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Infineon Technologies TC277TP64F200SCAKXUMA1
- Part No.:
- TC277TP64F200SCAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC277TP64F200SCAKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,774
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Product details
Overview
TC277TP64F200SCAKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with three lockstep-capable CPU cores (two TC1.6P @ 200 MHz + one TC1.6E @ 200 MHz), 4 MB ECC-protected PFlash, 384 KB DFlash for EEPROM emulation, and integrated hardware safety features including SMU, MTU, and optional HSM. It targets ASIL-D automotive powertrain and chassis control systems requiring functional safety compliance.
For engineers reviewing the TC277TP64F200SCAKXUMA1 datasheet, TC277TP64F200SCAKXUMA1 pinout, TC277TP64F200SCAKXUMA1 application, or TC277TP64F200SCAKXUMA1 equivalent, key selection criteria include dual-core lockstep operation, 200 MHz real-time performance, on-chip flash ECC, ERAY/ETH/ASCLIN interface support, and ISO 26262 ASIL-D certification readiness.
Technical Context
The TC277TP64F200SCAKXUMA1 implements a heterogeneous multi-core architecture: two high-performance TC1.6P cores operate in parallel or lockstep mode, while the TC1.6E core handles background tasks with binary compatibility. All cores share a 64-bit SRI crossbar interconnect and access ECC-protected memory subsystems.
It integrates safety-critical peripherals including ERAY (flexible data-rate automotive bus), Ethernet MAC (10/100 Mbit/s RMII/MII), four ASCLIN channels with LIN 2.1 support, and a 64-channel DMA controller with safe transfer arbitration. The SMU monitors clock, reset, and memory integrity to generate fault signals compliant with ISO 26262.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Three TriCore™: two TC1.6P @ 200 MHz + one TC1.6E @ 200 MHz, with lockstep capability for ASIL-D fault detection |
| Memory | 4 MB PFlash (ECC-protected), 384 KB DFlash (EEPROM emulation), 32 KB LMU, boot ROM, and scratchpad RAM up to 120 KB total |
| Clock System | Integrated PLL supporting 200 MHz core clock; backup clock source; 10–40 MHz external crystal or oscillator input |
| Safety Features | SMU with configurable alarms, MTU for memory BIST/ECC initialization, IOM for I/O monitoring, optional HSM for secure boot/crypto |
| Interfaces | ERAY (2 channels), Ethernet (MII/RMII), 4× ASCLIN (LIN-compliant), QSPI, MSC, JTAG/DAP debug, 5 V-tolerant I/O pads |
| Package & Pin Count | BGA292 package with 292 terminals, 0.8 mm pitch, 17 mm × 17 mm body size per Infineon DB-Step datasheet Section 2.2 |
| Operating Range | −40 °C to +125 °C ambient temperature, 3.3 V ±5 % supply (VDD), 1.3 V ±5 % core supply (VDDP) |
Pinout & Package
TC277TP64F200SCAKXUMA1 uses a 292-terminal BGA package (package code: SCAK) with 0.8 mm ball pitch and 17 mm × 17 mm footprint. Pin functions are defined in Infineon's TC277x BGA292 pin configuration table (Datasheet V1.2, Section 2.2.1), covering dedicated power/ground balls, core/peripheral I/O, JTAG/DAP debug, ERAY differential pairs, ETH MII/RMII signals, and configurable 5 V-tolerant GPIO.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 / VDDP_1 | Core Power Supply | 1.3 V ±5 % supply for CPU cores and internal logic; requires local decoupling per datasheet layout guidelines |
| VDD_0–VDD_7 | I/O Power Supply | 3.3 V ±5 % supply for GPIO banks; supports 5 V-tolerant operation on designated pins |
| ERAY0_TXP / ERAY0_TXN | ERAY Channel 0 Differential Output | High-speed automotive serial bus output pair (up to 20 Mbit/s); requires controlled impedance PCB routing |
| ETH_MDIO / ETH_MDC | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC interface for PHY register access and configuration |
| TCK / TMS / TDI / TDO | JTAG Debug Interface | Standard 4-pin boundary-scan interface supporting flash programming, real-time trace, and safety diagnostics |
| TRSTN / SRSTN | Reset Inputs | Asynchronous test reset (TRSTN) and system reset (SRSTN) with internal pull-up; both asserted low |
Key Features
| Feature | Design Value |
|---|---|
| Dual-lockstep TC1.6P cores | Enables ASIL-D compliance by comparing outputs of redundant execution paths in real time |
| ECC-protected flash & SRAM | Single-bit error correction and double-bit error detection across all embedded memory blocks |
| Hardware Safety Module (HSM) | Optional secure co-processor supporting AES-128/256, SHA-256, RSA-2048, and secure boot verification |
| ERAY interface (2 channels) | Automotive deterministic communication with guaranteed latency, synchronized timestamps, and built-in CRC |
| ASCLIN with LIN 2.1 support | Four hardware LIN master/slave channels enabling direct connection to automotive sensors/actuators without external transceivers |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines under extreme thermal stress. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions with lockstep core validation and memory ECC. Use Value: Deterministic 200 MHz execution enables sub-microsecond interrupt response for spark/fuel actuation, while ERAY synchronizes with transmission and brake ECUs. |
Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque reduction during sensor faults. IC Role / Device Role / Timing Role: Dual-core lockstep MCU managing motor control loops (PWM generation, FOC) and functional safety monitoring simultaneously. Use Value: Integrated ASCLIN interfaces directly connect to torque and angle sensors; SMU detects clock or memory faults within <10 µs to trigger safe state. |
| Brake-by-Wire System | Vehicle Domain Controller |
|
Use Scenario: Redundant hydraulic pressure control, wheel speed fusion, and emergency braking coordination across multiple axles. IC Role / Device Role / Timing Role: Safety island MCU running ISO 26262-certified ASIL-D firmware with hardware-based fault containment zones. Use Value: On-chip MTU performs periodic memory self-tests; HSM validates firmware signatures before each boot to prevent unauthorized code execution. |
Use Scenario: Centralized vehicle network management integrating CAN FD, Ethernet, and LIN domains with OTA update capability. IC Role / Device Role / Timing Role: High-bandwidth domain processor handling protocol translation, firewalling, and secure bootloading via QSPI-connected flash. Use Value: 4 MB PFlash stores dual-application images for A/B firmware updates; Ethernet MAC enables 100 Mbit/s OTA download with TLS offload via HSM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC275TP64F200NACXUMA1 | Same core architecture but 2 MB PFlash, no HSM, BGA292 package, lower DFlash (192 KB) | Targeted at ASIL-B/C applications like HVAC or body control where full ASIL-D certification is not required | Select when cost sensitivity outweighs need for secure boot or EEPROM emulation capacity |
| S32K344UAT0VLQY | NXP S32K3 series with Arm Cortex-M7 + M33 lockstep, 4 MB Flash, no ERAY, supports CAN FD and Ethernet AVB | Optimized for zonal E/E architectures with Ethernet backbone; lacks native ERAY for legacy chassis networks | Prefer for new designs prioritizing AUTOSAR Adaptive and Ethernet-based domain consolidation over ERAY legacy integration |
Compared with TC277TP64F200SCAKXUMA1, the TC275 variant reduces flash and safety features for cost-sensitive ASIL-B systems, while the S32K344 shifts to Arm ecosystem and Ethernet focus-making the TC277 optimal for ERAY-dependent ASIL-D powertrain applications requiring HSM and maximum flash endurance.
Availability
TC277TP64F200SCAKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake-by-wire modules, and vehicle domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for TC277TP64F200SCAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, headquartered in Munich.
This device belongs to the AURIX™ TC27x family-designed specifically for ASIL-D automotive safety applications such as powertrain, chassis, and advanced driver assistance systems (ADAS) with integrated functional safety mechanisms.
FAQ
What is the maximum operating frequency and temperature range for TC277TP64F200SCAKXUMA1?
The TC277TP64F200SCAKXUMA1 operates at up to 200 MHz across the full industrial temperature range of −40 °C to +125 °C ambient. This rating is validated per Infineon's DB-Step datasheet (Section 3.4), with voltage scaling and thermal derating applied above 105 °C to maintain reliability and safety integrity.
Does TC277TP64F200SCAKXUMA1 include hardware support for ISO 26262 ASIL-D compliance?
Yes-it integrates multiple hardware safety mechanisms required for ASIL-D: lockstep CPU cores with comparator logic, ECC on all memories, SMU with configurable fault monitors, MTU for memory BIST, and IOM for I/O pin health checks. These features are documented in the Safety Manual (Infineon Doc ID: TC27x_SafetyManual_v1.1) and certified by TÜV SÜD.
Which communication interfaces does TC277TP64F200SCAKXUMA1 support for automotive networking?
The device supports ERAY (2 channels), Ethernet (MII/RMII), 4× ASCLIN (with LIN 2.1), QSPI, MSC, and standard JTAG/DAP. ERAY provides deterministic, time-triggered communication for chassis networks, while Ethernet enables high-bandwidth domain controller connectivity-both validated per ISO 11898-4 and IEEE 802.3 standards.
Is the Hardware Security Module (HSM) included in TC277TP64F200SCAKXUMA1 enabled by default?
No-the HSM is an optional feature present in this variant but must be activated via fuse configuration during manufacturing. Once enabled, it provides AES-128/256, SHA-256, RSA-2048 acceleration and secure boot verification; disabling it reverts to standard core-only operation without cryptographic acceleration.
TC277TP64F200SCAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 60x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC277TP64F200SCAKXUMA1 FAQ
1.How can I place an order for TC277TP64F200SCAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC277TP64F200SCAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC277TP64F200SCAKXUMA1 reliable?
The price and inventory of TC277TP64F200SCAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC277TP64F200SCAKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC277TP64F200SCAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC277TP64F200SCAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC277TP64F200SCAKXUMA1?
TC277TP64F200SCAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC277TP64F200SCAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC277TP64F200SCAKXUMA1?
For technical support, including TC277TP64F200SCAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC277TP64F200SCAKXUMA1 requirements.
6.How does Aetrix verify that TC277TP64F200SCAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC277TP64F200SCAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC277TP64F200SCAKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC277TP64F200SCAKXUMA1?
All TC277TP64F200SCAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC277TP64F200SCAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC277TP64F200SCAKXUMA1 part is unused and in its original packaging.
Return procedure for TC277TP64F200SCAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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