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Infineon Technologies TC297TX128F300SBCKXUMA2
- Part No.:
- TC297TX128F300SBCKXUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC297TX128F300SBCKXUMA2.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,544
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Product details
Overview
TC297TX128F300SBCKXUMA2 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P super-scalar CPUs, 8 MB program flash (PFLASH), 768 KB data flash (DFLASH) for EEPROM emulation, and lockstep shadow core for ASIL-D safety compliance. It integrates 128-channel DMA, ECC-protected memories and buses, and supports automotive powertrain and chassis control systems.
For engineers reviewing the TC297TX128F300SBCKXUMA2 datasheet, TC297TX128F300SBCKXUMA2 pinout, TC297TX128F300SBCKXUMA2 application, or TC297TX128F300SBCKXUMA2 equivalent, key selection criteria include dual-core real-time performance, functional safety architecture (ISO 26262 ASIL-D), on-chip flash endurance for over-the-air updates, and BGA292 package compatibility with automotive ECU thermal and layout constraints.
Technical Context
The TC297TX128F300SBCKXUMA2 implements a dual-core TriCore™ TC1.6P architecture with lockstep monitoring of Core 1, enabling hardware-level fault detection per ISO 26262 requirements. Its SRI crossbar interconnect provides 64-bit parallel bus arbitration between two CPUs, DMA, and memory subsystems.
It includes dedicated safety mechanisms: ECC on all SRAM/Flash, error-correcting memory controllers, safe DMA with address/data integrity checking, and configurable emergency stop (ESTOP) functionality tied to external safety signals. The device operates across −40 °C to 125 °C with supply voltages of 5 V and 3.3 V switchable I/O pads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual 32-bit TriCore™ TC1.6P super-scalar cores, one in lockstep mode for ASIL-D compliance |
| Max Clock Frequency | 300 MHz at full industrial temperature range (−40 °C to 125 °C) |
| Embedded Memory | 8 MB PFLASH (ECC-protected), 768 KB DFLASH (EEPROM-emulation capable), 32 KB LMU |
| Safety Features | ECC on all memories and buses, lockstep CPU monitoring, ESTOP input, safe DMA with integrity checks |
| I/O Voltage Support | 5 V / 3.3 V switchable pads with configurable pull-up/pull-down reset behavior |
| Package | BGA292 (15 × 15 mm, 0.8 mm pitch), thermally enhanced for automotive under-hood use |
| Operating Temperature | −40 °C to +125 °C ambient, qualified per AEC-Q100 Grade 1 |
Pinout & Package
TC297TX128F300SBCKXUMA2 uses a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad and optimized ball map for signal integrity and thermal dissipation in automotive ECUs. Pin functions are defined per Section 2.3.1 of the BC-Step datasheet (V1.1, 2019-03).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | Main Power Supply | 5 V core supply for analog/peripheral domains; requires local decoupling per datasheet layout guidelines |
| VDD | Digital Core Supply | 3.3 V supply for CPU, SRI, and digital logic; monitored by internal voltage supervisor |
| ESTOP | Emergency Stop Input | Asynchronous, level-sensitive safety input triggering immediate CPU halt and peripheral freeze per ISO 26262 |
| TRSTN | JTAG Reset | Active-low debug interface reset; independent of system reset and safety state machine |
| ETH_MDIO | Ethernet Management Data | Open-drain bidirectional interface for PHY register access via IEEE 802.3 clause 22 |
| QSPI_CS0 | Quad SPI Chip Select 0 | Enables external flash or sensor interface in high-speed QSPI master mode (up to 80 MHz) |
Key Features
| Feature | Design Value |
|---|---|
| Dual TriCore™ CPUs with lockstep | Enables ASIL-D compliant real-time control without software-based redundancy overhead |
| 8 MB ECC-protected PFLASH | Supports dual-bank firmware update with atomic swap and runtime integrity verification |
| 128-channel safety DMA | Transfers sensor/actuator data with address/data CRC, channel-level error reporting, and stall-on-error |
| 64-bit SRI Crossbar | Eliminates bus contention between CPU cores, DMA, and peripherals for deterministic latency |
| ESTOP and Safe End-of-Scan | Hardware-enforced shutdown path meeting ISO 26262 Part 10 Annex D timing requirements |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions with lockstep CPU verification. Use Value: 300 MHz dual-core throughput enables simultaneous model-predictive control and diagnostics within 100 µs loop time. |
Use Scenario: Torque assist calculation, motor phase commutation, and steering angle feedback processing. IC Role / Device Role / Timing Role: Safety monitor and actuator driver controller interfacing with 3-phase inverter gate drivers and torque sensors. Use Value: Integrated ESTOP and safe DMA ensure fail-operational behavior during torque sensor fault or CAN timeout. |
| Brake-by-Wire System | Vehicle Domain Controller |
|
Use Scenario: Redundant hydraulic pressure modulation and wheel-speed-based ABS/EBD execution. IC Role / Device Role / Timing Role: Dual-core lockstep unit managing brake actuator PWM generation and cross-core consistency checking. Use Value: ECC-protected 768 KB DFLASH stores calibrated brake curves and enables field-updatable friction models. |
Use Scenario: Centralized vehicle network gateway aggregating CAN FD, LIN, and Ethernet (100BASE-T1) traffic. IC Role / Device Role / Timing Role: High-bandwidth domain processor running AUTOSAR Adaptive and Classic stacks concurrently. Use Value: QSPI and ETH interfaces support secure OTA update delivery while maintaining real-time CAN FD scheduling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297TX128F300SBCKXUMA1 | Same silicon, different mask revision (BC-Step vs. BB-Step); lacks updated ERAY_PLL jitter specs and minor DSADC calibration improvements | Not qualified for new designs requiring latest safety certification evidence per VDA 6.3 | Select only for legacy design continuity where requalification is prohibited |
| TC397XP-160F300WCKXUMA1 | Newer AURIX™ TC3xx generation with 300 MHz TC1.8P cores, 16 MB PFLASH, and integrated HSM for AES-128/GCM | Supports AUTOSAR SecOC and encrypted boot; higher power consumption (1.2 W typical vs. 0.95 W) | Choose when cryptographic acceleration, larger code space, or next-gen toolchain support is required |
Compared with TC297TX128F300SBCKXUMA2, the MA1 variant offers backward-compatible pinout but lacks updated safety documentation, while the TC397XP delivers cryptographic and memory scalability at the cost of higher thermal design complexity and toolchain migration effort.
Availability
TC297TX128F300SBCKXUMA2 is available at Aetrix Electronics and suitable for engine control units, electric power steering modules, and brake-by-wire systems requiring stable component supply, long-term automotive lifecycle support, and ASIL-D certified silicon.
Supply support for TC297TX128F300SBCKXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing facilities.
This part belongs to the AURIX™ TC29x family-designed specifically for ISO 26262-compliant automotive safety applications including powertrain, chassis, and advanced driver assistance systems (ADAS).
FAQ
What is the maximum junction temperature rating for TC297TX128F300SBCKXUMA2?
The device is rated for operation up to 150 °C junction temperature, validated per AEC-Q100 Grade 1 requirements (−40 °C to +125 °C ambient). Thermal design must maintain Tj ≤ 150 °C under worst-case power dissipation (0.95 W typical, 1.35 W peak) using the exposed thermal pad and recommended PCB copper area per datasheet Section 3.35.
Does TC297TX128F300SBCKXUMA2 support JTAG debugging in safety-critical modes?
Yes-it supports full JTAG debug via TRSTN and TDI/TDO pins even during lockstep operation, with dedicated debug access port (DAP) that isolates debug traffic from safety-critical execution paths. Debug entry is disabled during ESTOP assertion or when the safety monitor detects inconsistent CPU states.
How is EEPROM emulation implemented in the 768 KB DFLASH?
The DFLASH uses a wear-leveling algorithm managed by Infineon's Flash API (FEE) library, dividing memory into logical sectors with dynamic mapping. Each write cycle distributes erase operations across physical blocks to achieve >100,000 write/erase cycles per logical address, verified per ISO 26262 FMEDA analysis.
Can TC297TX128F300SBCKXUMA2 operate with only a 3.3 V supply?
No-the device requires both 5 V (VDDP) for analog/peripheral domains and 3.3 V (VDD) for digital core logic. The 5 V/3.3 V switchable I/O pads refer to voltage tolerance on GPIOs, not supply flexibility. Omitting VDDP violates absolute maximum ratings and causes functional failure.
TC297TX128F300SBCKXUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 768K x 8
- RAM Size:
- 728K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 94x12b SAR, Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC297TX128F300SBCKXUMA2 FAQ
1.How can I place an order for TC297TX128F300SBCKXUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC297TX128F300SBCKXUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC297TX128F300SBCKXUMA2 reliable?
The price and inventory of TC297TX128F300SBCKXUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC297TX128F300SBCKXUMA2 is usually 5 days.
3.What payment methods are accepted for TC297TX128F300SBCKXUMA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC297TX128F300SBCKXUMA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC297TX128F300SBCKXUMA2?
TC297TX128F300SBCKXUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC297TX128F300SBCKXUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC297TX128F300SBCKXUMA2?
For technical support, including TC297TX128F300SBCKXUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC297TX128F300SBCKXUMA2 requirements.
6.How does Aetrix verify that TC297TX128F300SBCKXUMA2 is sourced from the original manufacturer or authorized distributors?
All TC297TX128F300SBCKXUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC297TX128F300SBCKXUMA2 meets industry standards.
7.What is the process for return or replacement of TC297TX128F300SBCKXUMA2?
All TC297TX128F300SBCKXUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TC297TX128F300SBCKXUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC297TX128F300SBCKXUMA2 part is unused and in its original packaging.
Return procedure for TC297TX128F300SBCKXUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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