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Infineon Technologies TC277TP64F200SDCKXUMA3
- Part No.:
- TC277TP64F200SDCKXUMA3
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC277TP64F200SDCKXUMA3.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,431
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Product details
Overview
TC277TP64F200SDCKXUMA3 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring three lockstep-capable CPU cores (two TC1.6P at up to 200 MHz and one TC1.6E), 4 MB embedded PFlash with ECC, 384 KB DFlash for EEPROM emulation, and integrated hardware security module (HSM) support. It delivers real-time deterministic control for automotive powertrain and chassis systems requiring ASIL-D compliance.
For engineers reviewing the TC277TP64F200SDCKXUMA3 datasheet, TC277TP64F200SDCKXUMA3 pinout, TC277TP64F200SDCKXUMA3 application, or TC277TP64F200SDCKXUMA3 equivalent, key selection criteria include dual-core lockstep configuration, 200 MHz operation across -40°C to 125°C, HSM-enabled secure boot, and BGA292 package with 212 I/O pins supporting LIN, Ethernet (MII/RMII), and E-Ray interfaces.
Technical Context
The TC277TP64F200SDCKXUMA3 implements a safety-critical tri-core architecture where two TC1.6P cores operate in lockstep for fault detection, while the TC1.6E core handles background tasks. All cores share a 64-bit SRI crossbar interconnect enabling concurrent memory and peripheral access without arbitration delay.
It integrates functional safety features including Safety Management Unit (SMU), Memory Test Unit (MTU) with ECC and MBIST, Hardware I/O Monitor (IOM), and configurable error correction on all on-chip memories. The device supports AUTOSAR-compliant MCAL drivers and ISO 26262 ASIL-D decomposition via hardware redundancy and diagnostic coverage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Three TriCore™ CPUs: two TC1.6P (200 MHz, super-scalar, FPU, MAC) + one TC1.6E (200 MHz, scalar, code-compatible) |
| Memory | 4 MB PFlash (ECC-protected), 384 KB DFlash (EEPROM emulation), 32 KB LMU, BootROM, up to 120 KB DSPR + 32 KB PSPR per TC1.6P core |
| Package & Pins | BGA292 (15 × 15 mm, 0.8 mm pitch), 212 user I/O pins with 5 V/3.3 V switchable, LVDSH/LVDSM, and JTAG/DAP debug interfaces |
| Safety Features | Lockstep CPU pairs, SMU, MTU (ECC/MBIST), IOM, HSM option, ASIL-D capable per ISO 26262 Part 5 |
| Peripherals | 4× ASCLIN (LIN v2.1/J2602), 1× Ethernet (MII/RMII), 1× E-Ray, 64-channel DMA, QSPI, VADC/DSADC, ERAY_PLL, PLL with spread spectrum |
| Operating Range | -40°C to +125°C ambient, 1.3 V core / 3.3 V I/O supply, qualified per AEC-Q100 Grade 1 |
Pinout & Package
TC277TP64F200SDCKXUMA3 is housed in a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad, optimized for automotive PCB layout and thermal dissipation under high-reliability conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V ±3% supply for CPU cores and internal logic; requires low-noise decoupling near ball array |
| VDDP_3P3 | I/O Power Supply | 3.3 V ±5% supply for digital I/O banks; supports 5 V-tolerant mode on selected pins |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO bus for PHY register access; operates at ≤10 MHz with open-drain pull-up |
| ERAY_TXD0 / ERAY_RXD0 | E-Ray High-Speed Serial Interface | Differential pair for deterministic time-triggered communication; supports up to 10 Mbit/s with built-in CRC and synchronization |
| TCK / TMS / TDI / TDO | JTAG Debug Interface | IEEE 1149.1-compliant boundary scan and debug access; enables flash programming and real-time trace via DAP |
Key Features
| Feature | Design Value |
|---|---|
| Triple-core lockstep architecture | Enables ASIL-D decomposition: primary TC1.6P pair performs safety-critical tasks with continuous comparison; TC1.6E handles non-safety firmware updates and diagnostics |
| HSM-ready secure boot | Hardware Security Module interface supports AES-128/256, SHA-256, RSA-2048, and secure key storage - enables certified secure boot and OTA update authentication |
| On-chip memory ECC & MBIST | All SRAM and Flash include single-bit error correction and double-bit error detection; MTU executes automated memory self-tests during startup and runtime |
| Real-time Ethernet interface | MII/RMII PHY interface with timestamping and DMA coherency ensures sub-microsecond latency for time-sensitive ADAS sensor fusion and gateway routing |
| Functional safety peripherals | SMU monitors clock, reset, voltage, and temperature domains; IOM validates I/O pin states against expected patterns - both feed into safe state activation via RSTOUT |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines under transient load conditions. IC Role / Device Role / Timing Role: Primary ASIL-D controller executing AUTOSAR-compliant MCAL stack with dual-lockstep TC1.6P cores managing critical actuator outputs. Use Value: Sub-1 µs interrupt latency and deterministic execution enable precise spark advance and closed-loop torque control within ISO 26262 timing constraints. |
Use Scenario: Torque assist calculation, motor phase current regulation, and fail-safe torque reduction during steering column overload events. IC Role / Device Role / Timing Role: Safety-certified host MCU coordinating ASCLIN-based sensor feedback, PWM-driven 3-phase inverter control, and E-Ray communication with vehicle domain controller. Use Value: Integrated DSADC with 16-bit resolution and hardware oversampling enables <100 ns current sampling jitter for field-oriented motor control. |
| Brake-by-Wire System | Vehicle Gateway Module |
Use Scenario: Redundant hydraulic pressure modulation and brake pedal feel simulation in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Dual-lockstep TC1.6P cores execute independent brake pressure models; TC1.6E manages CAN FD diagnostics and HSM-secured firmware updates. Use Value: On-chip SMU triggers immediate safe state transition (e.g., valve de-energization) upon detection of clock drift >±2% or voltage drop below 1.25 V. |
Use Scenario: Protocol translation between CAN FD, LIN, Ethernet, and E-Ray networks in zonal architecture vehicles. IC Role / Device Role / Timing Role: High-bandwidth gateway MCU leveraging QSPI for external flash expansion, Ethernet MII for backbone connectivity, and ASCLIN for legacy LIN cluster bridging. Use Value: 64-channel DMA with scatter-gather capability enables zero-copy packet forwarding between network interfaces at line rate (100 Mbps). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC275T64F200NACXUMA1 | Same TriCore™ architecture but BGA196 package (12 × 12 mm); 2 MB PFlash, no HSM, reduced I/O count (144 pins) | Limited to ASIL-B applications (e.g., body control modules); lacks Ethernet and E-Ray interfaces | Select when cost, footprint, and safety requirements are lower - not suitable for powertrain or gateway use cases. |
| S32K344WAT0VLQY | NXP S32K3 series ARM Cortex-M7/M7 dual-core; 4 MB Flash, 1.5 MB SRAM; includes HSE security engine and ASIL-D support | Different ISA (ARM vs TriCore); requires full software re-architecture; supports CAN FD, Ethernet, and PCIe but no E-Ray | Choose for new designs targeting ARM ecosystem tooling and long-term roadmap alignment - not a drop-in replacement. |
Compared with TC275T64F200NACXUMA1, this part adds Ethernet, E-Ray, and HSM for ASIL-D gateways; versus S32K344WAT0VLQY, it retains TriCore's deterministic real-time performance and native AUTOSAR MCAL compatibility without porting effort.
Availability
TC277TP64F200SDCKXUMA3 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, brake-by-wire systems, and vehicle gateway modules requiring stable component supply and long-term industrial lifecycle support.
Supply support for TC277TP64F200SDCKXUMA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing facilities.
This device belongs to the AURIX™ TC2xx family - engineered specifically for ISO 26262-compliant automotive safety applications including engine management, chassis control, and autonomous driving support systems.
FAQ
What is the maximum operating frequency and temperature range for TC277TP64F200SDCKXUMA3?
The TC277TP64F200SDCKXUMA3 operates at up to 200 MHz across the full industrial temperature range of -40°C to +125°C, validated per AEC-Q100 Grade 1 qualification. Core voltage is fixed at 1.3 V, and I/O banks support 3.3 V operation with 5 V tolerance on designated pins.
Does TC277TP64F200SDCKXUMA3 include hardware security features for secure boot?
Yes - the part supports optional Hardware Security Module (HSM) integration, enabling AES-128/256 encryption, SHA-256 hashing, RSA-2048 signature verification, and secure key storage. Secure boot leverages HSM-managed keys and immutable BootROM to validate signed firmware images before execution.
How many CAN FD interfaces does TC277TP64F200SDCKXUMA3 support?
The TC277TP64F200SDCKXUMA3 does not integrate native CAN FD controllers. It supports ASCLIN modules configured for LIN (v2.1/J2602) and offers Ethernet (MII/RMII) and E-Ray interfaces. CAN FD functionality requires external transceivers paired with ASCLIN or third-party bridge ICs.
Is TC277TP64F200SDCKXUMA3 pin-compatible with other TC27x variants?
No - TC277TP64F200SDCKXUMA3 uses the BGA292 package, while TC275 variants use LQFP176 or BGA196 packages. Pin mapping differs significantly across families due to increased I/O count, Ethernet signal routing, and E-Ray differential pairs; PCB redesign is required for migration.
TC277TP64F200SDCKXUMA3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 200MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, POR, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 472K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.17V ~ 5.5V
- Data Converters:
- A/D 60x12b SAR, Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC277TP64F200SDCKXUMA3 FAQ
1.How can I place an order for TC277TP64F200SDCKXUMA3 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC277TP64F200SDCKXUMA3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC277TP64F200SDCKXUMA3 reliable?
The price and inventory of TC277TP64F200SDCKXUMA3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC277TP64F200SDCKXUMA3 is usually 5 days.
3.What payment methods are accepted for TC277TP64F200SDCKXUMA3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC277TP64F200SDCKXUMA3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC277TP64F200SDCKXUMA3?
TC277TP64F200SDCKXUMA3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC277TP64F200SDCKXUMA3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC277TP64F200SDCKXUMA3?
For technical support, including TC277TP64F200SDCKXUMA3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC277TP64F200SDCKXUMA3 requirements.
6.How does Aetrix verify that TC277TP64F200SDCKXUMA3 is sourced from the original manufacturer or authorized distributors?
All TC277TP64F200SDCKXUMA3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC277TP64F200SDCKXUMA3 meets industry standards.
7.What is the process for return or replacement of TC277TP64F200SDCKXUMA3?
All TC277TP64F200SDCKXUMA3 units undergo pre-shipment inspection (PSI). If there is an issue with TC277TP64F200SDCKXUMA3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC277TP64F200SDCKXUMA3 part is unused and in its original packaging.
Return procedure for TC277TP64F200SDCKXUMA3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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