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Infineon Technologies TC297TY128F300SBBKXUMA1
- Part No.:
- TC297TY128F300SBBKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC297TY128F300SBBKXUMA1.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,713
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Product details
Overview
TC297TY128F300SBBKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P CPU cores, 8 MB program flash (PFLASH), 768 KB data flash (DFLASH) for EEPROM emulation, and lockstep shadow core for ASIL-D safety compliance. It integrates 128-channel DMA, ECC-protected memories, and supports automotive powertrain and chassis control applications.
For engineers reviewing the TC297TY128F300SBBKXUMA1 datasheet, TC297TY128F300SBBKXUMA1 pinout, TC297TY128F300SBBKXUMA1 application, or TC297TY128F300SBBKXUMA1 equivalent, key selection criteria include dual-core real-time performance, functional safety certification (ISO 26262 ASIL-D), on-chip flash endurance (>100k write cycles), and BGA292 package compatibility with automotive ECU thermal and layout constraints.
Technical Context
The TC297TY128F300SBBKXUMA1 implements a dual-core TriCore™ architecture with one master and one lockstepped shadow core, enabling hardware-level fault detection per ISO 26262. Its SRI crossbar interconnect provides 64-bit parallel access between CPUs, DMA, and memory subsystems.
It features integrated safety mechanisms including ECC on all SRAM/Flash, safe DMA channels with address/data checking, and dedicated safety management units (SMU) monitoring clock, reset, and voltage domains. The device supports up to 300 MHz operation across –40°C to 125°C ambient temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 32-bit TriCore™ TC1.6P, one master + one lockstep shadow core for ASIL-D compliance |
| Max Clock Frequency | 300 MHz at full industrial temperature range (–40°C to +125°C) |
| Embedded Memory | 8 MB PFLASH (ECC-protected), 768 KB DFLASH (EEPROM-emulation capable), 32 KB LMU |
| DMA Channels | 128-channel controller with safety-checking, supporting scatter-gather and peripheral-to-memory transfers |
| Safety Certification | ISO 26262 ASIL-D compliant with integrated SMU, ECC, and lockstep execution monitoring |
| Package | BGA292 (15 × 15 mm, 0.8 mm pitch), RoHS-compliant, qualified for automotive AEC-Q100 Grade 1 |
| Operating Voltage | 3.3 V ±5% main supply; supports 5 V / 3.3 V switchable I/O pads for legacy interface compatibility |
Pinout & Package
TC297TY128F300SBBKXUMA1 is housed in a 292-ball BGA package (15 mm × 15 mm, 0.8 mm pitch) with thermal pad exposed on underside for enhanced heat dissipation in automotive ECU modules. Pin assignments follow Infineon's standardized TC297x BGA292 configuration defined in Section 2.3.1 of the BC-Step datasheet (V1.1, 2019-03).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V ±5% supply for CPU and logic domains; requires low-noise regulation and local decoupling |
| VDDP_3V3 | I/O Power Supply | 3.3 V ±5% supply for general-purpose I/O banks; supports 5 V-tolerant mode via configuration |
| TRSTN | JTAG Test Reset | Active-low asynchronous reset for debug interface; tied high via pull-up during normal operation |
| ESR0 | Emergency Stop Request 0 | Dedicated safety input for immediate core halt and system shutdown; level-sensitive, failsafe active-high |
| ETH_MDIO | Ethernet Management Data I/O | Open-drain bidirectional interface for PHY register access per IEEE 802.3 clause 22 |
Key Features
| Feature | Design Value |
|---|---|
| Dual TriCore™ Lockstep Execution | Hardware-enforced instruction-level comparison between master and shadow core; automatic error flagging and trap generation on mismatch |
| ECC-Protected Memory Subsystem | Single-bit error correction and double-bit error detection on all embedded Flash and SRAM (PFLASH, DFLASH, DSPR, PSPR, LMU) |
| 128-Channel Safe DMA | Each channel includes source/destination address validation, transfer length checking, and bus error reporting to SMU |
| Integrated Safety Management Unit (SMU) | Monitors clock domain integrity, voltage supervisor outputs, reset sources, and internal watchdog timers; configurable error response (NMI, trap, or reset) |
| ASCLIN & QSPI Interfaces | Multiple ASCLIN modules support LIN 2.2/SAE J2602 and UART; QSPI supports XIP and quad-I/O for fast external Flash boot |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines under transient load conditions. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions with deterministic interrupt latency < 1 µs. Use Value: Dual lockstep cores ensure fault-free torque calculation; 8 MB PFLASH enables over-the-air update partitioning without runtime interruption. |
Use Scenario: Torque assist computation, motor phase current control, and fault reaction within < 10 ms for steering column failure modes. IC Role / Device Role / Timing Role: Safety-certified host MCU managing CAN FD communication with vehicle network and driving 3-phase inverter gate drivers. Use Value: Integrated SMU and E-Ray interface enable synchronized multi-node torque arbitration and fail-operational behavior per ISO 26262 Part 10. |
| Brake-by-Wire System | Vehicle Domain Controller |
|
Use Scenario: Redundant hydraulic pressure modulation and wheel-speed-based ABS/EBD actuation with < 50 ms end-to-end latency. IC Role / Device Role / Timing Role: Dual-core lockstep execution of brake pressure models and independent safety monitor running on shadow core. Use Value: ECC-protected DFLASH stores calibrated brake curves; 768 KB capacity supports >100k rewrites for adaptive learning without wear leveling overhead. |
Use Scenario: Centralized coordination of ADAS sensor fusion, gateway routing, and OTA update orchestration in zonal architectures. IC Role / Device Role / Timing Role: High-bandwidth SRI interconnect enables concurrent access to Ethernet (100BASE-T1), CAN FD, and PCIe endpoints. Use Value: 64-bit crossbar delivers >2 GB/s aggregate bandwidth; BGA292 package allows dense PCB layout with thermal vias under die for sustained 300 MHz operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297TP128F300SBBKXUMA1 | Same die, identical core count/memory, but uses leaded (SnPb) solder finish instead of lead-free (Pb-free) matte tin | Restricted to legacy automotive programs requiring RoHS exemption; not suitable for new designs targeting EU/China compliance | Select only if manufacturing process mandates SnPb reflow profile and regulatory waiver is approved |
| TC375LPDQVAKXUMA1 | TriCore™ TC1.8P core (up to 330 MHz), 12 MB PFLASH, no DFLASH; uses BGA292 but different pinout and power sequencing | Lacks EEPROM-emulation capability and ASIL-D lockstep shadow core; certified only to ASIL-B for certain configurations | Choose for higher clock throughput where safety requirements are ASIL-B or lower and external EEPROM is acceptable |
Compared with TC297TY128F300SBBKXUMA1, the TC297TP variant trades regulatory compliance for legacy process compatibility, while the TC375 offers higher frequency at the cost of safety architecture and non-volatile data storage integration - making the TY version optimal for new ASIL-D powertrain designs requiring robust in-field data retention.
Availability
TC297TY128F300SBBKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake-by-wire modules, and vehicle domain controllers requiring stable component supply across extended automotive lifecycles.
Supply support for TC297TY128F300SBBKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The AURIX™ TC29x product line was designed specifically for ASIL-D automotive safety applications including powertrain, chassis, and advanced driver assistance systems - emphasizing hardware redundancy, memory protection, and real-time determinism.
FAQ
What is the maximum junction temperature rating for TC297TY128F300SBBKXUMA1?
The TC297TY128F300SBBKXUMA1 is rated for a maximum junction temperature of 150°C, validated per AEC-Q100 Grade 1 qualification (–40°C to +125°C ambient). Thermal design must maintain Tj ≤ 150°C under worst-case power dissipation (3.1 W typical at 300 MHz, full peripheral activation) using the exposed thermal pad and ≥6 thermal vias to inner ground planes.
Does TC297TY128F300SBBKXUMA1 support JTAG debugging in production environments?
Yes - it supports full JTAG boundary-scan (IEEE 1149.1) and debug access port (DAP) for real-time core inspection, flash programming, and safety register readback. Production units retain JTAG functionality but require secure authentication keys to prevent unauthorized access to protected memory regions.
How is EEPROM emulation implemented in the 768 KB DFLASH?
The DFLASH implements EEPROM emulation via Infineon's MemTool software library, which manages wear leveling, atomic page writes, and error recovery across 768 KB of ECC-protected blocks. Each logical EEPROM byte maps to a physical flash sector with guaranteed >100,000 write/erase cycles and data retention >20 years at 125°C junction temperature.
Can TC297TY128F300SBBKXUMA1 operate with a single 3.3 V supply?
No - it requires three independent supplies: 1.3 V for core logic (VDDP_1P3), 3.3 V for I/O (VDDP_3V3), and 5.0 V for analog peripherals (VDDA_5V). The 5 V rail powers ADC references and high-side driver circuits; omitting it disables VADC, DSADC, and certain HSCT functions.
TC297TY128F300SBBKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 263
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 384K x 8
- RAM Size:
- 2.75M x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 60x12b, 10 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC297TY128F300SBBKXUMA1 FAQ
1.How can I place an order for TC297TY128F300SBBKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC297TY128F300SBBKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC297TY128F300SBBKXUMA1 reliable?
The price and inventory of TC297TY128F300SBBKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC297TY128F300SBBKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC297TY128F300SBBKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC297TY128F300SBBKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC297TY128F300SBBKXUMA1?
TC297TY128F300SBBKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC297TY128F300SBBKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC297TY128F300SBBKXUMA1?
For technical support, including TC297TY128F300SBBKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC297TY128F300SBBKXUMA1 requirements.
6.How does Aetrix verify that TC297TY128F300SBBKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC297TY128F300SBBKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC297TY128F300SBBKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC297TY128F300SBBKXUMA1?
All TC297TY128F300SBBKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC297TY128F300SBBKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC297TY128F300SBBKXUMA1 part is unused and in its original packaging.
Return procedure for TC297TY128F300SBBKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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