My Inquiry
My Account
Infineon Technologies TC297TP128F300NBCKXUMA1
- Part No.:
- TC297TP128F300NBCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC297TP128F300NBCKXUMA1.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,415
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC297TP128F300NBCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with dual 300 MHz TC1.6P CPU cores, 8 MB program flash (PFLASH), 768 KB data flash (DFLASH) for EEPROM emulation, and ECC-protected SRAM/flash memory. It integrates a 128-channel safety DMA, lockstep shadow core for ASIL-D compliance, and supports automotive powertrain and chassis control applications.
For engineers reviewing the TC297TP128F300NBCKXUMA1 datasheet, TC297TP128F300NBCKXUMA1 pinout, TC297TP128F300NBCKXUMA1 application, or TC297TP128F300NBCKXUMA1 equivalent, key selection criteria include dual-core lockstep operation, 300 MHz real-time performance, integrated Ethernet (ETH), E-Ray, and ASCLIN interfaces, and functional safety certification per ISO 26262 up to ASIL-D.
Technical Context
The TC297TP128F300NBCKXUMA1 implements a dual-core TriCore™ architecture with one master and one lockstepped shadow core, both operating at up to 300 MHz across -40°C to 125°C ambient. Its SRI crossbar interconnect enables concurrent access to PFLASH, DFLASH, and multiple SRAM blocks (DSPR, PSPR, LMU) with ECC protection on all memories.
It integrates dedicated safety peripherals including SafeTcore™ watchdogs, end-to-end CRC protection for DMA transfers, and hardware-assisted error correction for flash and RAM. Communication subsystems include dual E-Ray controllers (for deterministic automotive networking), 10/100 Mbps Ethernet MAC with MII/RMII, and 12x ASCLIN channels supporting LIN, UART, and SPI modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 32-bit TriCore™ TC1.6P, one master + one lockstepped shadow core for ASIL-D fault tolerance |
| Max Clock Frequency | 300 MHz across full industrial temperature range (-40°C to +125°C) |
| Flash Memory | 8 MB PFLASH with ECC, 768 KB DFLASH for EEPROM emulation with wear leveling support |
| RAM | 120 KB DSPR + 32 KB PSPR + 32 KB LMU + BootROM; all ECC-protected |
| Safety Features | SafeTcore™ watchdogs, lockstep core monitoring, ECC on all memories, safe DMA with CRC |
| Communication Interfaces | 2× E-Ray, 1× 10/100 Mbps Ethernet (MII/RMII), 12× ASCLIN, 2× QSPI, 2× I²C, 2× MSC |
| Package | BGA292 (15 × 15 mm, 0.8 mm pitch), RoHS-compliant, lead-free |
Pinout & Package
TC297TP128F300NBCKXUMA1 uses a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad. Pin functions are defined in Section 2.3.1 of the TC297x datasheet (V1.1, 2019-03), covering supply domains (VDDP, VDDC, VDDIO), clock inputs (OSC, EXTAL, XTAL), reset (nRST), debug (JTAG/DAP), and peripheral-specific balls for E-Ray, ETH, ASCLIN, and QSPI.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0–VDDP_7 | Core Power Supply | Eight independent 1.3 V supplies for CPU, cache, and logic domains; enable fine-grained power domain control |
| VDDC_0–VDDC_3 | Analog & Peripheral Power | Four 3.3 V supplies for ADC, DSADC, and high-speed I/O banks |
| nRST | Reset Input | Active-low asynchronous reset with internal pull-up; initiates cold start and safety state recovery |
| OSC / EXTAL / XTAL | Crystal Oscillator Interface | Supports 20–40 MHz external crystal or CMOS clock input for main system clock generation |
| TCK / TMS / TDI / TDO / nTRST | JTAG Debug Interface | IEEE 1149.1-compliant boundary scan and debug access; supports real-time trace via DAP |
| ERAY_TXD_A / ERAY_RXD_A | E-Ray Channel A Data | Differential transmit/receive pair for deterministic, fault-tolerant automotive network communication |
Key Features
| Feature | Design Value |
|---|---|
| Dual TriCore™ Lockstep Execution | Hardware-enforced instruction-level comparison between master and shadow cores; automatic fail-safe shutdown on mismatch |
| ECC-Protected Memory Subsystem | Single-bit error correction and double-bit error detection on all PFLASH, DFLASH, DSPR, PSPR, LMU, and BROM |
| Safe 128-Channel DMA | End-to-end CRC, address range checking, and channel isolation prevent memory corruption during safety-critical transfers |
| Integrated Ethernet MAC | 10/100 Mbps MII/RMII interface with IEEE 1588 timestamping support for time-sensitive networking in ADAS |
| Automotive Network Peripherals | Two E-Ray controllers (up to 20 Mbit/s), 12 ASCLIN channels configurable as LIN/UART/SPI, and dual QSPI for external flash expansion |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines under transient load conditions. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D software partitions with lockstep core verification and memory ECC. Use Value: Enables deterministic 300 MHz execution of complex control algorithms while meeting ISO 26262 ASIL-D requirements via hardware safety mechanisms. |
Use Scenario: Torque assist calculation, motor position feedback processing, and fail-operational torque limiting in steer-by-wire systems. IC Role / Device Role / Timing Role: Dual-core coordination with safe DMA transfer of sensor data (resolver, torque sensor) and actuator commands to gate drivers. Use Value: Achieves <100 µs control loop latency with hardware CRC-protected data paths and redundant E-Ray communication to steering column ECUs. |
| Brake Control Module (BCM) | Vehicle Domain Controller |
|
Use Scenario: ABS/EBD/ESC actuation sequencing, wheel speed signal conditioning, and hydraulic pressure modulation in x-by-wire braking systems. IC Role / Device Role / Timing Role: Safety-critical real-time executor with dedicated DSADC for analog sensor acquisition and HSCT for precise PWM generation. Use Value: Delivers sub-microsecond timer resolution and synchronized sampling across 8 DSADC channels for multi-sensor fusion without CPU intervention. |
Use Scenario: Centralized vehicle computing for OTA updates, cybersecurity management, and cross-domain coordination (powertrain + chassis + body). IC Role / Device Role / Timing Role: High-integrity host processor running AUTOSAR Adaptive and Classic stacks with secure boot and encrypted DFLASH storage. Use Value: Supports secure firmware updates via Ethernet and cryptographic acceleration using integrated TRNG and HASH engine. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297TP128F300NACXUMA1 | Same die, but packaged in BGA292 with different marking and no extended temperature screening (−40°C to 105°C vs. −40°C to 125°C) | Targeted at non-under-hood applications such as body control modules where ambient temperature is lower | Select when full 125°C operation is not required and cost optimization is prioritized |
| TC375LPDFTAKXUMA1 | TriCore™ TC1.8P core (up to 300 MHz), 4 MB PFLASH, 512 KB DFLASH, no E-Ray, adds HSM security module | Focused on secure gateway and infotainment domains requiring TLS/SSL offload rather than deterministic networking | Choose when hardware security module (HSM) and AUTOSAR SecOC support are mandatory over E-Ray determinism |
Compared with TC297TP128F300NBCKXUMA1, the TC297TP128F300NACXUMA1 trades junction temperature margin for cost, while the TC375LPDFTAKXUMA1 replaces E-Ray with HSM-making it suitable for secure gateways but unsuitable for time-triggered chassis networks.
Availability
TC297TP128F300NBCKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake control modules, and vehicle domain controllers requiring stable component supply across long automotive production lifecycles.
Supply support for TC297TP128F300NBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, headquartered in Munich.
This part belongs to the AURIX™ TC2xx family-designed specifically for ASIL-D automotive safety applications in powertrain, chassis, and advanced driver assistance systems (ADAS) with integrated functional safety hardware.
FAQ
What is the maximum junction temperature rating for TC297TP128F300NBCKXUMA1?
The device is rated for operation up to 150°C junction temperature, with guaranteed functionality across −40°C to +125°C ambient temperature when used with appropriate PCB thermal design and airflow. This rating aligns with AEC-Q100 Grade 0 qualification and supports under-hood deployment in modern ICE and hybrid powertrains.
Does TC297TP128F300NBCKXUMA1 support AUTOSAR Classic Platform?
Yes-it is fully compatible with AUTOSAR Classic R4.x and later, with certified MCAL drivers for E-Ray, ETH, ASCLIN, DIO, PORT, GPT, ICU, and ADC. Infineon provides validated configuration tools (DAVE™ and AURIX Development Studio) and integration packages for EB tresos and Vector DaVinci.
How is functional safety certification documented for this MCU?
TC297TP128F300NBCKXUMA1 is certified to ISO 26262:2018 ASIL-D at the hardware level (FMEDA report, safety manual, and diagnostic coverage analysis included in Infineon's Safety Support Package). The safety manual details FIT rates, diagnostic coverage, and safe failure fraction for each safety mechanism including lockstep, ECC, and watchdogs.
Can the on-chip DFLASH be used for secure key storage?
No-DFLASH is intended for EEPROM emulation (e.g., calibration data, NV counters) and lacks hardware encryption. For secure key storage, use the dedicated Hardware Security Module (HSM) found only in TC3xx devices, or implement SW-based key wrapping with keys derived from the on-chip TRNG and stored in protected PFLASH sectors with read-protection enabled.
TC297TP128F300NBCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 263
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 768K x 8
- RAM Size:
- 240K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.17V ~ 1.43V, 2.97V ~ 5.5V
- Data Converters:
- A/D 60x12b, 10 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC297TP128F300NBCKXUMA1 FAQ
1.How can I place an order for TC297TP128F300NBCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC297TP128F300NBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC297TP128F300NBCKXUMA1 reliable?
The price and inventory of TC297TP128F300NBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC297TP128F300NBCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC297TP128F300NBCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC297TP128F300NBCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC297TP128F300NBCKXUMA1?
TC297TP128F300NBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC297TP128F300NBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC297TP128F300NBCKXUMA1?
For technical support, including TC297TP128F300NBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC297TP128F300NBCKXUMA1 requirements.
6.How does Aetrix verify that TC297TP128F300NBCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC297TP128F300NBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC297TP128F300NBCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC297TP128F300NBCKXUMA1?
All TC297TP128F300NBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC297TP128F300NBCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC297TP128F300NBCKXUMA1 part is unused and in its original packaging.
Return procedure for TC297TP128F300NBCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC297TP128F300NBCKXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
