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Home > Products > Integrated Circuits (ICs) > Embedded > Microcontrollers

Infineon Technologies TC297TX128F300SBCKXUMA1

Name: TC297TX128F300SBCKXUMA1
Brand: Infineon Technologies
SKU: TC297TX128F300SBCKXUMA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TC297TX128F300SBCKXUMA1

Manufacturer:: Infineon Technologies

Category:: Microcontrollers

Package:: 292-LFBGA

Datasheet:: TC297TX128F300SBCKXUMA1.pdf

Description:: IC MCU 32BIT 8MB FLASH 292LFBGA

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Product details

Overview

TC297TX128F300SBCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P CPU cores, lockstep shadow core for ASIL-D safety compliance, 8 MB ECC-protected program flash, 768 KB data flash for EEPROM emulation, and integrated 128-channel DMA. It targets automotive powertrain and chassis control systems requiring functional safety up to ISO 26262 ASIL-D.

For engineers reviewing the TC297TX128F300SBCKXUMA1 datasheet, TC297TX128F300SBCKXUMA1 pinout, TC297TX128F300SBCKXUMA1 application, or TC297TX128F300SBCKXUMA1 equivalent, key selection criteria include dual-core lockstep timing integrity, ERAY/ETH/ASCLIN interface coexistence, BGA292 package thermal performance, and flash ECC coverage for safety-critical code storage.

Technical Context

The TC297TX128F300SBCKXUMA1 implements a deterministic real-time architecture with two independent TriCore™ TC1.6P superscalar CPUs (300 MHz max), each with dedicated 120 KB DSPR and 16 KB PSPR, plus a lockstepped shadow core for fault detection. Its SRI crossbar enables concurrent access across 64-bit bus masters including CPUs, DMA, and peripherals.

It integrates safety-critical subsystems: ERAY controller for deterministic automotive networking, Ethernet MAC (10/100 Mbit/s), 12x ASCLIN channels supporting LIN/UART/SPI, and dual VADC/DSADC converters with hardware post-processing. All embedded memories feature full ECC protection and are qualified for automotive temperature range (–40 °C to 150 °C).

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	Dual 32-bit TriCore™ TC1.6P @ up to 300 MHz; lockstep shadow core ensures ASIL-D fault detection in real time.
Memory	8 MB PFLASH + 768 KB DFLASH (EEPROM-emulation), all with SEC-DED ECC; 120 KB DSPR + 16 KB PSPR per core.
Package	BGA292 (15 × 15 mm, 0.8 mm pitch); supports automotive thermal dissipation up to 150 °C junction temperature.
Interface Peripherals	ERAY controller (2 channels), 10/100 Ethernet MAC, 12× ASCLIN, 2× VADC (24-ch), 2× DSADC (4-ch), QSPI, I²C, EBU.
Safety Features	Lockstep CPU monitoring, memory ECC, safe DMA, end-to-end CRC on peripheral data paths, and hardware-based error injection test support.
Operating Range	–40 °C to +150 °C ambient; qualified per AEC-Q100 Grade 0; supply: 3.3 V ±5 % (I/O), 1.3 V ±5 % (core).

Pinout & Package

TC297TX128F300SBCKXUMA1 uses the BGA292 package (15 mm × 15 mm, 0.8 mm pitch) with 292 solder balls arranged in a 17 × 17 array excluding corner pads. Thermal pad exposed on underside for PCB heat transfer.

Pin/Terminal	Circuit Role	Design Meaning
VDDP_1.3V	Core Power Supply	Supplies 1.3 V ±5 % to CPU cores and internal logic; requires low-noise decoupling near package.
VDDIO_3.3V	I/O Power Supply	Supplies 3.3 V ±5 % to GPIO, ASCLIN, ETH, and peripheral I/O banks; supports 5 V-tolerant inputs on select pins.
OSC_IN / OSC_OUT	Crystal Oscillator Interface	Accepts 20 MHz external crystal; feeds main PLL and backup clock domain; supports fail-safe clock switching.
ERAY_TXD0 / ERAY_RXD0	ERAY Channel 0 Data	Differential pair for deterministic automotive time-triggered network; complies with FlexRay v2.1 physical layer.
ETH_MDIO / ETH_MDC	Ethernet Management Interface	Provides IEEE 802.3-compliant MDIO/MDC access to PHY registers; supports auto-negotiation and link status polling.
BOOT_MODE[1:0]	Boot Configuration	Two-pin strap selects boot source: internal flash, external SPI flash, or JTAG debug; sampled at power-on reset only.

Key Features

Feature	Design Value
TriCore™ Dual-Core Lockstep	Enables real-time ASIL-D compliance via cycle-accurate comparison of primary and shadow core outputs.
ECC-Protected Memory Subsystem	Full SEC-DED coverage on all PFLASH, DFLASH, SRAM, and cache - eliminates silent data corruption in safety-critical code/data.
ERAY Controller with Redundancy	Two independent ERAY channels with configurable time-triggered scheduling; supports dual-bus redundancy for fault-tolerant communication.
Hardware Safety Monitor (HSM)	Dedicated RISC-based safety core monitors CPU execution, memory integrity, and peripheral health - meets ISO 26262 FMEDA requirements.
Multi-Channel ASCLIN with LIN Support	12 ASCLIN modules configurable as UART/LIN/SPI; LIN mode includes automatic sync-break detection and checksum handling per ISO 17987.

Applications

Engine Control Unit (ECU)

Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection, and knock control under transient load conditions.

IC Role / Device Role / Timing Role: Primary compute engine executing ASIL-D control algorithms with sub-microsecond interrupt latency and deterministic instruction dispatch.

Use Value: Dual lockstep cores ensure fault-free torque calculation; ECC flash guarantees bootloader and calibration data integrity over 15+ year vehicle lifetime.

Use Scenario: High-bandwidth motor position feedback, torque assist computation, and fail-operational steering response.

IC Role / Device Role / Timing Role: Safety-critical host controller managing BLDC motor FOC, sensor fusion (resolver + CAN), and torque path monitoring.

Use Value: Integrated DSADC with hardware oversampling delivers 16-bit effective resolution for resolver angle decoding; ERAY synchronizes with brake ECU for coordinated stability intervention.

Brake Control Module (BCM)

Advanced Driver Assistance Systems (ADAS) Domain Controller

Use Scenario: Hydraulic pressure modulation, ABS/EBD actuation, and vehicle dynamics coordination via CAN/ERAY.

IC Role / Device Role / Timing Role: Real-time safety supervisor interfacing with hydraulic valves, wheel speed sensors, and yaw rate IMU via VADC/DSADC.

Use Value: Hardware CRC engines on ADC result chains prevent erroneous brake pressure commands; HSM validates control loop execution timing every 10 µs.

Use Scenario: Sensor preprocessing for radar/vision fusion, path planning, and V2X message routing in zonal architecture.

IC Role / Device Role / Timing Role: Deterministic edge node aggregating CAN FD, Ethernet, and LIN data while enforcing ASIL-B software partitioning.

Use Value: 10/100 Ethernet MAC enables OTA update delivery and diagnostic streaming; QSPI interface supports secure boot from external encrypted flash.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TC297TX128F300WBCKXUMA1	Same die, WLCSP package (236-ball); lower thermal resistance but no exposed thermal pad; not suitable for high-power chassis modules.	Targeted at compact ADAS camera modules where board space is constrained and peak power < 3.5 W.	Select when footprint size and reflow compatibility outweigh thermal management needs.
TC375LXQX128F300SACXUMA1	Newer AURIX™ TC3xx generation; triple TriCore™ cores (up to 300 MHz), 16 MB flash, enhanced HSM, and PCIe 2.0 root complex.	Required for next-gen central domain controllers needing multi-OS virtualization and high-throughput sensor aggregation.	Choose for new designs demanding higher compute density, PCIe connectivity, or extended safety lifecycle beyond 2028.

Compared with TC297TX128F300SBCKXUMA1, the WBCK variant trades thermal performance for miniaturization, while the TC375 offers generational upgrades in core count, memory, and interface bandwidth - making it appropriate for forward-looking architectures but over-specified for established ECU platforms.

Availability

TC297TX128F300SBCKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake control modules, and ADAS domain controllers requiring stable component supply across long automotive production cycles.

Supply support for TC297TX128F300SBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

This part belongs to the AURIX™ TC29x family - engineered specifically for ISO 26262 ASIL-D automotive applications including powertrain, chassis, and advanced driver assistance systems.

FAQ

What is the maximum operating junction temperature for TC297TX128F300SBCKXUMA1?

The device is qualified for operation up to +150 °C junction temperature per AEC-Q100 Grade 0. This rating is validated across voltage, frequency, and process corners using on-die temperature sensors and thermal characterization in the BGA292 package. Derating curves in Section 3.4 of the datasheet define safe operating area boundaries.

Does TC297TX128F300SBCKXUMA1 support secure boot from external QSPI flash?

Yes - the device implements hardware-accelerated AES-128 decryption and SHA-256 signature verification for external QSPI flash images. Boot ROM validates image authenticity and integrity before loading into internal RAM, with keys stored in protected OTP memory. Configuration is set via BOOT_MODE pins and protected configuration registers.

How many independent clock domains does the TC297TX128F300SBCKXUMA1 support?

It supports five independent clock domains: CPU core (PLL-derived), peripheral bus (SRI), ERAY, Ethernet, and low-power standby (backup oscillator). Each domain has dedicated gating, frequency dividers, and fail-safe monitoring - enabling selective clock shutdown and asynchronous domain crossing with handshake protocols.

Can the DSADC modules perform simultaneous sampling across multiple channels?

Yes - both DSADC units support hardware-synchronized sampling across up to four input channels per module using shared trigger sources (e.g., PWM edge, timer overflow). Each channel provides 16-bit resolution with configurable oversampling ratios (up to 128×), delivering effective 19-bit noise-free resolution for resolver or current sensing.

TC297TX128F300SBCKXUMA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Package/Case:: 292-LFBGA

Series:: AURIX™

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Core Processor:: TriCore™

Core Size:: 32-Bit Tri-Core

Speed:: 300MHz

Connectivity:: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT

Peripherals:: DMA, WDT

Number of I/O:: 169

Program Memory Size:: 8MB (8M x 8)

Program Memory Type:: FLASH

EEPROM Size:: 384K x 8

RAM Size:: 728K x 8

Voltage - Supply (Vcc/Vdd):: 3.3V, 5V

Data Converters:: A/D 84x12b, 10 x Sigma-Delta

Oscillator Type:: External

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

TC297TX128F300SBCKXUMA1 FAQ

1.How can I place an order for TC297TX128F300SBCKXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC297TX128F300SBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC297TX128F300SBCKXUMA1 reliable?

The price and inventory of TC297TX128F300SBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC297TX128F300SBCKXUMA1 is usually 5 days.

3.What payment methods are accepted for TC297TX128F300SBCKXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC297TX128F300SBCKXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC297TX128F300SBCKXUMA1?

TC297TX128F300SBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC297TX128F300SBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC297TX128F300SBCKXUMA1?

For technical support, including TC297TX128F300SBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC297TX128F300SBCKXUMA1 requirements.

6.How does Aetrix verify that TC297TX128F300SBCKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC297TX128F300SBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC297TX128F300SBCKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC297TX128F300SBCKXUMA1?

All TC297TX128F300SBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC297TX128F300SBCKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC297TX128F300SBCKXUMA1 part is unused and in its original packaging.

Return procedure for TC297TX128F300SBCKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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