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Infineon Technologies TC277TP64F200NDCKXUMA1
- Part No.:
- TC277TP64F200NDCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC277TP64F200NDCKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,940
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Product details
Overview
TC277TP64F200NDCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three lockstep-capable CPU cores (two TC1.6P @ 200 MHz + one TC1.6E @ 200 MHz), 4 MB embedded PFlash with ECC, 384 KB DFlash for EEPROM emulation, and integrated hardware safety mechanisms including SMU, MTU, and optional HSM. It targets ASIL-D automotive powertrain and chassis control systems requiring functional safety compliance.
For engineers reviewing the TC277TP64F200NDCKXUMA1 datasheet, TC277TP64F200NDCKXUMA1 pinout, TC277TP64F200NDCKXUMA1 application, or TC277TP64F200NDCKXUMA1 equivalent, key selection criteria include dual-core lockstep configuration, 200 MHz real-time execution, on-chip Ethernet (MII/RMII), E-Ray and ASCLIN LIN support, and ISO 26262 ASIL-D certification readiness.
Technical Context
The TC277TP64F200NDCKXUMA1 implements a deterministic, safety-critical architecture with two high-performance TriCore TC1.6P cores operating in lockstep with a third scalar TC1.6E core for background tasks. Its SRI crossbar enables concurrent 64-bit memory access across CPUs, DMA, and peripherals while maintaining ECC protection on all on-chip SRAM and Flash.
It integrates dedicated safety hardware including the Safety Management Unit (SMU) for fault detection, Memory Test Unit (MTU) for runtime memory testing, and Hardware I/O Monitor (IOM) for digital pin integrity verification - all aligned to ISO 26262 Part 5 requirements for ASIL-D decomposition.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Three TriCore CPUs: two TC1.6P (200 MHz, lockstep), one TC1.6E (200 MHz, scalar) |
| Embedded Memory | 4 MB PFlash (ECC-protected), 384 KB DFlash (EEPROM emulation), 32 KB LMU, BootROM |
| Real-Time Peripherals | 4× ASCLIN (LIN v2.1/J2602), 1× Ethernet MAC (MII/RMII), 1× E-Ray, 64-channel DMA |
| Safety Features | SMU, MTU, IOM, lockstep CPU pairs, ECC on all memories, BIST support |
| Package & Pin Count | BGA292 (15 × 15 mm, 0.8 mm pitch), 292 terminals |
| Operating Temperature | −40 °C to +125 °C (automotive grade, AEC-Q100 qualified) |
| Supply Voltages | 1.3 V core, 3.3 V I/O, 5 V tolerant pads for specific interfaces (e.g., MSC) |
Pinout & Package
TC277TP64F200NDCKXUMA1 uses a 292-terminal BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad. Pin functions are defined per BGA292 variant in Infineon's DB-Step datasheet Section 2.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1.3V | Core Power Supply | 1.3 V supply for CPU, cache, and logic blocks; requires low-noise regulation |
| VDDIO_3.3V | I/O Power Supply | 3.3 V supply for general-purpose I/O banks; supports 5 V-tolerant operation on select pins |
| ETH_TXD[3:0] | Ethernet Transmit Data | MII interface outputs driving external PHY; timing-critical, requires controlled impedance routing |
| ERAY_TxD / ERAY_RxD | E-Ray Serial Interface | Dedicated differential transceiver pins for deterministic automotive time-triggered networking |
| ASCLIN0_TX / ASCLIN0_RX | LIN Communication Channel | Hardware-accelerated LIN v2.1 transceiver pins supporting baud rates up to 20 kBd |
| TRST, TDI, TDO, TMS, TCK | JTAG Debug Interface | IEEE 1149.1-compliant boundary-scan and debug access; supports real-time trace via DAP |
Key Features
| Feature | Design Value |
|---|---|
| Triple TriCore Architecture | Enables ASIL-D decomposition: lockstep TC1.6P pair handles safety-critical tasks; TC1.6E runs non-safety firmware concurrently |
| On-Chip Ethernet (MII/RMII) | Eliminates external MAC/PHY for domain controller designs; supports time-sensitive networking prerequisites |
| E-Ray Interface | Provides deterministic, fault-tolerant communication for brake-by-wire and steer-by-wire systems with <1 µs jitter |
| Hardware Security Module (HSM) | Optional tamper-resistant crypto engine supporting AES-128/256, SHA-256, RSA-2048 for secure boot and OTA updates |
| Memory Built-in Self-Test (MBIST) | Automated runtime RAM/ROM testing without CPU intervention - required for ASIL-D diagnostic coverage |
Applications
| Electric Powertrain Control | Brake-by-Wire System |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate control in 800 V EV platforms. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep CPU validation. Use Value: 200 MHz deterministic execution ensures sub-10 µs current loop response; PFlash ECC prevents corruption of critical motor maps. |
Use Scenario: Redundant hydraulic pressure modulation in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Dual-lockstep TC1.6P cores monitor actuator feedback and trigger fail-safe transitions within 5 ms. Use Value: Integrated E-Ray and SMU enable synchronized multi-node braking commands with end-to-end fault coverage. |
| ADAS Domain Controller | Vehicle Gateway |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic data for L2+ autonomy. IC Role / Device Role / Timing Role: High-bandwidth SRI interconnect routes sensor data to TC1.6E for preprocessing while TC1.6P handles safety monitoring. Use Value: 4 MB PFlash stores multiple neural network models; Ethernet interface enables OTA model updates without gateway dependency. |
Use Scenario: Secure bridging between CAN FD, LIN, and Ethernet domains in zonal architecture. IC Role / Device Role / Timing Role: Acts as firewall and protocol translator with HSM-enforced message filtering and authentication. Use Value: Hardware-accelerated crypto and ASCLIN/LIN support reduce latency vs. software-based gateways by >40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC275TP64F200NDCXUMA1 | Same package and pinout, but 2.5 MB PFlash, no Ethernet MAC, no E-Ray | Targeted at ASIL-B steering column modules where Ethernet/E-Ray not required | Select when system-level bandwidth and deterministic networking are unnecessary |
| S32K344WAT0VLQY | NXP S32K3 series; Arm Cortex-R52 dual-core, 1 MB Flash, no integrated Ethernet PHY interface | Designed for body electronics; lacks AURIX-specific safety diagnostics like MTU and IOM | Choose only if Arm ecosystem toolchain compatibility outweighs AURIX's ASIL-D hardware safety depth |
Compared with TC277TP64F200NDCKXUMA1, TC275TP64F200NDCXUMA1 reduces cost and complexity for less demanding safety domains, while S32K344WAT0VLQY offers Arm-based development continuity at the expense of certified ASIL-D hardware safety features.
Availability
TC277TP64F200NDCKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, ADAS domain controllers, and vehicle gateway applications requiring stable component supply and long-term automotive lifecycle support.
Supply support for TC277TP64F200NDCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.
The AURIX™ TC27x product line was engineered specifically for ISO 26262 ASIL-D automotive applications, emphasizing hardware-based safety mechanisms, real-time determinism, and multi-core lockstep resilience in powertrain and chassis systems.
FAQ
What is the maximum operating frequency of each CPU core in TC277TP64F200NDCKXUMA1?
The TC277TP64F200NDCKXUMA1 features two TC1.6P cores and one TC1.6E core, all rated for 200 MHz operation across the full −40 °C to +125 °C temperature range. This frequency is guaranteed under specified voltage (1.3 V core) and thermal conditions, enabling deterministic real-time execution for ASIL-D safety tasks without dynamic frequency scaling.
Does TC277TP64F200NDCKXUMA1 include hardware support for Ethernet communication?
Yes - it integrates a full Ethernet MAC supporting both MII and RMII physical layer interfaces, compliant with IEEE 802.3. The MAC includes DMA channels, VLAN tagging, and time-stamping capabilities. External PHY is required, but the on-chip MAC eliminates need for discrete Ethernet controllers in domain controller designs.
How does the Safety Management Unit (SMU) function in this microcontroller?
The SMU monitors internal error signals from CPUs, memories, peripherals, and clocks, then triggers configurable responses such as interrupt generation, reset assertion, or safe state activation. It supports programmable error classification (warning/fatal), error injection for test, and integration with AUTOSAR OS error handling - fulfilling ASIL-D diagnostic coverage requirements per ISO 26262.
Is the TC277TP64F200NDCKXUMA1 pin-compatible with other TC27x variants?
No - TC277TP64F200NDCKXUMA1 uses the BGA292 package, while TC275 variants use LQFP176 and TC270 uses bare die. Even within BGA292, pin functions differ across TC277 sub-variants (e.g., Ethernet vs. non-Ethernet versions). Pin mapping must be verified against the specific DB-Step datasheet revision for each part number.
TC277TP64F200NDCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 60x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC277TP64F200NDCKXUMA1 FAQ
1.How can I place an order for TC277TP64F200NDCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC277TP64F200NDCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC277TP64F200NDCKXUMA1 reliable?
The price and inventory of TC277TP64F200NDCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC277TP64F200NDCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC277TP64F200NDCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC277TP64F200NDCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC277TP64F200NDCKXUMA1?
TC277TP64F200NDCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC277TP64F200NDCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC277TP64F200NDCKXUMA1?
For technical support, including TC277TP64F200NDCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC277TP64F200NDCKXUMA1 requirements.
6.How does Aetrix verify that TC277TP64F200NDCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC277TP64F200NDCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC277TP64F200NDCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC277TP64F200NDCKXUMA1?
All TC277TP64F200NDCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC277TP64F200NDCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC277TP64F200NDCKXUMA1 part is unused and in its original packaging.
Return procedure for TC277TP64F200NDCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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