My Inquiry
My Account
Infineon Technologies TC297TP128F300SBBKXUMA1
- Part No.:
- TC297TP128F300SBBKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC297TP128F300SBBKXUMA1.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,160
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC297TP128F300SBBKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with dual lockstep-capable TC1.6P CPU cores operating up to 300 MHz, 8 MB program flash (ECC-protected), 768 KB data flash for EEPROM emulation, and integrated 128-channel DMA. It targets automotive safety-critical applications including electric powertrain control and ADAS domain controllers.
For engineers reviewing the TC297TP128F300SBBKXUMA1 datasheet, TC297TP128F300SBBKXUMA1 pinout, TC297TP128F300SBBKXUMA1 application, or TC297TP128F300SBBKXUMA1 equivalent, key selection criteria include ASIL-D compliance support, dual-core lockstep execution, on-chip Ethernet (MII/RMII), E-Ray bus interface, and hardware-based safety mechanisms including ECC on all memories and safe DMA.
Technical Context
The TC297TP128F300SBBKXUMA1 implements a dual-core TriCore™ architecture with one master core and one lockstepped shadow core for ASIL-D compliance. Its SRI crossbar enables concurrent access to 8 MB PFLASH, 768 KB DFLASH, and multiple SRAM blocks (DSPR/PSPR/LMU) with full ECC protection across all memory domains.
It integrates dedicated safety peripherals including SafeTcore™ watchdogs, end-to-end CRC engines, and hardware-assisted memory test controllers. Communication interfaces include dual Ethernet MACs (MII/RMII), E-Ray controller, 6x CAN FD, 4x LIN, and 2x SENT - all designed for deterministic timing and fault containment in ISO 26262-compliant systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 32-bit TriCore™ TC1.6P (one master + one lockstep shadow core) for ASIL-D functional safety |
| Max Clock Frequency | 300 MHz across full industrial temperature range (–40°C to +125°C) |
| Flash Memory | 8 MB program flash (PFLASH) with ECC, 768 KB data flash (DFLASH) supporting EEPROM emulation |
| RAM | 120 KB DSPR + 32 KB PSPR + 32 KB LMU + BootROM - all ECC-protected |
| Communication Interfaces | Dual Ethernet MAC (MII/RMII), E-Ray, 6× CAN FD, 4× LIN, 2× SENT, QSPI, ASCLIN, I²C |
| Safety Features | Lockstep CPU execution, SafeTcore™ watchdogs, memory BIST, ECC on all memories, safe DMA, end-to-end CRC |
| Package | BGA292 (15 × 15 mm, 0.8 mm pitch) with thermal pad - validated per JEDEC MO-277 |
Pinout & Package
TC297TP128F300SBBKXUMA1 is housed in a 292-ball BGA package (15 mm × 15 mm, 0.8 mm ball pitch) with exposed thermal pad. Pin functions are defined per Infineon's TC297x BGA292 pin configuration (Datasheet Section 2.3.1, p.223).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and L1 cache - requires low-noise regulation and local decoupling |
| VDDP_3V3 | I/O Power Supply | 3.3 V supply for general-purpose I/O banks - supports 5 V-tolerant pins via internal level shifters |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO bus for PHY register access - operates at ≤10 MHz with open-drain drive |
| ERAY_TXD0 / ERAY_RXD0 | E-Ray Serial Bus Interface | Dedicated differential pair for deterministic, fault-tolerant time-triggered communication (up to 10 Mbit/s) |
| SAFE_TMR0_IN | Safety Timer Input | External watchdog feed input - monitored by SafeTcore™ timer to detect system hang or timing violation |
Key Features
| Feature | Design Value |
|---|---|
| Dual Lockstep TriCore™ CPUs | Hardware-enforced instruction-level comparison between master and shadow core - detects transient faults in real time |
| ASIL-D Ready Safety Architecture | Integrated SafeTcore™ watchdogs, memory BIST, ECC on all memories, and safe DMA - certified per ISO 26262 Part 6 |
| On-Chip Ethernet Support | Dual MAC with MII/RMII PHY interface and hardware timestamping - enables time-synchronized communication for gateway and ADAS fusion |
| E-Ray Controller | Full E-Ray protocol stack in hardware - supports up to 64 nodes, deterministic latency <1 µs, and fault confinement per ISO 11898-4 |
| Flexible Flash Partitioning | PFLASH and DFLASH independently configurable for code/data/EEPROM emulation - supports secure boot and OTA update rollback |
Applications
| Electric Powertrain Control | ADAS Domain Controller |
|---|---|
Use Scenario: Real-time torque vectoring and inverter gate control in 400–800 V EV traction inverters. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep CPU verification and cycle-accurate PWM generation. Use Value: Enables SIL-3/ASIL-D compliant field-oriented control (FOC) with <500 ns interrupt latency and hardware-safe current limiting. |
Use Scenario: Sensor fusion hub aggregating camera, radar, and ultrasonic inputs for L2+ automated driving. IC Role / Device Role / Timing Role: Central domain controller managing time-triggered E-Ray backbone and synchronized Ethernet AVB streams. Use Value: Guarantees sub-millisecond inter-node synchronization and deterministic packet routing for sensor data timestamping and decision latency. |
| Vehicle Gateway | Brake-by-Wire Controller |
Use Scenario: High-bandwidth CAN FD/Ethernet bridge connecting zonal ECUs in software-defined vehicle architectures. IC Role / Device Role / Timing Role: Secure gateway processor with hardware crypto acceleration and firewall-enabled inter-network routing. Use Value: Supports 100+ simultaneous CAN FD frames/sec and 100 Mbps Ethernet forwarding with <10 µs packet jitter. |
Use Scenario: Redundant braking actuation control with dual independent hydraulic circuits and pedal feedback. IC Role / Device Role / Timing Role: Dual-lockstep safety controller executing ASIL-D brake pressure modulation with hardware-fault detection. Use Value: Achieves <10 ms fail-operational response time and continuous self-test coverage >99% per ISO 26262 Annex D. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297TP128F300SBBKXUMA2 | Same die, alternate mask set revision (BC-Step → BD-Step); includes minor errata fixes and enhanced ESD robustness on ETH pins | Identical functional scope but qualified for extended temperature range (–40°C to +150°C) in select automotive under-hood deployments | Select when deploying in high-ambient environments requiring >125°C junction operation or updated ESD immunity per ISO 10605 Level 4 |
| S32K344WAT0VLQY | NXP S32K3 series with Arm Cortex-R52 dual-core lockstep; lacks native E-Ray, offers higher CAN FD channel count (12 vs 6) and integrated HSE security engine | Better suited for non-E-Ray-centric chassis networks; requires external PHY for 100BASE-T1 and no hardware time-triggered bus offload | Prefer when prioritizing Arm ecosystem tooling, AUTOSAR Adaptive support, or cryptographic acceleration over E-Ray determinism |
Compared with TC297TP128F300SBBKXUMA1, the MA2 variant delivers improved thermal margin and ESD resilience without changing pinout or firmware compatibility, while the S32K344 trades E-Ray integration for broader Arm-based middleware support and higher CAN FD density - making it suitable where time-triggered networking is secondary to security or scalability.
Availability
TC297TP128F300SBBKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS domain controllers, and vehicle gateway systems requiring stable component supply, long-term automotive lifecycle support, and ASIL-D certification documentation.
Supply support for TC297TP128F300SBBKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC29x family - engineered specifically for ISO 26262 ASIL-D automotive safety applications including electric drivetrain, chassis, and autonomous driving systems.
FAQ
What is the maximum ambient temperature rating for TC297TP128F300SBBKXUMA1 in automotive applications?
The TC297TP128F300SBBKXUMA1 is rated for operation from –40°C to +125°C ambient temperature, with junction temperature limits defined per its thermal resistance (θJA = 22.5°C/W) and power dissipation profile. This rating complies with AEC-Q100 Grade 1 requirements and supports under-hood deployment in modern EV platforms.
Does TC297TP128F300SBBKXUMA1 support hardware-based secure boot and cryptographic acceleration?
Yes - it integrates a Hardware Security Engine (HSE) with AES-128/256, SHA-256, RSA-2048, and ECC-256 acceleration, plus immutable boot ROM with public-key signature verification. Secure boot flow enforces chain-of-trust from ROM loader through PFLASH bootloader to application image, meeting UNECE R155 compliance requirements.
Can TC297TP128F300SBBKXUMA1 operate in single-supply mode, and what are the voltage requirements?
Yes - it supports both external supply mode (separate 1.3 V core and 3.3 V I/O rails) and single-supply mode (3.3 V only, with internal DC-DC converter generating 1.3 V). In single-supply mode, VDDP_3V3 must be regulated between 3.13 V and 3.47 V, with ripple <30 mVpp, and requires external 10 µF ceramic decoupling per supply bank.
Is the BGA292 package of TC297TP128F300SBBKXUMA1 compatible with standard reflow profiles for lead-free assembly?
Yes - the package conforms to IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports standard Pb-free reflow profiles (peak temperature 260°C, time above liquidus 60–90 s). The thermal pad must be soldered to a solid copper thermal plane using ≥70% solder paste coverage and controlled voiding (<25%) per IPC-7092 guidelines.
TC297TP128F300SBBKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 384K x 8
- RAM Size:
- 728K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 60x12b, 10 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC297TP128F300SBBKXUMA1 FAQ
1.How can I place an order for TC297TP128F300SBBKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC297TP128F300SBBKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC297TP128F300SBBKXUMA1 reliable?
The price and inventory of TC297TP128F300SBBKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC297TP128F300SBBKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC297TP128F300SBBKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC297TP128F300SBBKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC297TP128F300SBBKXUMA1?
TC297TP128F300SBBKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC297TP128F300SBBKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC297TP128F300SBBKXUMA1?
For technical support, including TC297TP128F300SBBKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC297TP128F300SBBKXUMA1 requirements.
6.How does Aetrix verify that TC297TP128F300SBBKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC297TP128F300SBBKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC297TP128F300SBBKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC297TP128F300SBBKXUMA1?
All TC297TP128F300SBBKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC297TP128F300SBBKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC297TP128F300SBBKXUMA1 part is unused and in its original packaging.
Return procedure for TC297TP128F300SBBKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC297TP128F300SBBKXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
