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Home > Products > Integrated Circuits (ICs) > Embedded > Microcontrollers

Infineon Technologies TC277TP64F200NDCKXUMA3

Name: TC277TP64F200NDCKXUMA3
Brand: Infineon Technologies
SKU: TC277TP64F200NDCKXUMA3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TC277TP64F200NDCKXUMA3

Manufacturer:: Infineon Technologies

Category:: Microcontrollers

Package:: 292-LFBGA

Datasheet:: TC277TP64F200NDCKXUMA3.pdf

Description:: IC MCU 32BIT 4MB FLASH 292LFBGA

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Product details

Overview

TC277TP64F200NDCKXUMA3 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three lockstep-capable CPU cores (two TC1.6P at up to 200 MHz and one TC1.6E), 4 MB embedded PFlash with ECC, 384 KB DFlash for EEPROM emulation, and integrated hardware safety mechanisms including SMU, MTU, and optional HSM. It targets ASIL-D automotive powertrain and chassis control systems requiring functional safety compliance.

For engineers reviewing the TC277TP64F200NDCKXUMA3 datasheet, TC277TP64F200NDCKXUMA3 pinout, TC277TP64F200NDCKXUMA3 application, or TC277TP64F200NDCKXUMA3 equivalent, key selection criteria include triple-core lockstep configuration, 200 MHz real-time execution, on-chip Flash ECC protection, integrated Ethernet (MII/RMII), and E-Ray high-speed deterministic communication support.

Technical Context

The TC277TP64F200NDCKXUMA3 implements a heterogeneous multi-core architecture: two high-performance TC1.6P cores handle time-critical control loops and signal processing, while the TC1.6E core manages background tasks and diagnostics - all synchronized via lockstep monitoring. Its SRI crossbar enables concurrent 64-bit memory access across CPUs, DMA, and peripherals without arbitration bottlenecks.

Functional safety is enforced at silicon level: SMU monitors clock, voltage, temperature, and core health; MTU performs on-the-fly memory initialization and MBIST; IOM validates digital I/O integrity. The device supports AUTOSAR-compliant boot flow via BROM and includes dedicated ASCLIN modules with hardware LIN protocol acceleration up to 50 MBaud.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Architecture	Three TriCore™ cores: dual TC1.6P (200 MHz, super-scalar, FPU, MAC) + TC1.6E (200 MHz, scalar, code-compatible)
Embedded Memory	4 MB PFlash (ECC-protected), 384 KB DFlash (EEPROM emulation), 32 KB LMU, BootROM, up to 120 KB DSPR + 32 KB PSPR per TC1.6P
Clock System	Integrated PLL supporting 200 MHz core clock; backup clock input; 12 MHz internal oscillator; configurable clock distribution with fail-safe monitoring
Safety Features	Lockstep CPU pairs, Safety Management Unit (SMU), Memory Test Unit (MTU), Hardware I/O Monitor (IOM), optional Hardware Security Module (HSM)
Communication Interfaces	Ethernet (MII/RMII), E-Ray (2x channels), 4× ASCLIN (LIN v2.1/J2602), QSPI, MSC, I²C, JTAG/DAP debug
Package & Pin Count	BGA292 package with 292 terminals; 1.0 mm pitch; RoHS-compliant; thermal pad exposed on underside
Operating Range	−40 °C to +125 °C ambient; 3.3 V ±5% supply; qualified per AEC-Q100 Grade 1

Pinout & Package

BGA292 package (15 × 15 mm, 1.0 mm pitch) with thermal pad; pinout defined in TC277x BGA292 Package Variant Pin Configuration (Datasheet Section 2.2.1, p.66). Terminal functions include dedicated E-Ray differential pairs, Ethernet MII/RMII signals, ASCLIN/LIN transceivers, and safety-redundant reset/watchdog inputs.

Pin/Terminal	Circuit Role	Design Meaning
VDDP_1P3	Core Power Supply	1.3 V ±5% supply for CPU cores and L1 caches; requires low-noise regulation and local decoupling
VDDP_3V3	I/O Power Supply	3.3 V ±5% supply for general-purpose I/Os, ASCLIN, QSPI, and peripheral interfaces
ERAY0_TXP/N	E-Ray Channel 0 Differential Output	High-speed deterministic serial bus output (up to 10 MBd); requires controlled-impedance PCB routing (100 Ω differential)
ETH_MDIO / ETH_MDC	IEEE 802.3 Management Interface	Open-drain MDIO and push-pull MDC for PHY register access; supports auto-negotiation and link status polling
ASCLIN0_TX / RX	LIN Protocol Transceiver Interface	Dedicated UART-like interface with hardware LIN break detection, sync field generation, and checksum calculation per LIN 2.1
TRSTN / TCK / TMS / TDI / TDO	JTAG Debug Interface	Standard 5-pin boundary-scan interface for flash programming, real-time debugging, and structural test

Key Features

Feature	Design Value
Triple-Core Lockstep Architecture	Enables ASIL-D decomposition: primary TC1.6P pair runs control algorithm while shadow TC1.6E verifies timing and result consistency
On-Chip Memory ECC Protection	Full ECC coverage for all PFlash, DFlash, SRAM, caches, and register files prevents silent data corruption in safety-critical runtime
Hardware LIN Acceleration	ASCLIN modules offload LIN frame assembly, checksum validation, and sleep/wake-up handling - reducing CPU load by >40% vs software-only implementation
Integrated Ethernet MAC	MII/RMII interface with DMA coherency and timestamping supports OTA updates, diagnostic logging, and gateway routing without external PHY dependency
Safety-Certified BootROM	BROM provides secure, immutable boot sequence with flash signature verification and safe firmware update rollback - certified for ISO 26262 ASIL-D

Applications

Engine Control Unit (ECU)

Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel engines.

IC Role / Device Role / Timing Role: Primary controller executing ASIL-D safety-critical engine management algorithms with lockstep core verification.

Use Value: 200 MHz dual-core execution ensures sub-10 µs interrupt latency for misfire detection and closed-loop torque control.

Use Scenario: Motor position sensing, torque assist calculation, and fault-tolerant steering angle validation in steer-by-wire systems.

IC Role / Device Role / Timing Role: Safety monitor and actuator driver coordinating EPS motor control with redundant sensor fusion and fail-operational response.

Use Value: Integrated E-Ray interface enables deterministic 10 MBd communication between steering ECU and column module with <1 µs jitter.

Brake Control Module (BCM)

Vehicle Gateway

Use Scenario: ABS/ESC hydraulic pressure modulation, wheel speed correlation, and brake-by-wire redundancy management.

IC Role / Device Role / Timing Role: Fault-tolerant controller managing CAN FD, E-Ray, and ASCLIN networks with hardware safety monitors active during braking events.

Use Value: SMU-triggered safe state activation within 50 µs upon voltage droop or clock deviation exceeding ±5%.

Use Scenario: Protocol translation between CAN FD (body domain), Ethernet (ADAS), and LIN (door/window modules) in zonal architectures.

IC Role / Device Role / Timing Role: High-bandwidth gateway processor with dual Ethernet MACs, 4x CAN FD controllers, and firewall-enabled HSM for secure OTA updates.

Use Value: 4 MB PFlash stores multiple firmware images (active/backup/rollback), enabling A/B partitioning for zero-downtime updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar tri-core automotive microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TC275TP64F200NDCXUMA1	2 MB PFlash, no Ethernet MAC, single E-Ray channel, BGA292 but reduced peripheral set	Suitable for mid-tier powertrain ECUs where Ethernet connectivity and dual E-Ray are not required	Select when cost-sensitive designs omit gateway functionality but retain ASIL-D core safety architecture
S32K344WAT0MLHT	ARM Cortex-R52 dual-core, 2 MB Flash, no E-Ray, includes HSE security engine, LQFP176 package	Targets chassis and battery management where ARM ecosystem tooling and CAN FD dominate over TriCore-specific AUTOSAR stacks	Prefer when leveraging NXP's S32DS toolchain and existing R52-based software investments over Infineon's DAVE™/AURIX™ ecosystem

Compared with TC277TP64F200NDCKXUMA3, TC275TP64F200NDCXUMA1 reduces memory and communication bandwidth for cost-constrained ECUs, while S32K344WAT0MLHT shifts to ARM-based development flow and omits E-Ray - making it suitable for non-deterministic chassis networks but unsuitable for time-triggered E-Ray domains.

Availability

TC277TP64F200NDCKXUMA3 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, brake control modules, and vehicle gateways requiring stable component supply across extended product lifecycles.

Supply support for TC277TP64F200NDCKXUMA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.

The AURIX™ TC27x product line was designed specifically for ASIL-D automotive safety applications - integrating lockstep cores, memory ECC, and hardware safety monitors into a single die for powertrain, chassis, and ADAS control units.

FAQ

What is the maximum operating frequency of the TC277TP64F200NDCKXUMA3 CPU cores?

The TC277TP64F200NDCKXUMA3 features two TC1.6P cores and one TC1.6E core, all rated for operation up to 200 MHz across the full industrial temperature range (−40 °C to +125 °C). This frequency is sustained under worst-case voltage (3.3 V ±5%) and thermal conditions, with PLL-based clock generation ensuring stability and jitter performance compliant with AURIX™ timing requirements.

Does TC277TP64F200NDCKXUMA3 support AUTOSAR-compliant boot and runtime environments?

Yes - the device includes a certified BootROM (BROM) that executes a secure, immutable boot sequence with flash image authentication, CRC checking, and safe firmware update rollback. It supports AUTOSAR OS 4.x via Infineon's SafeTcore and DAVE™ toolchain, with pre-certified MCAL drivers for CAN FD, E-Ray, Ethernet, and ASCLIN, all validated for ASIL-D compliance per ISO 26262.

How is functional safety implemented in hardware on this MCU?

Functional safety is implemented through multiple hardware blocks: Safety Management Unit (SMU) monitors clocks, voltages, temperatures, and core exceptions; Memory Test Unit (MTU) performs on-the-fly ECC initialization and MBIST; Hardware I/O Monitor (IOM) validates pin-level signal integrity; and lockstep CPU pairs provide real-time result comparison. All safety mechanisms are independently verified and documented in Infineon's ISO 26262 FMEDA report.

What package variant and thermal characteristics apply to TC277TP64F200NDCKXUMA3?

TC277TP64F200NDCKXUMA3 uses a BGA292 package (15 mm × 15 mm, 1.0 mm pitch) with an exposed thermal pad. Its junction-to-board thermal resistance (Ψ_JB) is 5.2 K/W, and junction-to-case (Ψ_JC) is 1.8 K/W. The device is qualified for AEC-Q100 Grade 1 (−40 °C to +125 °C) and supports reflow soldering per JEDEC J-STD-020D.3.

TC277TP64F200NDCKXUMA3 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Package/Case:: 292-LFBGA

Series:: AURIX™

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Core Processor:: TriCore™

Core Size:: 32-Bit Tri-Core

Speed:: 200MHz

Connectivity:: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT

Peripherals:: DMA, POR, WDT

Number of I/O:: 169

Program Memory Size:: 4MB (4M x 8)

Program Memory Type:: FLASH

EEPROM Size:: 64K x 8

RAM Size:: 472K x 8

Voltage - Supply (Vcc/Vdd):: 1.17V ~ 5.5V

Data Converters:: A/D 60x12b SAR, Sigma-Delta

Oscillator Type:: External

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

TC277TP64F200NDCKXUMA3 FAQ

1.How can I place an order for TC277TP64F200NDCKXUMA3 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC277TP64F200NDCKXUMA3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC277TP64F200NDCKXUMA3 reliable?

The price and inventory of TC277TP64F200NDCKXUMA3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC277TP64F200NDCKXUMA3 is usually 5 days.

3.What payment methods are accepted for TC277TP64F200NDCKXUMA3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC277TP64F200NDCKXUMA3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC277TP64F200NDCKXUMA3?

TC277TP64F200NDCKXUMA3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC277TP64F200NDCKXUMA3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC277TP64F200NDCKXUMA3?

For technical support, including TC277TP64F200NDCKXUMA3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC277TP64F200NDCKXUMA3 requirements.

6.How does Aetrix verify that TC277TP64F200NDCKXUMA3 is sourced from the original manufacturer or authorized distributors?

All TC277TP64F200NDCKXUMA3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC277TP64F200NDCKXUMA3 meets industry standards.

7.What is the process for return or replacement of TC277TP64F200NDCKXUMA3?

All TC277TP64F200NDCKXUMA3 units undergo pre-shipment inspection (PSI). If there is an issue with TC277TP64F200NDCKXUMA3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC277TP64F200NDCKXUMA3 part is unused and in its original packaging.

Return procedure for TC277TP64F200NDCKXUMA3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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