Infineon Technologies TC297TA128F300NBCKXUMA1

Overview

TC297TA128F300NBCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with dual 300 MHz TC1.6P CPU cores, lockstep shadow core for ASIL-D safety compliance, 8 MB program flash (ECC-protected), 768 KB data flash for EEPROM emulation, and integrated 128-channel DMA. It targets automotive powertrain and chassis control systems requiring functional safety up to ISO 26262 ASIL-D.

For engineers reviewing the TC297TA128F300NBCKXUMA1 datasheet, TC297TA128F300NBCKXUMA1 pinout, TC297TA128F300NBCKXUMA1 application, or TC297TA128F300NBCKXUMA1 equivalent, key selection criteria include dual-core lockstep timing integrity, ECC-protected memory hierarchy, ERAY/ETH/ASCLIN interface concurrency, and BGA292 package thermal performance in engine control units.

Technical Context

The TC297TA128F300NBCKXUMA1 implements a deterministic real-time architecture with two independent TriCore™ TC1.6P superscalar CPUs operating at up to 300 MHz across –40°C to 150°C ambient, each with dedicated 120 KB DSPR and 16 KB PSPR, plus shared SRI crossbar enabling concurrent access to PFLASH, DFLASH, and peripheral registers without arbitration delay.

It integrates safety-critical subsystems including lockstep monitoring of Core 1, ECC on all on-chip memories, hardware-based end-to-end CRC protection for DMA transfers, and redundant clock domains for ERAY, ETH, and system timers-enabling single-chip implementation of ASIL-D motor control and brake-by-wire applications per ISO 26262 Part 6.

Key Specifications

Pinout & Package

BGA292 package (15 mm × 15 mm, 0.8 mm ball pitch) with thermal pad exposed on underside for PCB-level heat dissipation in engine control modules. Pinout defined per section 2.3.1 of TC297x Data Sheet V1.1 (2019-03).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Compared with TC297TA128F300NBCKXUMA1, the NBCK variant offers superior thermal performance for under-hood deployment, while the NACX variant trades thermal capability for cost; the S32K344 lacks both ERAY and DSADC-making it unsuitable for powertrain applications requiring FlexRay or high-precision motor current sensing.

Availability

TC297TA128F300NBCKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, and brake-by-wire modules requiring stable component supply, long-term automotive lifecycle support, and ASIL-D certification traceability.

Supply support for TC297TA128F300NBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with R&D centers in Munich, Dresden, and Austin.

This part belongs to the AURIX™ TC29x family-designed specifically for ISO 26262 ASIL-D automotive powertrain and chassis control, emphasizing lockstep computation, memory safety, and real-time peripheral concurrency.

FAQ

What is the maximum junction temperature specification for TC297TA128F300NBCKXUMA1?

The device is qualified for continuous operation at a maximum junction temperature of +150°C, validated per AEC-Q100 Grade 0 stress testing. Thermal design must maintain Tj ≤ 150°C under worst-case ambient and power dissipation conditions, using the BGA292 package's 2.8°C/W θJA value with 4-layer PCB and 2 oz copper.

Does TC297TA128F300NBCKXUMA1 support JTAG debugging in production environments?

Yes-it supports IEEE 1149.1 JTAG boundary scan and debug via DAP (Debug Access Port) with secure authentication. Production units allow full visibility into CPU registers, memory, and peripheral states, but debug access can be permanently disabled via fuse programming to prevent unauthorized firmware extraction.

Can the 768 KB DFLASH be used for both EEPROM emulation and OTA update storage simultaneously?

Yes-the DFLASH is partitioned into independently erasable sectors. One region may host wear-leveled EEPROM emulation (via Infineon's DFlashLib), while another stores signed OTA firmware images. Both regions retain ECC protection and support atomic write operations to prevent corruption during power loss.

Is external clock source required for ERAY operation, or does the internal oscillator suffice?

The internal 40 MHz oscillator meets ERAY timing accuracy requirements for nominal operation, but an external crystal (±50 ppm) is mandatory for ASIL-D-compliant designs per ISO 26262 Annex D. The device supports automatic fallback to internal oscillator if external clock fails, triggering safety state transition.