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Infineon Technologies TC297TA128F300SBCKXUMA2
- Part No.:
- TC297TA128F300SBCKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC297TA128F300SBCKXUMA2.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,359
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Product details
Overview
TC297TA128F300SBCKXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with dual lockstep-capable TC1.6P CPU cores operating up to 300 MHz, 8 MB program flash (PFLASH), 768 KB data flash (DFLASH), and ECC-protected SRAM - designed for ASIL-D automotive safety-critical applications including electric powertrain control and brake-by-wire systems.
For engineers reviewing the TC297TA128F300SBCKXUMA2 datasheet, TC297TA128F300SBCKXUMA2 pinout, TC297TA128F300SBCKXUMA2 application, or TC297TA128F300SBCKXUMA2 equivalent, key selection criteria include dual-core lockstep execution integrity, integrated Ethernet (10/100 Mbit/s), E-Ray high-speed deterministic bus, and hardware safety mechanisms compliant with ISO 26262.
Technical Context
The TC297TA128F300SBCKXUMA2 implements a dual-core TriCore™ architecture with one master core and one lockstepped shadow core, both running at up to 300 MHz across −40 °C to 125 °C ambient. It integrates a 64-bit SRI crossbar interconnect enabling concurrent access to PFLASH, DFLASH, and multiple SRAM blocks with ECC protection on all memories.
It features dedicated safety peripherals including a Safety Management Unit (SMU), Memory Protection Units (MPUs), and hardware-based error correction for flash and RAM. The device supports E-Ray (up to 10 Mbit/s), Ethernet MAC with RMII/MII, and 128-channel DMA with channel linking and scatter-gather support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual TC1.6P TriCore™ cores, one master + one lockstepped shadow core, supporting ASIL-D decomposition per ISO 26262. |
| Max Clock Frequency | 300 MHz - enables real-time deterministic execution of complex motor control and safety monitoring algorithms. |
| Flash Memory | 8 MB PFLASH + 768 KB DFLASH - supports EEPROM emulation, secure boot, and dual-bank update without runtime interruption. |
| RAM | 32 KB LMU + DSPR/PSPR up to 120/240 KB - ECC-protected, partitioned for safety-critical task isolation. |
| Communication Interfaces | Ethernet (MII/RMII), E-Ray (10 Mbit/s), 12× CAN FD, 16× ASCLIN, QSPI, I²C - full redundancy support for chassis and powertrain networks. |
| Safety Features | SMU, lockstep CPU, memory ECC, MPU, safe DMA, and voltage/temperature monitoring - certified for ASIL-D system integration. |
| Package | BGA292 (15 × 15 mm, 0.8 mm pitch) - thermally optimized for automotive under-hood environments with 292 I/O terminals. |
Pinout & Package
BGA292 package (15 mm × 15 mm, 0.8 mm pitch) with 292 solder balls; thermal pad on underside for enhanced heat dissipation in automotive powertrain modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | 1.3 V Core Power Supply | Supplies CPU, cache, and logic domains; requires low-noise regulation and decoupling per Infineon layout guidelines. |
| VDDP_3V3 | 3.3 V I/O & Peripheral Power | Feeds GPIO, CAN transceivers, ASCLIN, and Ethernet PHY interface; supports 5 V-tolerant pads via internal level shifters. |
| ETH_RXD0–ETH_RXD3 | Ethernet Receive Data | MII-mode inputs synchronized to ETH_RX_CLK; require controlled impedance routing and <15 ps skew matching. |
| ERAY_TXD / ERAY_RXD | E-Ray High-Speed Bus Interface | Differential signaling pair for deterministic time-triggered communication; supports up to 10 Mbit/s with built-in CRC and frame filtering. |
| TRSTN | JTAG Test Reset Input | Active-low asynchronous reset for debug interface; used during boundary scan and flash programming sequences. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Lockstep CPU Execution | Hardware-enforced instruction-level comparison between master and shadow cores, triggering SMU fault response on mismatch. |
| ECC-Protected Memory Subsystem | Single-bit error correction and double-bit error detection on all PFLASH, DFLASH, and SRAM blocks - eliminates silent data corruption. |
| Integrated Safety Management Unit (SMU) | Configurable fault injection, watchdog supervision, and interrupt routing to dedicated safety channels - reduces external safety IC dependency. |
| E-Ray Communication Controller | Time-triggered, fault-tolerant bus controller with hardware timestamping and guaranteed latency ≤ 2 µs - meets AUTOSAR FlexRay replacement requirements. |
| Hardware Cryptographic Accelerator | Supports AES-128/256, SHA-256, and RSA-2048 acceleration with key storage in protected memory - enables secure OTA updates and key provisioning. |
Applications
| Electric Powertrain Control | Brake-by-Wire Systems |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive control in 800 V EV platforms. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control loops with sub-1 µs jitter and dual-core lockstep validation. Use Value: Enables SIL3/ASIL-D compliance without external safety monitor, reducing BOM count and PCB area by 35% versus dual-MCU solutions. |
Use Scenario: Redundant hydraulic pressure modulation and fail-operational braking in autonomous vehicles. IC Role / Device Role / Timing Role: Central safety MCU managing ECU-level diagnostics, sensor fusion, and actuator command arbitration with <10 ms end-to-end latency. Use Value: Integrated E-Ray and Ethernet allow deterministic communication with wheel-end actuators and ADAS domain controllers - eliminating gateway bottlenecks. |
| ADAS Domain Controller | Chassis Stability Control |
|
Use Scenario: Sensor preprocessing and decision fusion for L2+ automated driving functions. IC Role / Device Role / Timing Role: High-bandwidth data aggregator for camera, radar, and ultrasonic inputs using QSPI and ASCLIN interfaces with DMA offload. Use Value: 128-channel DMA with scatter-gather and channel linking enables zero-copy sensor data movement - reducing CPU load by 42% versus polled I/O. |
Use Scenario: Integrated yaw rate, lateral acceleration, and wheel speed processing for ESC and DSC subsystems. IC Role / Device Role / Timing Role: Real-time safety supervisor coordinating ABS, TCS, and VDC functions with hardware time synchronization via GPT12 timers. Use Value: On-chip temperature sensor and voltage monitors feed SMU for dynamic derating - extending functional safety lifetime beyond 15 years in harsh environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297TA128F300SBCKXUMA1 | Same silicon, different mask revision (BC-Step vs. BB-Step); lacks updated E-Ray PLL jitter specs and minor flash ECC timing improvements. | Not qualified for new ASIL-D designs requiring latest safety certification evidence per ISO 26262:2018 Annex D. | Select only for legacy redesigns where qualification retesting is prohibited. |
| S32K344W0MLT1 | NXP S32K3 series with Arm Cortex-M7 + M33 lockstep; lower max frequency (240 MHz), no native E-Ray, Ethernet limited to 100BASE-T1. | Targeted at body electronics and gateway ECUs - lacks the deterministic bus bandwidth and safety peripheral depth for powertrain use. | Prefer when leveraging existing NXP toolchain and Arm ecosystem over TriCore-specific development. |
Compared with TC297TA128F300SBCKXUMA1, the BC-Step offers tighter E-Ray PLL jitter (±25 ps vs. ±50 ps) and extended flash endurance (100k cycles vs. 30k). Versus S32K344, it delivers higher real-time throughput, native E-Ray, and deeper hardware safety integration - critical for powertrain and chassis control.
Availability
TC297TA128F300SBCKXUMA2 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, ADAS domain controllers, and chassis stability control requiring stable component supply across automotive production lifecycles.
Supply support for TC297TA128F300SBCKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.
The AURIX™ TC29x product line was engineered specifically for ISO 26262 ASIL-D automotive safety applications - emphasizing hardware fault tolerance, memory integrity, and deterministic communication for powertrain, chassis, and ADAS systems.
FAQ
What is the maximum junction temperature rating for TC297TA128F300SBCKXUMA2?
The TC297TA128F300SBCKXUMA2 is rated for operation up to 150 °C junction temperature, validated across its full industrial temperature range (−40 °C to +125 °C ambient) with derated performance above 125 °C ambient. Thermal design must maintain θJA ≤ 22 °C/W using the exposed thermal pad and 6-layer PCB stack-up per Infineon's AN2018-07 layout guide.
Does TC297TA128F300SBCKXUMA2 support secure boot with cryptographic verification?
Yes - it implements hardware-accelerated secure boot using SHA-256 and RSA-2048 signature verification executed in ROM before user code execution. Public keys are stored in One-Time Programmable (OTP) memory, and the boot image must be signed with the corresponding private key. Boot failure triggers SMU-initiated safe state entry.
Can the Ethernet MAC operate in both MII and RMII modes simultaneously?
No - the Ethernet MAC supports either MII or RMII mode, selected at reset via the ETH_MODE pin configuration. MII uses 25 MHz reference clock and 16-bit data bus; RMII uses 50 MHz clock and 2-bit data bus. Mode switching requires full reset and cannot be done dynamically during operation.
How many independent CAN FD channels does TC297TA128F300SBCKXUMA2 integrate?
The TC297TA128F300SBCKXUMA2 integrates 12 independent CAN FD controllers (CAN0–CAN11), each with dedicated message RAM, transmit/receive buffers, and bit-rate switching capability up to 5 Mbit/s. All channels support ISO 11898-1:2015 and are accessible via the SRI bus with configurable priority arbitration.
TC297TA128F300SBCKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 768K x 8
- RAM Size:
- 2.7M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 94x12b SAR, Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC297TA128F300SBCKXUMA2 FAQ
1.How can I place an order for TC297TA128F300SBCKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC297TA128F300SBCKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC297TA128F300SBCKXUMA2 reliable?
The price and inventory of TC297TA128F300SBCKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC297TA128F300SBCKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC297TA128F300SBCKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC297TA128F300SBCKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC297TA128F300SBCKXUMA2?
TC297TA128F300SBCKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC297TA128F300SBCKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC297TA128F300SBCKXUMA2?
For technical support, including TC297TA128F300SBCKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC297TA128F300SBCKXUMA2 requirements.
6.How does Aetrix verify that TC297TA128F300SBCKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC297TA128F300SBCKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC297TA128F300SBCKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC297TA128F300SBCKXUMA2?
All TC297TA128F300SBCKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC297TA128F300SBCKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC297TA128F300SBCKXUMA2 part is unused and in its original packaging.
Return procedure for TC297TA128F300SBCKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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