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Infineon Technologies TC277TP64F200SDCKXUMA1
- Part No.:
- TC277TP64F200SDCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC277TP64F200SDCKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:990
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Product details
Overview
TC277TP64F200SDCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three CPU cores (two TC1.6P super-scalar and one TC1.6E scalar), 4 MB program flash, 384 KB data flash, 200 MHz max clock frequency, and integrated hardware safety mechanisms including lockstep execution, ECC-protected memories, and Safety Management Unit (SMU). It targets automotive powertrain and chassis control systems requiring ASIL-D compliance.
For engineers reviewing the TC277TP64F200SDCKXUMA1 datasheet, TC277TP64F200SDCKXUMA1 pinout, TC277TP64F200SDCKXUMA1 application, or TC277TP64F200SDCKXUMA1 equivalent, key selection considerations include dual-core lockstep configuration, 292-pin BGA package with LVDS-capable I/O, ERAY and Ethernet interface support, and HSM-enabled secure boot capability.
Technical Context
The TC277TP64F200SDCKXUMA1 implements a heterogeneous multi-core architecture: two high-performance TC1.6P cores operate up to 200 MHz with 120 KB DSPR and 32 KB PSPR each, while the TC1.6E core provides binary-compatible low-power execution at same frequency with 112 KB DSPR. All cores feature fully pipelined FPUs and MAC units sustaining 2 operations per cycle.
On-chip memory subsystem includes 4 MB PFLASH and 384 KB DFLASH with EEPROM emulation, all ECC-protected; 32 KB LMU for local memory management; and BootROM. Peripheral interconnect uses 64-bit SRI crossbar, 32-bit SPB, and SFI bridge, enabling deterministic latency for safety-critical real-time tasks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Three-core TriCore™: two TC1.6P (200 MHz, 120 KB DSPR) + one TC1.6E (200 MHz, 112 KB DSPR), all with lockstep shadowing |
| Flash Memory | 4 MB program flash (PFLASH) + 384 KB data flash (DFLASH) with EEPROM emulation, ECC-protected |
| Max Clock Frequency | 200 MHz across full industrial temperature range (−40°C to +125°C) |
| Package & Pins | BGA292 (15 × 15 mm, 0.8 mm pitch), supporting LVDSH/LVDSM I/O, ERAY, Ethernet MII/RMII, and ASCLIN interfaces |
| Safety Features | Lockstep CPU pairs, SMU, MTU (MBIST/ECC initialization), IOM (I/O monitoring), HSM option for secure boot and crypto acceleration |
| Peripheral Integration | 64-channel DMA, four ASCLIN with LIN v2.1/J2602, ERAY controller, 10/100 Ethernet MAC, QSPI, VADC/DSADC, MSC |
Pinout & Package
TC277TP64F200SDCKXUMA1 is housed in a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad, optimized for automotive ECU board layouts requiring high I/O density and thermal reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and L1 cache; requires low-noise regulation and decoupling per EVR spec |
| VDDP_3P3 | I/O & Peripheral Power | 3.3 V supply for GPIO, ASCLIN, QSPI, and peripheral domains; supports 5 V-tolerant pads via internal level shift |
| ERAY_TXD0 / ERAY_RXD0 | Ethernet Reliable Automotive Bus | Differential pair for ERAY communication; supports 10/20/50 Mbps with built-in CRC and frame filtering |
| ETH_MDIO / ETH_MDC | PHY Management Interface | IEEE 802.3-compliant MDIO/MDC for external PHY configuration and status polling |
| ASCLIN0_TX / ASCLIN0_RX | LIN/UART/SPI Serial Interface | Hardware-supported LIN v2.1 transceiver pins with automatic sync-break detection and checksum generation |
Key Features
| Feature | Design Value |
|---|---|
| Triple-Core Lockstep | TC1.6P+TC1.6P and TC1.6E+shadow enable ASIL-D fault containment for critical control loops |
| ECC-Protected Memory Subsystem | All SRAM, Flash, and caches include single-bit error correction and double-bit error detection (SECDED) |
| HSM Security Option | Optional Hardware Security Module supports AES-128/256, SHA-256, RSA-2048, and secure key storage for OTA updates |
| Real-Time Peripheral Interconnect | 64-bit SRI crossbar ensures zero-wait-state access between CPUs, DMA, and memories under full load |
| Automotive Network Integration | Native ERAY controller + Ethernet MAC + four ASCLIN channels eliminate need for external protocol bridges |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions on lockstepped TC1.6P cores. Use Value: Deterministic 200 MHz execution with ECC memory and SMU alarms enables <100 µs fault response time per ISO 26262. |
Use Scenario: Torque assist calculation, motor position feedback, and fail-safe torque reduction during steering actuation. IC Role / Device Role / Timing Role: Dual-core lockstep host for motor control algorithms with DSADC sampling at 2.5 MSPS and PWM generation at 20 kHz. Use Value: Integrated DSADC and HSCT timers deliver sub-microsecond current loop timing accuracy required for ISO 26262 ASIL-C EPS systems. |
| Brake-by-Wire System | Vehicle Domain Controller |
|
Use Scenario: Redundant hydraulic pressure modulation and wheel-speed-based ABS/EBD logic in electro-hydraulic brake modules. IC Role / Device Role / Timing Role: Safety monitor co-processor running independent ASIL-D diagnostics on TC1.6E core while TC1.6P handles primary control. Use Value: On-chip IOM validates digital I/O states in <5 µs, enabling rapid isolation of faulty sensor/actuator paths per ISO/PAS 21448 SOTIF. |
Use Scenario: Centralized vehicle network gateway aggregating CAN FD, LIN, Ethernet, and ERAY traffic for ADAS domain fusion. IC Role / Device Role / Timing Role: High-bandwidth interconnect hub using 100 Mbps Ethernet MAC and dual ERAY controllers for time-triggered communication. Use Value: 64-channel DMA with scatter-gather descriptors enables concurrent packet forwarding across 4+ networks without CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC275T64F200NACKXUMA1 | Same core architecture but 2 MB PFLASH, no HSM, LQFP176 package (not BGA) | Limited to ASIL-B systems; lacks Ethernet and ERAY interfaces | Select when cost-sensitive body control modules require footprint compatibility over safety scalability |
| TC375LP64F200NACKXUMA1 | Next-gen AURIX™ TC3xx with 300 MHz TC1.8P cores, 8 MB PFLASH, and enhanced HSM (AES-GCM) | Supports AUTOSAR Adaptive and zonal architecture; requires updated toolchain and PCB redesign | Select for new designs targeting ASIL-D + cybersecurity certification (UNECE R155/R156) |
Compared with TC275T64F200NACKXUMA1, this part adds Ethernet, ERAY, and HSM for higher integration in domain controllers; versus TC375LP64F200NACKXUMA1, it offers proven qualification for legacy powertrain platforms without migration overhead.
Availability
TC277TP64F200SDCKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake-by-wire modules, and vehicle domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for TC277TP64F200SDCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.
This device belongs to the AURIX™ TC27x family-designed specifically for ASIL-D automotive safety applications in powertrain, chassis, and advanced driver assistance systems (ADAS).
FAQ
What is the maximum operating temperature range for TC277TP64F200SDCKXUMA1?
The TC277TP64F200SDCKXUMA1 is qualified for operation from −40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements. Its internal thermal sensor and SMU-monitored junction temperature protection ensure safe operation under sustained 200 MHz CPU load in under-hood environments.
Does TC277TP64F200SDCKXUMA1 support JTAG debugging?
Yes, it supports IEEE 1149.1 JTAG boundary scan and debug via dedicated TCK/TMS/TDI/TDO pins, with additional DAP (Debug Access Port) support for SWD and SWO trace output. Debug authentication is enforced through HSM-secured debug lock bits when enabled.
How is functional safety compliance implemented in this MCU?
Functional safety is achieved through hardware-enforced redundancy: lockstep CPU pairs with compare-and-mask logic, ECC on all memories, SMU-driven alarm routing to reset or safe state, MTU for startup memory tests, and IOM for real-time I/O pin integrity checks-all aligned with ISO 26262 Part 5 ASIL-D requirements.
Can TC277TP64F200SDCKXUMA1 interface directly with an external Ethernet PHY?
Yes, it integrates a full IEEE 802.3-compliant 10/100 Mbps Ethernet MAC with MII and RMII interfaces. External PHY connection requires only ETH_TXD[3:0], ETH_RXD[3:0], ETH_TX_EN, ETH_CRS_DV, ETH_RX_ER, ETH_MDC, and ETH_MDIO signals-no external glue logic needed.
TC277TP64F200SDCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 60x12b, 6 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC277TP64F200SDCKXUMA1 FAQ
1.How can I place an order for TC277TP64F200SDCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC277TP64F200SDCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC277TP64F200SDCKXUMA1 reliable?
The price and inventory of TC277TP64F200SDCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC277TP64F200SDCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC277TP64F200SDCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC277TP64F200SDCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC277TP64F200SDCKXUMA1?
TC277TP64F200SDCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC277TP64F200SDCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC277TP64F200SDCKXUMA1?
For technical support, including TC277TP64F200SDCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC277TP64F200SDCKXUMA1 requirements.
6.How does Aetrix verify that TC277TP64F200SDCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC277TP64F200SDCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC277TP64F200SDCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC277TP64F200SDCKXUMA1?
All TC277TP64F200SDCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC277TP64F200SDCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC277TP64F200SDCKXUMA1 part is unused and in its original packaging.
Return procedure for TC277TP64F200SDCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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