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Infineon Technologies TC277T64F200SDCLXUMA1
- Part No.:
- TC277T64F200SDCLXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC277T64F200SDCLXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,388
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Product details
Overview
TC277T64F200SDCLXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores (two TC1.6P super-scalar and one TC1.6E scalar), 200 MHz max clock frequency, 4 MB embedded PFlash with ECC, 384 KB DFlash for EEPROM emulation, and integrated Safety Management Unit (SMU) and Memory Test Unit (MTU). It targets automotive safety-critical applications including engine control, transmission control, and ADAS domain controllers.
For engineers reviewing the TC277T64F200SDCLXUMA1 datasheet, TC277T64F200SDCLXUMA1 pinout, TC277T64F200SDCLXUMA1 application, or TC277T64F200SDCLXUMA1 equivalent, key selection criteria include ASCLIN LIN support up to 50 MBaud, lockstep core configuration, ERAY and Ethernet interface availability, and ISO 26262 ASIL-D compliance readiness via HSM and SMU integration.
Technical Context
The TC277T64F200SDCLXUMA1 implements a triple-core TriCore architecture with two high-performance TC1.6P cores (200 MHz, dual MAC/FPU, ICACHE/DCACHE) and one power-optimized TC1.6E core (200 MHz, binary-compatible, PSPR/DSPR), all operating within -40°C to 125°C ambient. Core lockstep pairs enable fault detection for ASIL-D systems.
It integrates a 64-channel safety-capable DMA controller, SRI 64-bit crossbar interconnect, and peripheral buses (SPB/SFI) supporting concurrent access to ECC-protected memories (4 MB PFlash, 384 KB DFlash, 32 KB LMU), BootROM, and hardware security modules including optional HSM and IOM for I/O monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | TriCore™ v1.6: dual TC1.6P + single TC1.6E, all at up to 200 MHz across full temperature range |
| Embedded Flash | 4 MB PFlash (ECC-protected program memory) + 384 KB DFlash (EEPROM-emulation capable) |
| SRAM | 120 KB DSPR + 32 KB PSPR + 32 KB LMU + BootROM - all ECC-protected |
| Communication Interfaces | 4× ASCLIN (LIN v2.1/J2602 compliant, up to 50 MBaud), ERAY, Ethernet (MII/RMII), QSPI, I²C, JTAG/DAP |
| Safety Features | Lockstep CPU pairs, SMU, MTU (MBIST/ECC initialization), IOM, optional HSM for cryptographic offload |
| Package & Pin Count | BGA292 package with 292-ball grid array, 0.8 mm pitch, RoHS-compliant |
| Operating Temperature | -40°C to +125°C ambient, qualified per AEC-Q100 Grade 1 |
Pinout & Package
TC277T64F200SDCLXUMA1 is housed in a 292-ball BGA package (15 × 15 mm, 0.8 mm pitch) with thermal pad, optimized for automotive PCB layouts requiring high I/O density and thermal reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and L1 caches; requires low-noise regulation and local decoupling |
| VDDP_3V3 | I/O & Peripheral Power | 3.3 V supply for GPIOs, ASCLIN, QSPI, and most peripherals; supports 3.3 V logic levels |
| VRX / VTX | Ethernet PHY Interface | Differential MII/RMII signals for 10/100 Mbps Ethernet physical layer connection |
| ERAY_TX / ERAY_RX | FlexRay Communication | Dedicated differential transceiver pins for deterministic, fault-tolerant FlexRay bus (up to 10 Mbps) |
| ASCLIN0_TX / ASCLIN0_RX | LIN Bus Interface | Hardware-supported LIN v2.1 transceiver pins with automatic baud rate detection and checksum handling |
| TRSTN / TCK / TMS / TDI / TDO | JTAG Debug Interface | Standard 5-pin boundary-scan interface for flash programming, real-time debugging, and functional test |
Key Features
| Feature | Design Value |
|---|---|
| Triple TriCore CPU Architecture | Enables parallel real-time task partitioning: safety-critical functions on lockstepped TC1.6P pair, background tasks on TC1.6E core |
| ECC-Protected Memory Subsystem | Full coverage of PFlash, DFlash, SRAM, caches, and registers prevents silent data corruption in harsh environments |
| Hardware Safety Monitoring | SMU detects timing violations, memory errors, and peripheral faults; triggers safe state transitions per ISO 26262 requirements |
| Integrated LIN Controller (ASCLIN) | Offloads LIN protocol stack (v2.1/J2602) from CPU - reduces latency, eliminates software timing jitter in body electronics |
| ERAY & Ethernet Coexistence | Simultaneous FlexRay (deterministic control) and Ethernet (high-bandwidth diagnostics/data logging) support in single chip |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control under transient load conditions. IC Role / Device Role / Timing Role: Primary safety-certified controller executing ASIL-D algorithms with lockstep core validation and SMU-monitored execution flow. Use Value: Deterministic 200 MHz TriCore execution ensures sub-1 µs interrupt latency for spark/fuel actuation, while ECC memory prevents undetected corruption in long-life field deployments. |
Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque reduction during sensor faults. IC Role / Device Role / Timing Role: Dual-lockstep TC1.6P core handles torque path; TC1.6E manages CAN/LIN communication and diagnostics. Use Value: Integrated ASCLIN LIN interfaces reduce external component count for steering column sensors, and ERAY enables synchronized multi-axis control in steer-by-wire variants. |
| ADAS Domain Controller | Transmission Control Module (TCM) |
|
Use Scenario: Sensor fusion preprocessing (radar/camera inputs), path planning, and vehicle dynamics coordination across multiple ECUs. IC Role / Device Role / Timing Role: High-bandwidth SRI interconnect routes data between PFlash, DFlash, and DSPR while maintaining cache coherency across three cores. Use Value: 4 MB PFlash stores multiple firmware variants (e.g., regional calibration maps); Ethernet interface enables OTA update delivery without gateway dependency. |
Use Scenario: Gear shift scheduling, clutch pressure control, and adaptive learning of wear characteristics over vehicle lifetime. IC Role / Device Role / Timing Role: DFlash emulates EEPROM for non-volatile storage of learned parameters; MTU performs periodic memory self-tests during idle cycles. Use Value: 384 KB DFlash provides >100k write/erase cycles for adaptive transmission tuning, eliminating need for external serial EEPROM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC275T64F200NACXUMA1 | Same TriCore architecture and pinout, but lacks Ethernet MAC and uses smaller 2 MB PFlash / 256 KB DFlash | Suitable for cost-sensitive ASIL-B applications where Ethernet connectivity is unnecessary (e.g., basic body control) | Select when Ethernet and extended flash are not required; lower BOM cost and reduced thermal footprint |
| TC375LPD64F200NACXUMA1 | Newer AURIX™ TC3xx generation with higher 300 MHz core speed, 8 MB PFlash, and enhanced HSM (AES-256, SHA-3) | Required for next-gen zonal architectures needing higher compute throughput and stronger cybersecurity (e.g., central gateway) | Choose for new designs targeting ASIL-D + cybersecurity certification; not pin-compatible with TC277 |
Compared with TC275T64F200NACXUMA1, this part adds Ethernet and larger flash for domain controller scalability; versus TC375LPD64F200NACXUMA1, it offers mature qualification and lower system-level integration risk, though with less crypto capability and compute headroom.
Availability
TC277T64F200SDCLXUMA1 is available at Aetrix Electronics and suitable for automotive engine control, electric power steering, ADAS domain control, and transmission management requiring stable component supply across extended product lifecycles.
Supply support for TC277T64F200SDCLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC27x family - engineered specifically for ISO 26262-compliant automotive safety applications, emphasizing lockstep processing, memory safety, and deterministic real-time performance in powertrain and chassis systems.
FAQ
What is the maximum operating frequency and temperature range for TC277T64F200SDCLXUMA1?
The TC277T64F200SDCLXUMA1 operates at up to 200 MHz across the full industrial automotive temperature range of -40°C to +125°C ambient. This rating is validated per AEC-Q100 Grade 1 and applies to all three TriCore CPUs, memory subsystems, and integrated peripherals including ASCLIN, ERAY, and Ethernet interfaces.
Does TC277T64F200SDCLXUMA1 include hardware support for LIN communication?
Yes - it integrates four ASCLIN modules with dedicated hardware LIN protocol acceleration supporting LIN 2.1 and SAE J2602, including automatic sync-break detection, checksum calculation, and configurable baud rates up to 50 MBaud. No external LIN transceiver is needed for basic node functionality.
Is an external Ethernet PHY required when using the built-in Ethernet MAC?
Yes - the TC277T64F200SDCLXUMA1 contains only the Media Access Control (MAC) layer. An external 10/100 Mbps Ethernet PHY (e.g., LAN8720A or KSZ8081RNB) must be connected via MII or RMII interface; VRX/VTX pins provide the differential analog interface to that PHY.
How is functional safety implemented in this microcontroller?
Functional safety is implemented through hardware-enforced mechanisms: lockstep CPU core pairs with comparator monitoring, Safety Management Unit (SMU) for fault detection and reaction, Memory Test Unit (MTU) with ECC and MBIST, Hardware I/O Monitor (IOM), and optional Hardware Security Module (HSM). These meet ISO 26262 ASIL-D requirements when configured per Infineon's safety manual.
TC277T64F200SDCLXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 60x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC277T64F200SDCLXUMA1 FAQ
1.How can I place an order for TC277T64F200SDCLXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC277T64F200SDCLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC277T64F200SDCLXUMA1 reliable?
The price and inventory of TC277T64F200SDCLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC277T64F200SDCLXUMA1 is usually 5 days.
3.What payment methods are accepted for TC277T64F200SDCLXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC277T64F200SDCLXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC277T64F200SDCLXUMA1?
TC277T64F200SDCLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC277T64F200SDCLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC277T64F200SDCLXUMA1?
For technical support, including TC277T64F200SDCLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC277T64F200SDCLXUMA1 requirements.
6.How does Aetrix verify that TC277T64F200SDCLXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC277T64F200SDCLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC277T64F200SDCLXUMA1 meets industry standards.
7.What is the process for return or replacement of TC277T64F200SDCLXUMA1?
All TC277T64F200SDCLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC277T64F200SDCLXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC277T64F200SDCLXUMA1 part is unused and in its original packaging.
Return procedure for TC277T64F200SDCLXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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