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Infineon Technologies TC297TB128F300SBBKXUMA1
- Part No.:
- TC297TB128F300SBBKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC297TB128F300SBBKXUMA1.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,839
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Product details
Overview
TC297TB128F300SBBKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P CPU cores, 8 MB program flash (PFLASH), 768 KB data flash (DFLASH) for EEPROM emulation, and ECC-protected SRAM/flash memory. It integrates a 128-channel safety DMA, lockstep shadow core for ASIL-D compliance, and supports automotive powertrain and chassis control applications.
For engineers reviewing the TC297TB128F300SBBKXUMA1 datasheet, TC297TB128F300SBBKXUMA1 pinout, TC297TB128F300SBBKXUMA1 application, or TC297TB128F300SBBKXUMA1 equivalent, key selection criteria include dual-core lockstep operation, 300 MHz real-time performance, integrated Ethernet (ETH), E-Ray, and ASCLIN interfaces, and functional safety certification per ISO 26262 up to ASIL-D.
Technical Context
The TC297TB128F300SBBKXUMA1 implements a dual-core TriCore™ architecture with one master and one lockstepped shadow core, both operating at up to 300 MHz across the full industrial temperature range (–40 °C to +125 °C). Its SRI crossbar interconnect enables concurrent access to PFLASH, DFLASH, and multiple SRAM blocks (DSPR, PSPR, LMU) with deterministic latency.
It integrates safety-critical peripherals including E-Ray (flexible time-triggered communication), Ethernet MAC (10/100 Mbit/s), ASCLIN (UART/SPI/LIN), and DSADC (16-bit delta-sigma ADC with 1 MSps sampling rate), all supported by ECC, parity, and end-to-end data protection mechanisms aligned with ISO 26262 requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 32-bit TriCore™ TC1.6P, one master + one lockstepped shadow core for ASIL-D fault containment |
| Max Clock Frequency | 300 MHz - sustains full real-time performance across –40 °C to +125 °C ambient temperature |
| Flash Memory | 8 MB PFLASH + 768 KB DFLASH - DFLASH supports wear-leveling and EEPROM emulation with ECC |
| RAM | 120 KB DSPR + 32 KB PSPR + 32 KB LMU - all SRAM blocks protected by ECC or parity |
| Safety Features | Lockstep CPU, ECC on all memories, safe DMA, memory protection units (MPUs), and error-correcting interrupt controller |
| Communication Interfaces | Ethernet (MII/RMII), E-Ray (2 channels), ASCLIN (12 channels), QSPI, I²C, USB 2.0 OTG, and SENT |
| Analog Peripherals | DSADC (2x 16-bit delta-sigma ADC, 1 MSps), VADC (2x 12-bit SAR ADC, 1.5 MSps), temperature sensor |
Pinout & Package
BGA292 package (15 × 15 mm, 0.8 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU, cache, and logic; requires low-noise regulation and local decoupling |
| VDDP_3V3 | I/O Power Supply | 3.3 V supply for general-purpose I/Os and peripheral interfaces; supports 5 V-tolerant pins via internal clamping |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO bus for PHY configuration; operates at ≤10 MHz with open-drain drive |
| ERAY_TX0 / ERAY_RX0 | E-Ray Channel 0 Transceiver | Differential time-triggered bus interface supporting up to 10 Mbit/s; includes built-in termination and fail-safe monitoring |
| ASCLIN0_TX / ASCLIN0_RX | Asynchronous Serial Communication | Configurable UART/SPI/LIN transceiver; supports LIN 2.2A and SAE J2602 with automatic sync detection |
| BOOT_MODE0 / BOOT_MODE1 | Boot Configuration | Strap pins sampled at reset to select boot source: internal flash, external SPI flash, or debug interface |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-D Ready Architecture | Dual lockstep TriCore™ cores with continuous comparison, ECC on all memories, and safe interrupt controller meet ISO 26262 Part 6 requirements |
| Integrated Ethernet MAC | 10/100 Mbit/s MII/RMII interface with DMA offload, VLAN tagging, and IEEE 1588 timestamping support for time-sensitive networking |
| E-Ray Communication Subsystem | Two independent E-Ray channels with configurable frame length, dynamic slot allocation, and hardware CRC generation for deterministic automotive networks |
| High-Resolution Analog Front-End | DSADC with 16-bit resolution, 1 MSps sampling, and oversampling ratio up to 128× for motor current sensing in traction inverters |
| Secure Boot & Flash Protection | Hardware-based secure boot from encrypted PFLASH; write-protection regions and read-out protection prevent unauthorized firmware access |
Applications
| Electric Powertrain Control | Brake-by-Wire Systems |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate driver control in 400 V/800 V EV traction systems. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with sub-1 µs loop timing via lockstep CPUs and DSADC feedback. Use Value: Enables precise field-oriented control (FOC) with <100 ns jitter on PWM outputs and synchronized current sampling across 3 phases. |
Use Scenario: Redundant actuator control and pressure modulation in electro-hydraulic brake (EHB) modules. IC Role / Device Role / Timing Role: Dual-core lockstep MCU managing E-Ray communication to brake calipers and monitoring hydraulic pressure sensors via DSADC. Use Value: Achieves <50 ms fail-operational response time with hardware-assisted safety state transitions and diagnostic coverage >99%. |
| ADAS Domain Controller | Chassis Stability Control |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for L2+ automated driving functions. IC Role / Device Role / Timing Role: High-bandwidth data concentrator using QSPI for radar preprocessing, Ethernet for camera streaming, and ASCLIN for LIN-connected sensors. Use Value: Supports simultaneous 100 Mbps Ethernet video transport and 10 Mbps E-Ray actuator coordination without CPU intervention via DMA routing. |
Use Scenario: Integrated vehicle dynamics controller coordinating ESC, ABS, and active suspension subsystems. IC Role / Device Role / Timing Role: Time-triggered scheduler executing 10 kHz stability algorithms across dual cores while maintaining E-Ray synchronization with wheel speed sensors. Use Value: Guarantees <200 µs worst-case interrupt latency for yaw rate correction loops under full ASIL-D diagnostic load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297TB128F300SBBKXUMA2 | Same die, different mask revision (BC-Step → BD-Step); adds minor errata fixes and improved thermal derating above 105 °C | Identical pinout and software compatibility; qualified for extended high-temp engine bay deployment | Select for new designs requiring latest silicon revision and enhanced thermal margin |
| S32K344WAT0VLQY | NXP S32K3 64-bit Arm Cortex-M7 dual-core; 320 MHz, 4 MB flash, no integrated Ethernet MAC or E-Ray | Lacks native E-Ray and Ethernet PHY interface; requires external PHY and gateway IC for domain controller use | Choose when Arm ecosystem tooling and AUTOSAR Classic support are prioritized over native time-triggered networking |
Compared with TC297TB128F300SBBKXUMA1, the MA2 variant offers incremental reliability improvements without architectural change, while the S32K344 requires external components to match integrated E-Ray/Ethernet functionality-impacting BOM cost, PCB area, and functional safety decomposition effort.
Availability
TC297TB128F300SBBKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, ADAS domain controllers, and chassis stability control requiring stable component supply and long-term automotive lifecycle support.
Supply support for TC297TB128F300SBBKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.
The AURIX™ TC29x product line is designed specifically for ASIL-D automotive safety applications-including powertrain, braking, steering, and ADAS-delivering deterministic real-time performance with integrated safety mechanisms and time-triggered communication.
FAQ
What is the maximum junction temperature rating for TC297TB128F300SBBKXUMA1?
The device is rated for operation up to 150 °C junction temperature, validated across the full industrial temperature range (–40 °C to +125 °C ambient) with derated performance above 105 °C. Thermal design must maintain θJA ≤ 28 °C/W using the recommended 10-layer PCB stackup with internal ground/power planes and thermal vias under the BGA292 package.
Does TC297TB128F300SBBKXUMA1 support AUTOSAR Classic and Adaptive platforms?
Yes-it provides full AUTOSAR Classic 4.3+ compliance with certified MCAL drivers for E-Ray, ETH, DSADC, and GPT, and supports Adaptive AUTOSAR via its POSIX-compliant SafeRTOS port and Ethernet/IP stack. The dual-core lockstep configuration satisfies ASIL-D requirements for both platforms' safety partitions.
How is flash memory protected against corruption during power loss or reset events?
All PFLASH and DFLASH blocks feature hardware ECC (SEC-DED), write-protection registers, and atomic sector erase/write operations. The Flash State Machine (FSM) enforces strict sequencing, and brown-out detection triggers immediate flash suspend to prevent partial writes-validated per ISO 26262 Annex D for Class 2 memory safety integrity.
Can TC297TB128F300SBBKXUMA1 operate in single-supply mode with only 3.3 V applied?
No-this variant requires separate 1.3 V core supply (VDDP_1P3) and 3.3 V I/O supply (VDDP_3V3). The internal voltage regulators are not enabled; external DC-DC converters must provide both rails. Single-supply operation is only supported on specific TC2xx derivatives with integrated regulators (e.g., TC27x with VDDP_5V input).
TC297TB128F300SBBKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 384K x 8
- RAM Size:
- 2.75M x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 60x12b, 10 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC297TB128F300SBBKXUMA1 FAQ
1.How can I place an order for TC297TB128F300SBBKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC297TB128F300SBBKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC297TB128F300SBBKXUMA1 reliable?
The price and inventory of TC297TB128F300SBBKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC297TB128F300SBBKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC297TB128F300SBBKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC297TB128F300SBBKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC297TB128F300SBBKXUMA1?
TC297TB128F300SBBKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC297TB128F300SBBKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC297TB128F300SBBKXUMA1?
For technical support, including TC297TB128F300SBBKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC297TB128F300SBBKXUMA1 requirements.
6.How does Aetrix verify that TC297TB128F300SBBKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC297TB128F300SBBKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC297TB128F300SBBKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC297TB128F300SBBKXUMA1?
All TC297TB128F300SBBKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC297TB128F300SBBKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC297TB128F300SBBKXUMA1 part is unused and in its original packaging.
Return procedure for TC297TB128F300SBBKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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