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Infineon Technologies TC297TA64F300SBCKXUMA1
- Part No.:
- TC297TA64F300SBCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC297TA64F300SBCKXUMA1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,672
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Product details
Overview
TC297TA64F300SBCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P CPU cores, lockstep shadow core for ASIL-D safety compliance, 6 MB program flash (PFLASH), 768 KB data flash (DFLASH) with EEPROM emulation, and integrated Ethernet MAC (10/100 Mbit/s). It targets automotive powertrain and chassis control units requiring functional safety certification.
For engineers reviewing the TC297TA64F300SBCKXUMA1 datasheet, TC297TA64F300SBCKXUMA1 pinout, TC297TA64F300SBCKXUMA1 application, or TC297TA64F300SBCKXUMA1 equivalent, key selection criteria include dual-core lockstep timing integrity, ASCLIN/QSPI/Ethernet peripheral availability, BGA292 package thermal performance, and ECC-protected memory architecture for ISO 26262 ASIL-D systems.
Technical Context
The TC297TA64F300SBCKXUMA1 implements a safety-critical dual-core architecture where Core 0 operates in lockstep with its shadow core to detect transient faults, while Core 1 serves as an independent real-time processing unit. Its SRI crossbar enables concurrent access to PFLASH, DFLASH, and SRAM resources without arbitration delay.
It integrates dedicated safety mechanisms including ECC on all on-chip memories, parity-protected peripherals, and hardware-based end-to-end data path checking for DMA transfers. The ERAY controller supports deterministic time-triggered communication, and the Ethernet MAC includes MII/RMII interfaces with IEEE 1588 timestamping support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual 32-bit TriCore™ TC1.6P cores (300 MHz max), one lockstepped for ASIL-D fault detection |
| Memory | 6 MB ECC-protected PFLASH + 768 KB DFLASH (EEPROM emulation) + 32 KB LMU + BootROM |
| Peripheral Set | Ethernet MAC (MII/RMII), 4x ASCLIN, 2x QSPI, 2x ERAY, 128-channel DMA, VADC/DSADC converters |
| Safety Features | Full ECC on all memories, parity on peripherals, lockstep CPU monitoring, safe interrupt system |
| Package | BGA292 (15 × 15 mm, 0.8 mm pitch), RoHS-compliant, rated for -40°C to 125°C ambient |
| Power Supply | 1.3 V core, 3.3 V I/O, with integrated EVR regulators and external supply mode flexibility |
| Clock System | Internal 12 MHz oscillator + PLL supporting up to 300 MHz core clock; backup clock input available |
Pinout & Package
BGA292 package (15 mm × 15 mm, 0.8 mm ball pitch) with thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1.3V | Core Power Supply | 1.3 V supply for CPU, cache, and internal logic; requires low-noise regulation |
| VDDIO_3.3V | I/O Power Supply | 3.3 V supply for GPIO, ASCLIN, QSPI, and Ethernet PHY interface pins |
| ETH_MDIO / ETH_MDC | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC signals for PHY configuration and status monitoring |
| ERAY_TXD0 / ERAY_RXD0 | FlexRay Channel 0 Transceiver Interface | Differential signaling pair for deterministic time-triggered network communication |
| QSPI0_SCLK / QSPI0_IO0–3 | Quad SPI Flash Interface | High-speed serial interface supporting XIP (execute-in-place) from external flash memory |
| ASCLIN0_TX / ASCLIN0_RX | Asynchronous Serial Communication | UART-compatible interface with LIN physical layer support for diagnostics and sensor communication |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core Execution | Real-time fault detection via cycle-accurate comparison between primary and shadow CPU cores |
| ECC Memory Protection | Single-bit error correction and double-bit error detection across all embedded flash and SRAM |
| Time-Triggered Communication | ERAY controller with guaranteed latency and jitter < 100 ns for safety-critical actuator control loops |
| Hardware Security Module (HSM) | Integrated cryptographic accelerator supporting AES-128/256, SHA-256, and RSA-2048 for secure boot and OTA updates |
| Automotive Temperature Range | Qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C junction temperature) for engine control applications |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary safety-certified controller executing ASIL-D software partitions with lockstep core verification. Use Value: Enables deterministic sub-microsecond interrupt response and ECC-protected code execution critical for emission compliance and fail-safe shutdown. |
Use Scenario: Torque assist calculation, motor position feedback, and fault-tolerant steering angle validation. IC Role / Device Role / Timing Role: Dual-core coordination: Core 0 handles safety-monitored torque loop; Core 1 manages CAN/LIN communication and diagnostics. Use Value: Redundant sensor fusion and lockstep-executed motor control algorithms meet ISO 26262 ASIL-C/D requirements. |
| Brake-by-Wire System | Vehicle Domain Controller |
|
Use Scenario: Hydraulic pressure modulation, wheel speed integration, and brake force distribution with redundancy. IC Role / Device Role / Timing Role: Safety island processor managing brake actuation via ERAY and ASCLIN interfaces with hardware-enforced time partitioning. Use Value: Sub-10 µs jitter on PWM outputs ensures precise hydraulic valve control and eliminates single-point failure modes. |
Use Scenario: Centralized vehicle networking integrating CAN FD, Ethernet, and LIN for ADAS domain consolidation. IC Role / Device Role / Timing Role: High-bandwidth interconnect hub using Ethernet MAC and QSPI for firmware storage, with ASCLIN for legacy bus bridging. Use Value: 100 Mbps Ethernet throughput and dual QSPI channels enable OTA update delivery and sensor data aggregation without bandwidth bottleneck. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297TA64F300NACKXUMA1 | Same die, but BGA292 package with non-lead-free (SnPb) finish; not AEC-Q100 qualified | Restricted to non-automotive industrial prototypes or legacy repair programs | Select only if lead-free compliance is waived and qualification documentation is not required |
| TC375LPD1EVA1AKXUMA1 | Newer AURIX™ TC3xx generation with higher core frequency (330 MHz), larger LRAM, and enhanced HSM | Requires PCB redesign due to BGA320 package and updated peripheral register mapping | Choose for new designs needing extended lifecycle, higher compute density, or upgraded security features |
Compared with TC297TA64F300SBCKXUMA1, the TC297TA64F300NACKXUMA1 lacks automotive qualification and RoHS compliance, while the TC375LPD1EVA1AKXUMA1 delivers 10% higher CPU throughput and expanded safety memory but mandates hardware and software revalidation.
Availability
TC297TA64F300SBCKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering modules, and brake-by-wire systems requiring stable component supply and long-term automotive lifecycle support.
Supply support for TC297TA64F300SBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC29x family-designed specifically for ASIL-D automotive safety applications including powertrain, chassis, and advanced driver assistance systems (ADAS).
FAQ
What is the maximum operating junction temperature for TC297TA64F300SBCKXUMA1?
The device is qualified per AEC-Q100 Grade 1 with a maximum junction temperature of +125 °C. Thermal design must maintain TJ ≤ 125 °C under worst-case ambient and power dissipation conditions, verified using the ΨJT parameter (1.9 °C/W) from the datasheet's thermal characteristics table.
Does TC297TA64F300SBCKXUMA1 support JTAG debugging in production mode?
No-JTAG is disabled after secure boot when the HSM is enabled. Debug access requires either pre-boot debug enablement or use of the DAP (Debug Access Port) interface with authenticated debug credentials, as defined in the Infineon AURIX™ Security User Manual v1.4.
Can the Ethernet MAC operate in RMII mode with external PHY?
Yes-the ETH peripheral supports both MII and RMII physical layer interfaces. RMII operation requires connection to a compliant 50 MHz reference clock and uses dedicated ETH_REF_CLK, ETH_RXD[1:0], ETH_TXD[1:0], ETH_TX_EN, and ETH_CRS_DV pins per section 3.28.4 of the datasheet.
How is flash endurance specified for DFLASH used in EEPROM emulation?
DFLASH endurance is rated for 100,000 write/erase cycles per sector when operated within specification limits (TA = −40 °C to +125 °C, VDDIO = 3.135–3.465 V). Wear leveling must be implemented in firmware to distribute writes across sectors and achieve >10-year data retention at 125 °C.
TC297TA64F300SBCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 384K x 8
- RAM Size:
- 2.75M x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 84x12b, 10 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC297TA64F300SBCKXUMA1 FAQ
1.How can I place an order for TC297TA64F300SBCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC297TA64F300SBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC297TA64F300SBCKXUMA1 reliable?
The price and inventory of TC297TA64F300SBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC297TA64F300SBCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC297TA64F300SBCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC297TA64F300SBCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC297TA64F300SBCKXUMA1?
TC297TA64F300SBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC297TA64F300SBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC297TA64F300SBCKXUMA1?
For technical support, including TC297TA64F300SBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC297TA64F300SBCKXUMA1 requirements.
6.How does Aetrix verify that TC297TA64F300SBCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC297TA64F300SBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC297TA64F300SBCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC297TA64F300SBCKXUMA1?
All TC297TA64F300SBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC297TA64F300SBCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC297TA64F300SBCKXUMA1 part is unused and in its original packaging.
Return procedure for TC297TA64F300SBCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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