TDI/TDO pins, supporting boundary-scan testing and debug access through DAP (Debug Access Port). However, HSM-secured devices may restrict full memory visibility unless debug authentication keys are provisioned during manufacturing.
How is the 4 MB PFlash organized for wear leveling in EEPROM emulation?
The 384 KB DFlash is architecturally optimized for EEPROM emulation using Infineon's Flash EEPROM Emulation Driver (FEED), which implements logical sector abstraction, wear leveling across physical blocks, and atomic write/erase operations - all managed in firmware without external components.
Can TC277T64F200SDCKXUMA2 operate without an external crystal oscillator?
Yes - it includes an internal MHz-range RC oscillator usable for initial boot and low-accuracy timing. For precise clock generation (e.g., Ethernet or LIN baud rate accuracy), an external crystal (1–20 MHz) connected to OSCIN/OSCOUT pins is required; the internal PLL then synthesizes the 200 MHz core clock.
TC277T64F200SDCKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, POR, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.17V ~ 5.5V
- Data Converters:
- A/D 60x12b SAR, Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC277T64F200SDCKXUMA2 FAQ
1.How can I place an order for TC277T64F200SDCKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC277T64F200SDCKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC277T64F200SDCKXUMA2 reliable?
The price and inventory of TC277T64F200SDCKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC277T64F200SDCKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC277T64F200SDCKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC277T64F200SDCKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC277T64F200SDCKXUMA2?
TC277T64F200SDCKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC277T64F200SDCKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC277T64F200SDCKXUMA2?
For technical support, including TC277T64F200SDCKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC277T64F200SDCKXUMA2 requirements.
6.How does Aetrix verify that TC277T64F200SDCKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC277T64F200SDCKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC277T64F200SDCKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC277T64F200SDCKXUMA2?
All TC277T64F200SDCKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC277T64F200SDCKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC277T64F200SDCKXUMA2 part is unused and in its original packaging.
Return procedure for TC277T64F200SDCKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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