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Infineon Technologies TC277TP64F200NDCLXUMA1

Part No.:
TC277TP64F200NDCLXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
292-LFBGA
Datasheet:
AetrixTC277TP64F200NDCLXUMA1.pdf
Description:
IC MCU 32BIT 4MB FLASH 292LFBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,164

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Product details

Overview

TC277TP64F200NDCLXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores (two TC1.6P super-scalar and one TC1.6E scalar), 4 MB program flash, 384 KB data flash for EEPROM emulation, 200 MHz max clock frequency, and integrated hardware safety mechanisms including lockstep shadow cores, ECC-protected memories, and Safety Management Unit (SMU). It targets automotive powertrain and chassis control systems requiring ASIL-D compliance.

For engineers reviewing the TC277TP64F200NDCLXUMA1 datasheet, TC277TP64F200NDCLXUMA1 pinout, TC277TP64F200NDCLXUMA1 application, or TC277TP64F200NDCLXUMA1 equivalent, key selection criteria include triple-core real-time determinism, on-chip HSM support, ERAY/ETH/ASCLIN interface count, BGA292 package thermal performance, and functional safety certification evidence per ISO 26262.

Technical Context

The TC277TP64F200NDCLXUMA1 implements a heterogeneous multi-core architecture: two high-performance TC1.6P cores (200 MHz, dual MAC/FPU, 120 KB DSPR) operate in parallel with a power-efficient TC1.6E core (200 MHz, 112 KB DSPR), all sharing a 64-bit SRI crossbar interconnect and ECC-protected memory subsystem. Core lockstep pairs enable ASIL-D fault detection.

It integrates safety-critical peripherals including ERAY (flexible data-rate automotive bus), Ethernet MAC (10/100 Mbit/s RMII/MII), four ASCLIN channels with LIN 2.1/J2602 support, and a 64-channel DMA controller with safe transfer arbitration. The SMU monitors voltage, temperature, clock, and memory integrity via dedicated watchdogs and error injection paths.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Architecture Three-core TriCore™: dual TC1.6P (200 MHz, 2×MAC/cycle, FPU) + TC1.6E (200 MHz, code-compatible, lower power)
Memory 4 MB PFLASH (ECC), 384 KB DFLASH (EEPROM emulation), 32 KB LMU, BootROM - all ECC-protected
Real-Time Safety Lockstep shadow cores, SMU with 12+ safety monitors, MTU for memory BIST, IOM for I/O pin monitoring
Communication Interfaces ERAY (2 channels), Ethernet (MII/RMII), 4×ASCLIN (LIN v2.1/J2602), QSPI, MSC, I²C, JTAG/DAP
Package & Thermal BGA292 (15×15 mm, 0.8 mm pitch), rated for -40°C to 125°C ambient, 1.3 V core supply with integrated EVR
Functional Safety Designed to meet ISO 26262 ASIL-D requirements; includes HSM option for secure boot and cryptographic acceleration

Pinout & Package

TC277TP64F200NDCLXUMA1 uses a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad, optimized for automotive ECU thermal dissipation and signal integrity. Pin functions are defined per Infineon's TC277xBGA292 Package Variant Pin Configuration (DS Section 2.2.1).

Pin/Terminal Circuit Role Design Meaning
VDDP_1P3 Core Power Supply 1.3 V ±3% supply for CPU cores and L1 cache; requires low-noise decoupling near ball array
VDDP_3V3 I/O Power Supply 3.3 V supply for general-purpose I/O banks; supports 5 V-tolerant pins when configured as inputs
ERAY0_TX / ERAY0_RX ERAY Channel 0 Differential Pair High-speed automotive serial bus interface (up to 20 Mbit/s); requires controlled-impedance PCB routing
ETH_MDIO / ETH_MDC Ethernet Management Interface IEEE 802.3-compliant MDIO/MDC signals for PHY register access; operates at ≤2.5 MHz
ASCLIN0_TX / ASCLIN0_RX LIN/UART/SPI Serial Interface Configurable ASCLIN channel supporting LIN 2.1 frame timing and automatic checksum generation
TRSTN / TCK / TMS / TDI / TDO JTAG Debug Interface Standard 5-pin boundary-scan and debug access; supports real-time trace via DAP interface

Key Features

Feature Design Value
Heterogeneous Triple-Core Execution Dual high-performance TC1.6P cores handle time-critical control loops while TC1.6E manages background tasks-enabling deterministic ASIL-D software partitioning
On-Chip Safety Infrastructure SMU continuously validates clock stability, supply voltage, temperature, and memory ECC status; triggers safe state transition within ≤10 µs on fault detection
Secure Boot & Cryptography HSM option provides AES-128/256, SHA-256, RSA-2048 acceleration and immutable secure boot chain using PFLASH signature verification
Automotive Network Integration Dual ERAY controllers support time-triggered communication with <1 µs jitter; Ethernet MAC enables OTA update capability without external PHY dependency
Flash Flexibility 384 KB DFLASH supports wear-leveling and atomic write operations for robust EEPROM emulation-critical for calibration data storage in powertrain ECUs

Applications

Engine Control Unit (ECU) Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection, and knock control under transient load conditions.

IC Role / Device Role / Timing Role: Primary ASIL-D controller executing safety-critical engine management algorithms with sub-microsecond interrupt latency.

Use Value: Dual TC1.6P lockstep cores ensure fault detection during critical spark/fuel events; 4 MB PFLASH stores multiple calibration maps with ECC protection against bit flips.

Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque reduction during sensor faults.

IC Role / Device Role / Timing Role: Safety-certified host MCU managing motor control loop (≤100 µs cycle) and ASIL-B EPS communication stack.

Use Value: Integrated ERAY interface synchronizes with vehicle CAN/Ethernet backbone; SMU monitors ADC reference voltage drift to prevent erroneous torque commands.

Brake-by-Wire System Vehicle Domain Controller

Use Scenario: Redundant hydraulic pressure control with cross-core validation and emergency stop activation.

IC Role / Device Role / Timing Role: Dual-lockstep TC1.6P pair performs independent brake pressure calculations; TC1.6E handles diagnostics and gateway functions.

Use Value: Hardware IOM validates all brake actuator GPIO states in real time; DFLASH stores fault history with timestamped CRC for regulatory traceability.

Use Scenario: Centralized coordination of ADAS sensors, infotainment updates, and over-the-air (OTA) firmware deployment.

IC Role / Device Role / Timing Role: High-bandwidth domain master interfacing with camera radar via QSPI/ETH while isolating safety-critical domains.

Use Value: 64-channel DMA offloads sensor data movement from CPUs; HSM secures OTA image authentication and encrypted flash programming.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TC275TP64F200NACXUMA1 Same core architecture but 2 MB PFLASH, no HSM, LQFP176 package (lower I/O count, higher thermal resistance) Suitable for cost-sensitive ASIL-B chassis modules where cryptographic security and flash density are non-critical Select when BGA assembly is unavailable or board space permits larger footprint and thermal derating is acceptable
S32K344WAT0MLLQZ NXP S32K3 series: Arm Cortex-M7 + M33 dual-core, 4 MB flash, ASIL-D certified, but lacks native ERAY and TriCore real-time determinism Preferred for new designs targeting AUTOSAR Adaptive and Linux-based domain controllers needing Arm ecosystem tooling Choose if Arm software compatibility, AUTOSAR Adaptive support, or integrated PCIe/USB outweighs TriCore's deterministic latency advantage

Compared with TC277TP64F200NDCLXUMA1, the TC275 variant trades flash capacity and security for package flexibility and cost, while the S32K344 offers Arm toolchain alignment at the expense of native ERAY integration and TriCore's cycle-exact real-time predictability.

Availability

TC277TP64F200NDCLXUMA1 is available at Aetrix Electronics and suitable for automotive powertrain control, electric steering systems, brake-by-wire modules, and vehicle domain controllers requiring stable component supply across extended product lifecycles.

Supply support for TC277TP64F200NDCLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.

This device belongs to the AURIX™ TC27x family-designed specifically for ASIL-D automotive applications such as engine control, transmission, and advanced driver assistance systems (ADAS) requiring functional safety, real-time performance, and multi-bus connectivity.

FAQ

What is the maximum operating temperature range for TC277TP64F200NDCLXUMA1?

The TC277TP64F200NDCLXUMA1 is qualified for operation from −40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements. Its internal temperature sensor and SMU monitor die temperature in real time, triggering thermal shutdown if junction exceeds 150 °C. This rating applies to the full 200 MHz performance range without derating.

Does TC277TP64F200NDCLXUMA1 include hardware cryptographic acceleration?

Yes-when configured with the optional Hardware Security Module (HSM), it provides dedicated AES-128/256, SHA-256, and RSA-2048 acceleration, secure key storage in tamper-resistant memory, and hardware-enforced secure boot. The HSM operates independently of the main TriCore cores and is certified to Common Criteria EAL4+ for automotive use cases.

How does the ERAY interface differ from standard CAN in TC277TP64F200NDCLXUMA1?

The ERAY controller supports flexible data-rate communication up to 20 Mbit/s with deterministic, time-triggered scheduling-unlike event-triggered CAN. It includes built-in synchronization, slot-based arbitration, and error containment islands, enabling seamless integration into AUTOSAR-compliant time-triggered networks for steer-by-wire and brake-by-wire systems.

Is external RAM required for running AUTOSAR OS on TC277TP64F200NDCLXUMA1?

No-AUTOSAR OS can execute entirely from on-chip resources: the 120 KB DSPR per TC1.6P core and 112 KB DSPR on TC1.6E provide sufficient RAM for OS kernel, stacks, and ISRs. External RAM is optional only for large application buffers or non-safety partitions; all safety-critical AUTOSAR modules run in protected internal SRAM with ECC.

TC277TP64F200NDCLXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
292-LFBGA
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, WDT
Number of I/O:
169
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
472K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 60x12b, 6 x Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC277TP64F200NDCLXUMA1 FAQ

1.How can I place an order for TC277TP64F200NDCLXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC277TP64F200NDCLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC277TP64F200NDCLXUMA1 reliable?

The price and inventory of TC277TP64F200NDCLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC277TP64F200NDCLXUMA1 is usually 5 days.

3.What payment methods are accepted for TC277TP64F200NDCLXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC277TP64F200NDCLXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC277TP64F200NDCLXUMA1?

TC277TP64F200NDCLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC277TP64F200NDCLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC277TP64F200NDCLXUMA1?

For technical support, including TC277TP64F200NDCLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC277TP64F200NDCLXUMA1 requirements.

6.How does Aetrix verify that TC277TP64F200NDCLXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC277TP64F200NDCLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC277TP64F200NDCLXUMA1 meets industry standards.

7.What is the process for return or replacement of TC277TP64F200NDCLXUMA1?

All TC277TP64F200NDCLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC277TP64F200NDCLXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC277TP64F200NDCLXUMA1 part is unused and in its original packaging.

Return procedure for TC277TP64F200NDCLXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC277TP64F200NDCLXUMA1 Tags

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