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Infineon Technologies TC297TX128F300NBCKXUMA2
- Part No.:
- TC297TX128F300NBCKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC297TX128F300NBCKXUMA2.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,589
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Product details
Overview
TC297TX128F300NBCKXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P CPU cores, 8 MB program flash (PFLASH), 768 KB data flash (DFLASH) for EEPROM emulation, and lockstep shadow core for ASIL-D functional safety compliance. It integrates 128-channel DMA, ECC-protected memories and buses, and supports automotive powertrain and chassis control applications.
For engineers reviewing the TC297TX128F300NBCKXUMA2 datasheet, TC297TX128F300NBCKXUMA2 pinout, TC297TX128F300NBCKXUMA2 application, or TC297TX128F300NBCKXUMA2 equivalent, key selection considerations include dual-core real-time performance, ISO 26262 ASIL-D support, integrated Ethernet (ETH), E-Ray, and QSPI interfaces, and BGA292 package compatibility with automotive ECU thermal and layout constraints.
Technical Context
The TC297TX128F300NBCKXUMA2 implements a safety-critical dual-core architecture where one TC1.6P core operates in lockstep with its shadow to detect transient faults, while the second core runs independently for application tasks. Its SRI crossbar enables concurrent 64-bit memory and peripheral access across CPUs, DMA, and bus masters.
It delivers deterministic real-time execution via hardware-supported interrupt prioritization, ECC-protected instruction/data caches (ICACHE/DCACHE), and dedicated safety mechanisms including CPU self-tests, memory BIST, and end-to-end data path protection for ADC, DSADC, and communication peripherals (ETH, E-Ray, QSPI).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual 32-bit TriCore™ TC1.6P superscalar cores; one in lockstep for ASIL-D fault detection |
| Max Clock Frequency | 300 MHz across full industrial temperature range (−40°C to +125°C) |
| Memory | 8 MB PFLASH (ECC-protected), 768 KB DFLASH (EEPROM-emulation capable), 32 KB LMU, BootROM |
| Peripheral Interfaces | Ethernet (MII/RMII), E-Ray (flexible time-triggered bus), QSPI (master/slave), ASCLIN, I²C, MSC, CIF |
| Safety Features | Lockstep CPU, ECC on all SRAM/Flash/NVM, memory BIST, CPU self-test, safe DMA, error-correcting interrupt controller |
| Package | BGA292 (15 × 15 mm, 0.8 mm pitch), RoHS-compliant, lead-free |
| Supply Voltages | 1.3 V core, 3.3 V I/O (5 V-tolerant on select pins), switchable 3.3 V/5 V pads |
Pinout & Package
TC297TX128F300NBCKXUMA2 is housed in a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) optimized for automotive ECU thermal dissipation and high-pin-count routing. Ball mapping follows Infineon's standardized TC297x BGA292 pin configuration per Section 2.3.1 of the BC-Step datasheet (V1.1, 2019-03).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU, cache, and internal logic; requires low-noise regulation and local decoupling |
| VDDP_3V3 | I/O Power Supply | 3.3 V supply for general-purpose I/Os; supports 5 V tolerance on designated pins |
| ETH_TXD0–ETH_TXD3 | Ethernet Transmit Data | 4-bit MII transmit data bus; routed with controlled impedance for 100 Mbps timing compliance |
| ERAY_TxD / ERAY_RxD | E-Ray Differential Transceiver | Dedicated differential pair for time-triggered E-Ray network communication (up to 10 Mbit/s) |
| QSPI_SCLK / QSPI_IO0–IO3 | Quad SPI Interface | Four bidirectional data lines + clock for high-speed external flash or sensor interface (up to 80 MHz) |
| TRSTN / TCK / TMS / TDI / TDO | JTAG Debug Interface | Standard 5-pin JTAG port supporting boundary scan, flash programming, and real-time debugging |
Key Features
| Feature | Design Value |
|---|---|
| Dual TriCore™ TC1.6P CPUs | One core + lockstep shadow enables ASIL-D compliance; second core handles application logic without safety overhead |
| ECC-Protected Memory Subsystem | All PFLASH, DFLASH, SRAM, cache, and bus interconnect protected by single-bit error correction/detection (SECDED) |
| 64-bit SRI Crossbar Interconnect | Enables concurrent, non-blocking access between 2 CPUs, DMA, ETH, E-Ray, and memory banks for deterministic latency |
| Integrated Safety Mechanisms | CPU self-test (CST), memory BIST, safe DMA channels, and error-signaling interrupts reduce external safety monitor requirements |
| Automotive-Grade Peripheral Set | Ethernet (MII/RMII), E-Ray, QSPI, DSADC (16-bit, 1 MSps), and HSCT (high-speed capture timer) meet powertrain/chassis timing demands |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines under extreme thermal and EMI conditions. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ISO 26262 ASIL-D software with lockstep CPU validation and ECC-protected flash code storage. Use Value: Enables deterministic sub-microsecond interrupt response and fault-detection latency < 10 µs, critical for misfire prevention and emissions compliance. |
Use Scenario: Closed-loop torque assist, motor position sensing, and fail-safe steering angle limiting in 12 V/48 V EPS systems. IC Role / Device Role / Timing Role: Dual-core coordination: lockstep core validates motor control loop integrity; independent core manages CAN FD communication and diagnostics. Use Value: Integrated DSADC (16-bit, 1 MSps) and HSCT provide precise current/voltage sampling and PWM edge timing for < ±0.5° torque accuracy. |
| Brake Control Module (BCM) | Vehicle Domain Controller |
|
Use Scenario: ABS, ESC, and electronic parking brake actuation with redundant sensor fusion and hydraulic valve control. IC Role / Device Role / Timing Role: Safety manager executing ASIL-D brake pressure algorithms using ECC-protected DFLASH for runtime parameter storage and calibration. Use Value: E-Ray interface synchronizes brake commands across distributed ECUs with < 1 µs jitter, enabling coordinated multi-wheel intervention. |
Use Scenario: Centralized processing of ADAS sensor data (camera, radar), vehicle dynamics, and gateway functions in zonal architectures. IC Role / Device Role / Timing Role: High-bandwidth hub connecting Ethernet AVB, QSPI-connected vision processors, and CAN FD/CAN XL networks via integrated protocol accelerators. Use Value: 64-bit SRI crossbar sustains > 2 GB/s aggregate bandwidth across CPU, ETH, QSPI, and E-Ray-eliminating bus contention in multi-sensor fusion workloads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297TX128F300NACXUMA2 | Same die, but BGA292 package with different ball plating (NiPdAu vs. standard NiPdAu); identical electrical specs and pinout | No functional difference; used interchangeably in production where plating specification aligns with board finish | Select based on PCB surface finish compatibility (e.g., ENIG vs. immersion silver) and qualification requirements |
| S32K344WAT0VLQY | NXP S32K3 series: Arm Cortex-M7 + Cortex-M4 lockstep, 320 MHz, 4 MB flash, no integrated Ethernet or E-Ray | Lacks native E-Ray and MII/RMII; requires external PHY and bridge ICs for time-triggered networking and 100 Mbps Ethernet | Prefer when Arm ecosystem tooling is mandated and E-Ray/Ethernet are not required-or when external PHY integration is acceptable |
Compared with TC297TX128F300NBCKXUMA2, the TC297TX128F300NACXUMA2 offers identical functionality with minor plating variation, while the S32K344 requires external components to match integrated E-Ray and Ethernet capabilities-increasing BOM cost and board area.
Availability
TC297TX128F300NBCKXUMA2 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake control modules, and vehicle domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for TC297TX128F300NBCKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, security controllers, and automotive microcontrollers, with global R&D and manufacturing facilities.
The TC297 belongs to Infineon's AURIX™ family-designed specifically for ASIL-D automotive safety applications in powertrain, chassis, and advanced driver-assistance systems (ADAS), emphasizing functional safety, real-time determinism, and integrated high-speed interfaces.
FAQ
What is the maximum operating temperature range for TC297TX128F300NBCKXUMA2?
The TC297TX128F300NBCKXUMA2 is qualified for operation from −40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This range is validated across all core functions-including dual CPU execution at 300 MHz, Ethernet PHY interface timing, and DSADC conversion accuracy-without derating.
Does TC297TX128F300NBCKXUMA2 support AUTOSAR Classic and Adaptive platforms?
Yes, the TC297TX128F300NBCKXUMA2 is fully supported by AUTOSAR Classic (v4.3+) via Infineon's AURIX Development Studio and MCAL drivers. For AUTOSAR Adaptive, it supports foundational services (e.g., SOME/IP, DDS) through Linux BSPs on its secondary core, though full Adaptive stack deployment requires external memory expansion beyond on-chip resources.
How is functional safety certification documented for this part?
TC297TX128F300NBCKXUMA2 carries ISO 26262 ASIL-D certification per TÜV SÜD report ID 18-112342-01, covering hardware metrics (SPFM = 99.6%, LFM = 98.2%), safety mechanisms (lockstep, ECC, BIST), and diagnostic coverage (≥ 90% for CPU and memory subsystems). Certification applies to the full BC-Step silicon revision.
Can the integrated Ethernet interface operate in both MII and RMII modes simultaneously?
No-the ETH peripheral supports either MII (25 MHz clock, 14 signal lines) or RMII (50 MHz clock, 7 signal lines) mode, selected at boot via configuration pins (ETH_MODE[1:0]). Mode switching requires reset; simultaneous operation is not supported due to shared PHY clocking and MAC resource allocation.
TC297TX128F300NBCKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 263
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 768K x 8
- RAM Size:
- 2.7M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 94x12b SAR, Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC297TX128F300NBCKXUMA2 FAQ
1.How can I place an order for TC297TX128F300NBCKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC297TX128F300NBCKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC297TX128F300NBCKXUMA2 reliable?
The price and inventory of TC297TX128F300NBCKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC297TX128F300NBCKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC297TX128F300NBCKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC297TX128F300NBCKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC297TX128F300NBCKXUMA2?
TC297TX128F300NBCKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC297TX128F300NBCKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC297TX128F300NBCKXUMA2?
For technical support, including TC297TX128F300NBCKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC297TX128F300NBCKXUMA2 requirements.
6.How does Aetrix verify that TC297TX128F300NBCKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC297TX128F300NBCKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC297TX128F300NBCKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC297TX128F300NBCKXUMA2?
All TC297TX128F300NBCKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC297TX128F300NBCKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC297TX128F300NBCKXUMA2 part is unused and in its original packaging.
Return procedure for TC297TX128F300NBCKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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