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Infineon Technologies TC297TP128F300SBCKXUMA1
- Part No.:
- TC297TP128F300SBCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC297TP128F300SBCKXUMA1.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:405
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Product details
Overview
TC297TP128F300SBCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P CPU cores, lockstep shadow core for ASIL-D compliance, 8 MB program flash with ECC, 768 KB data flash for EEPROM emulation, and integrated 128-channel safety DMA. It targets automotive powertrain and chassis control systems requiring functional safety up to ISO 26262 ASIL-D.
For engineers reviewing the TC297TP128F300SBCKXUMA1 datasheet, TC297TP128F300SBCKXUMA1 pinout, TC297TP128F300SBCKXUMA1 application, or TC297TP128F300SBCKXUMA1 equivalent, key selection criteria include dual-core lockstep timing integrity, flash ECC coverage, ERAY/ETH interface latency, and BGA292 package thermal performance in engine control units.
Technical Context
The TC297TP128F300SBCKXUMA1 implements a safety-critical dual-core architecture where Core 0 operates in lockstep with its shadow core to detect transient faults, while Core 1 runs independently for application tasks. Its SRI crossbar enables deterministic 64-bit memory access with sub-10 ns arbitration latency between CPUs, DMA, and peripherals.
It integrates dedicated safety mechanisms including ECC on all on-chip memories (PFLASH, DFLASH, SRAM), end-to-end CRC protection on DMA transfers, and hardware-supported memory protection units (MPUs) per core. The ERAY controller supports deterministic time-triggered communication at up to 10 Mbit/s with built-in protocol error detection and recovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual 32-bit TriCore™ TC1.6P @ 300 MHz with lockstep shadow core for ASIL-D fault detection |
| Flash Memory | 8 MB PFLASH + 768 KB DFLASH, both with full ECC and EEPROM emulation capability |
| RAM | 32 KB LMU SRAM, plus up to 120 KB DSPR + 32 KB PSPR per core, all ECC-protected |
| Communication Interfaces | 2× ERAY, 1× Ethernet (10/100 Mbit/s MII/RMII), 6× CAN FD, 4× ASC/ASCLIN, 2× QSPI, 1× I²C |
| Safety Features | Lockstep CPU monitoring, memory ECC, DMA CRC, MPU, safe interrupt controller, and BIST for logic and memory |
| Package | BGA292 (15 × 15 mm, 0.8 mm pitch), qualified for automotive AEC-Q100 Grade 1 (−40 °C to +125 °C) |
| Real-Time Performance | ≤ 10 ns interrupt latency with priority-based vectoring; ≤ 2-cycle instruction dispatch under full load |
Pinout & Package
TC297TP128F300SBCKXUMA1 is housed in a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad exposed on underside for enhanced heat dissipation in engine bay applications. Pin assignment follows the TC297x BGA292 configuration defined in Infineon's Data Sheet V1.1 Section 2.3.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and L1 cache; requires low-noise regulation and local decoupling |
| VDDP_3V3 | I/O Power Supply | 3.3 V supply for general-purpose I/Os, ASC, QSPI, and ETH interfaces |
| ERAY0_TX / ERAY0_RX | Time-Triggered Bus Interface | Differential pair for deterministic ERAY network communication; supports 10 Mbit/s with built-in clock recovery |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO bus for PHY register configuration and status polling |
| TRAP_IN / TRAP_OUT | Fault Signaling Interface | Asynchronous signals for external safety monitor coordination and system-level fail-safe shutdown |
| BOOT_MODE[1:0] | Boot Configuration Pins | Strapped inputs determining boot source (PFLASH, DFLASH, or external SPI flash) at power-on reset |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core Architecture | Core 0 + shadow core provide real-time fault detection with <1 µs diagnostic response for ASIL-D compliance |
| End-to-End DMA Safety | 128-channel controller with CRC generation/checking, address range checking, and channel isolation per safety domain |
| Flash ECC & Wear-Leveling | Full SEC-DED ECC on 8 MB PFLASH and 768 KB DFLASH, plus firmware-managed wear leveling for >100k write cycles |
| Hardware Time-Triggered Execution | Global timer (GTM) with 64-bit counter, 12 TBU modules, and precise PWM/ADC synchronization for deterministic motor control |
| Secure Boot & Debug Lock | ROM-based secure boot with SHA-256 signature verification; JTAG/DAP access disabled after production programming |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection sequencing, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D software partitions with lockstep core validation and flash ECC. Use Value: Sub-microsecond interrupt latency ensures precise spark/fuel actuation timing; ERAY interface synchronizes with transmission and brake ECUs. |
Use Scenario: Torque assist calculation, motor position feedback processing, and fault-tolerant torque limiting in column-assist EPS systems. IC Role / Device Role / Timing Role: Dual-core runtime separation: Core 0 handles safety-critical torque limiting; Core 1 runs PID motor control loop at 10 kHz. Use Value: GTM hardware timers enable <±50 ns PWM edge placement accuracy; DSADC provides 16-bit current sensing resolution at 1 MSps. |
| Brake-by-Wire System | Vehicle Domain Controller |
Use Scenario: Redundant hydraulic pressure control, wheel speed fusion, and fail-operational braking decisions. IC Role / Device Role / Timing Role: Safety island managing ISO 26262 ASIL-D brake actuation logic with independent watchdog supervision. Use Value: Dual-lockstep core + memory ECC guarantees fault-free execution of brake pressure ramping algorithms; ETH interface enables OTA update delivery. |
Use Scenario: Centralized vehicle functions including gateway routing, sensor fusion preprocessing, and over-the-air (OTA) update orchestration. IC Role / Device Role / Timing Role: High-bandwidth interconnect hub using SRI crossbar to coordinate CAN FD, Ethernet, and QSPI traffic across domains. Use Value: 64-bit SRI bandwidth supports concurrent 100 Mbps ETH + 8× CAN FD + 2× QSPI transfers without arbitration stall; BGA292 thermal design sustains 1.5 W sustained power in compact modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297TP128F300SBCKXUMA2 | Same silicon, updated BC-step mask revision with minor ESD robustness improvement (HBM ±8 kV → ±10 kV) | Identical functional safety qualification; preferred for new designs requiring latest wafer lot traceability | Select when sourcing from post-2021 production lots; pin- and code-compatible drop-in replacement |
| TC397XP-128F300SBCAKXUMA1 | Newer AURIX™ TC3xx generation with tri-core (2× TC1.6P + 1× TC1.8P), higher clock (330 MHz), and expanded ETH/PCIe support | Supports AUTOSAR Adaptive and centralized zonal architectures; not ASIL-D certified for legacy brake-by-wire | Choose for next-gen domain controllers needing PCIe connectivity or AUTOSAR Adaptive middleware; requires PCB redesign |
Compared with TC297TP128F300SBCKXUMA1, the MA2 variant offers enhanced ESD immunity without functional change, while the TC397XP delivers higher compute density and modern interfaces at the cost of ASIL-D certification continuity and BGA292 footprint compatibility.
Availability
TC297TP128F300SBCKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, and brake-by-wire modules requiring stable component supply across automotive production lifecycles.
Supply support for TC297TP128F300SBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and wafer fabs in Dresden and Villach.
This device belongs to the AURIX™ TC29x family-designed specifically for ISO 26262 ASIL-D automotive safety applications including powertrain, chassis, and advanced driver assistance systems (ADAS).
FAQ
What is the maximum junction temperature rating for TC297TP128F300SBCKXUMA1?
The TC297TP128F300SBCKXUMA1 is rated for operation up to +150 °C junction temperature, validated per AEC-Q100 Grade 1 specifications (−40 °C to +125 °C ambient). Thermal derating curves in the datasheet define safe operating area limits above 125 °C ambient based on package thermal resistance (θJA = 28.5 °C/W) and power dissipation profile.
Does TC297TP128F300SBCKXUMA1 support secure boot with cryptographic verification?
Yes-it includes ROM-based secure boot with SHA-256 hash verification of the first-stage bootloader image stored in protected PFLASH. The boot ROM validates digital signatures before execution and disables debug interfaces (JTAG/DAP) permanently upon successful production programming, meeting EVITA Full requirements.
How many independent CAN FD channels does TC297TP128F300SBCKXUMA1 integrate?
The device integrates six fully independent CAN FD controllers (CAN0–CAN5), each supporting data rates up to 5 Mbit/s, ISO 11898-1:2015 compliance, and configurable bit timing with programmable sample points. All channels feature dedicated message RAM, hardware filtering, and error counters with freeze mode for debugging.
Is external crystal required for the main system clock?
No-TC297TP128F300SBCKXUMA1 includes an internal 40 MHz RC oscillator (FRC) qualified for startup and fail-safe operation, plus a PLL that accepts either the FRC or an external crystal (1–20 MHz) as reference. Crystal use is optional but recommended for Ethernet MAC timing stability and reduced jitter in high-speed communication.
TC297TP128F300SBCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 384K x 8
- RAM Size:
- 728K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 84x12b, 10 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC297TP128F300SBCKXUMA1 FAQ
1.How can I place an order for TC297TP128F300SBCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC297TP128F300SBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC297TP128F300SBCKXUMA1 reliable?
The price and inventory of TC297TP128F300SBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC297TP128F300SBCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC297TP128F300SBCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC297TP128F300SBCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC297TP128F300SBCKXUMA1?
TC297TP128F300SBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC297TP128F300SBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC297TP128F300SBCKXUMA1?
For technical support, including TC297TP128F300SBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC297TP128F300SBCKXUMA1 requirements.
6.How does Aetrix verify that TC297TP128F300SBCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC297TP128F300SBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC297TP128F300SBCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC297TP128F300SBCKXUMA1?
All TC297TP128F300SBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC297TP128F300SBCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC297TP128F300SBCKXUMA1 part is unused and in its original packaging.
Return procedure for TC297TP128F300SBCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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