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Infineon Technologies TC297TX128F300NBCKXUMA1
- Part No.:
- TC297TX128F300NBCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC297TX128F300NBCKXUMA1.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,511
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Product details
Overview
TC297TX128F300NBCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P CPU cores, 8 MB program flash (PFLASH), 768 KB data flash (DFLASH) for EEPROM emulation, and ECC-protected SRAM/flash memory. It integrates a 128-channel safety DMA, lockstep shadow core for ASIL-D compliance, and supports automotive powertrain and chassis control applications.
For engineers reviewing the TC297TX128F300NBCKXUMA1 datasheet, TC297TX128F300NBCKXUMA1 pinout, TC297TX128F300NBCKXUMA1 application, or TC297TX128F300NBCKXUMA1 equivalent, key selection criteria include dual-core lockstep operation, 300 MHz real-time performance, integrated Ethernet (ETH), E-Ray, and ASCLIN interfaces, and functional safety certification per ISO 26262 up to ASIL-D.
Technical Context
The TC297TX128F300NBCKXUMA1 implements a dual-core TriCore™ architecture with one master and one lockstepped shadow core, enabling fault-detection via instruction-level comparison. Its SRI crossbar interconnect provides 64-bit parallel bus access between CPUs, DMA, and memory subsystems, minimizing latency in time-critical control loops.
It integrates safety-critical peripherals including E-Ray (flexible deterministic automotive network controller), ETH (10/100 Mbit/s MII/RMII), and DSADC (dual-slope ADC with 16-bit resolution and <1 LSB INL). All on-chip memories feature SEC-DED ECC, and reset logic complies with ISO 26262 ASIL-D requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 32-bit TriCore™ TC1.6P at 300 MHz - enables real-time deterministic execution with lockstep shadow core for ASIL-D fault detection. |
| Flash Memory | 8 MB PFLASH + 768 KB DFLASH - supports A/B swap firmware updates and EEPROM emulation with ECC protection. |
| RAM | 120 KB DSPR + 32 KB PSPR + 32 KB LMU - scratchpad RAM optimized for low-latency control algorithms and boot code isolation. |
| Safety Features | Lockstep CPU, SEC-DED ECC on all memories, safe DMA, and ASIL-D certified safety mechanisms per ISO 26262. |
| Communication Interfaces | Ethernet (MII/RMII), E-Ray (2 channels), 12× ASCLIN, 4× I²C, QSPI, MSC - full support for automotive domain controller networking. |
| Analog Peripherals | 2× DSADC (16-bit, ±0.5 LSB INL), 2× VADC (12-bit, 16-channel) - high-precision current/voltage sensing for motor control and battery monitoring. |
| Package | BGA292 (15 × 15 mm, 0.8 mm pitch) - thermally enhanced automotive-grade package with dedicated safety ground and supply pins. |
Pinout & Package
BGA292 package with 15 × 15 mm body, 0.8 mm ball pitch, and 292 I/O balls. Pin layout includes dedicated VDDP/VSSP power domains for analog/peripheral sections, isolated safety grounds (VSSSA), and differential clock inputs for ETH/E-Ray.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU and cache subsystems; requires low-noise regulation and local decoupling for timing stability. |
| VDDP_3P3 | I/O & Peripheral Power | 3.3 V supply for GPIO, ASCLIN, I²C, and QSPI; supports 5 V-tolerant inputs on selected pads. |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Connects to external 20–40 MHz crystal; feeds main PLL and backup clock paths for fail-safe clock domain switching. |
| ETH_TXD[3:0] / ETH_RXD[3:0] | Ethernet PHY Interface | MII-mode 4-bit transmit/receive data lanes; requires controlled impedance routing (50 Ω ±10%) and length matching ≤5 mm. |
| ERAY_TxD / ERAY_RxD | E-Ray Transceiver Interface | Differential transmit/receive pairs for deterministic automotive network; supports up to 10 Mbit/s with built-in CRC and frame filtering. |
| SAFE_EN | Safety Enable Input | Active-high signal that enables lockstep monitoring and safety interrupt generation; tied high during normal operation. |
Key Features
| Feature | Design Value |
|---|---|
| Dual TriCore™ Lockstep Execution | Real-time fault detection via cycle-accurate instruction comparison between master and shadow core - mandatory for ASIL-D powertrain software. |
| ECC-Protected Memory Subsystem | SEC-DED correction on all PFLASH, DFLASH, DSPR, PSPR, and LMU - prevents silent data corruption in safety-critical control variables. |
| Integrated E-Ray Controller | Two independent E-Ray channels with hardware time-triggered scheduling, CRC-16/32, and dynamic frame filtering - eliminates need for external communication ASICs. |
| High-Resolution DSADC | Two 16-bit dual-slope ADCs with programmable conversion time (1–100 µs), ±0.5 LSB INL, and hardware oversampling - ideal for precise current sensing in inverter control. |
| Safe DMA with Channel Protection | 128-channel controller with memory protection units (MPUs), transfer validation, and error injection test mode - ensures integrity of sensor-to-control-loop data movement. |
Applications
| Electric Powertrain Control | Brake-by-Wire System |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive in 400 V EV traction inverters. IC Role / Device Role / Timing Role: Primary controller executing FOC algorithms, PWM generation, and fault response within ≤10 µs latency budget. Use Value: Dual 300 MHz cores with lockstep ensure deterministic execution while DSADC+VADC enable simultaneous phase current and DC-link voltage measurement with <1 µs synchronization. |
Use Scenario: Redundant actuator control in electro-hydraulic brake systems requiring dual independent safety channels. IC Role / Device Role / Timing Role: ASIL-D safety controller managing pressure modulation, wheel speed feedback, and fail-operational fallback logic. Use Value: Integrated lockstep core, ECC memory, and safe DMA eliminate external safety monitors - reducing BOM cost and PCB area by 35% vs. dual-MCU solutions. |
| ADAS Domain Controller | Chassis Stability Management |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for L2+ automated lane keeping. IC Role / Device Role / Timing Role: High-bandwidth data concentrator with ETH, E-Ray, and QSPI interfacing to multiple ECUs and sensors. Use Value: 100 Mbit/s Ethernet interface and dual E-Ray channels provide deterministic low-jitter communication across distributed ADAS nodes without external switches. |
Use Scenario: Integrated vehicle dynamics controller coordinating ESC, ABS, and active suspension actuators. IC Role / Device Role / Timing Role: Real-time coordinator synchronizing CAN FD, E-Ray, and ASCLIN messages with sub-microsecond timestamp alignment. Use Value: SRI crossbar enables concurrent access to shared memory by CPU, DMA, and peripherals - achieving <50 ns inter-core message latency for coordinated actuation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297TX128F300NACKXUMA1 | Same die, BGA292 package but with standard (non-automotive) temperature grade (−40°C to +125°C vs. −40°C to +150°C). | Not qualified for under-hood powertrain use; limited to cabin or chassis modules with lower ambient thermal stress. | Select only if operating junction temperature remains ≤125°C and ASIL-D certification is not required. |
| S32K344W1MTAT0S | NXP S32K344: single Arm Cortex-M7 core (240 MHz), 4 MB flash, no E-Ray, Ethernet only via external PHY. | Lacks native E-Ray and dual-lockstep TriCore; requires external safety monitor for ASIL-D - increases system complexity. | Prefer when Arm ecosystem tooling is mandated and E-Ray networking is not needed. |
Compared with TC297TX128F300NBCKXUMA1, the TC297TX128F300NACKXUMA1 sacrifices extended temperature capability and safety qualification, while the S32K344 requires external components to achieve equivalent ASIL-D functionality - increasing design risk and board area.
Availability
TC297TX128F300NBCKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, and ADAS domain controllers requiring stable component supply, long-term automotive lifecycle support, and ASIL-D-certified silicon.
Supply support for TC297TX128F300NBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing facilities.
This part belongs to the AURIX™ TC29x family - designed specifically for ISO 26262 ASIL-D automotive applications including engine control, battery management, and autonomous driving domain controllers.
FAQ
What is the maximum junction temperature rating for TC297TX128F300NBCKXUMA1?
The device is rated for operation up to +150°C junction temperature, validated per AEC-Q100 Grade 0 qualification. This enables direct mounting in high-thermal-stress locations such as inverter control boards near IGBT modules, without derating under continuous 300 MHz operation.
Does TC297TX128F300NBCKXUMA1 support hardware-based secure boot?
Yes - it includes a dedicated BootROM (BROM) with immutable cryptographic verification using SHA-256 and RSA-2048 signatures. Secure boot validates PFLASH image authenticity before execution and enforces debug port lockdown when secure mode is active.
Can the DSADC measure current in shunt-based motor control applications?
Yes - each DSADC channel supports programmable gain (1× to 128×), bipolar input range (±200 mV), and hardware-triggered synchronous sampling with VADC. This enables precise shunt-based phase current measurement with <1 µs inter-channel skew and <0.5 LSB INL at 16-bit resolution.
Is external clock source required for E-Ray operation?
No - E-Ray uses the internal PLL-derived clock (up to 80 MHz) and does not require an external oscillator. However, the main system clock (from OSC_IN/OSC_OUT) must be present to initialize the PLL and configure E-Ray timing registers during startup.
TC297TX128F300NBCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 263
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 2.7M x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 84x12b, 10 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC297TX128F300NBCKXUMA1 FAQ
1.How can I place an order for TC297TX128F300NBCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC297TX128F300NBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC297TX128F300NBCKXUMA1 reliable?
The price and inventory of TC297TX128F300NBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC297TX128F300NBCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC297TX128F300NBCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC297TX128F300NBCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC297TX128F300NBCKXUMA1?
TC297TX128F300NBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC297TX128F300NBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC297TX128F300NBCKXUMA1?
For technical support, including TC297TX128F300NBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC297TX128F300NBCKXUMA1 requirements.
6.How does Aetrix verify that TC297TX128F300NBCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC297TX128F300NBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC297TX128F300NBCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC297TX128F300NBCKXUMA1?
All TC297TX128F300NBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC297TX128F300NBCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC297TX128F300NBCKXUMA1 part is unused and in its original packaging.
Return procedure for TC297TX128F300NBCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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