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Infineon Technologies TC299T128F300SBCKXUMA1
- Part No.:
- TC299T128F300SBCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 516-LFBGA
- Datasheet:
-
TC299T128F300SBCKXUMA1.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 516LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,038
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Product details
Overview
TC299T128F300SBCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P CPU cores, 8 MB program flash (PFLASH), 768 KB data flash (DFLASH) for EEPROM emulation, and lockstep shadow core for ASIL-D functional safety compliance. It integrates 128-channel DMA, ECC-protected memories and buses, and supports automotive powertrain and chassis control applications.
For engineers reviewing the TC299T128F300SBCKXUMA1 datasheet, TC299T128F300SBCKXUMA1 pinout, TC299T128F300SBCKXUMA1 application, or TC299T128F300SBCKXUMA1 equivalent, key selection criteria include dual-core real-time performance, ISO 26262 ASIL-D support, on-chip flash endurance, BGA516 package thermal and routing constraints, and integrated Ethernet/ERAY/DSADC peripheral timing.
Technical Context
The TC299T128F300SBCKXUMA1 implements a dual-core TriCore™ architecture with one master and one lockstepped shadow CPU, both operating at up to 300 MHz across full industrial temperature range (–40 °C to +125 °C). Each core includes 120 KB DSPR, 32 KB PSPR, 16 KB ICACHE, and 8 KB DCACHE - all ECC-protected.
It features a 64-bit SRI crossbar interconnect, 128-channel safety-capable DMA, and integrated peripherals including Ethernet MAC (10/100 Mbit/s), ERAY controller, DSADC (12-bit, 1.5 MSps), VADC (12-bit, 1.25 MSps), and QSPI interface. All embedded flash and SRAM are protected by SEC-DED ECC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 32-bit TriCore™ TC1.6P, lockstep configuration for ASIL-D compliance |
| Max Clock Frequency | 300 MHz at full temperature range (–40 °C to +125 °C) |
| PFLASH Capacity | 8 MB with ECC protection and 100k write/erase cycles |
| DFLASH Capacity | 768 KB for EEPROM emulation with wear leveling support |
| RAM (DSPR+PSPR) | 120 KB + 32 KB per core, ECC-protected, low-latency scratchpad |
| Package | BGA516 (27 × 27 mm, 0.8 mm pitch), RoHS-compliant, lead-free |
| Functional Safety | ISO 26262 ASIL-D compliant with built-in self-test (LBIST/ABIST), ECC, and error signaling |
Pinout & Package
TC299T128F300SBCKXUMA1 uses a 516-ball BGA package (27 mm × 27 mm, 0.8 mm ball pitch) optimized for automotive ECU thermal dissipation and high-speed signal integrity. Ball map follows JEDEC MO-275AC standard with dedicated power/ground arrays and controlled impedance routing zones.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and L1 cache; requires tight regulation (±30 mV) and local decoupling |
| VDDP_3V3 | I/O Power Supply | 3.3 V supply for general-purpose I/Os and peripheral interfaces; supports 5 V-tolerant LVDSH/LVDSM pads |
| ETH_RXD[3:0] | Ethernet Receive Data | LVDS-compatible differential inputs for 100BASE-TX MII/RMII operation; internal termination enabled |
| ERAY_TXD / ERAY_RXD | E-Ray Transceiver Interface | Dedicated differential pairs for deterministic automotive time-triggered network (up to 10 Mbit/s) |
| DSADC0_CH0..7 | Digital Sigma-Delta ADC Inputs | Eight configurable analog inputs supporting 12-bit resolution, 1.5 MSps sampling, and oversampling noise reduction |
| TRAP_IN | Emergency Stop Input | Asynchronous, fail-safe input triggering immediate CPU halt and safe state activation per ISO 26262 requirements |
Key Features
| Feature | Design Value |
|---|---|
| Dual TriCore™ Lockstep Execution | Real-time fault detection via instruction-level comparison; automatic fail-safe transition on mismatch |
| ECC-Protected Memory Subsystem | SEC-DED correction on all PFLASH, DFLASH, DSPR, PSPR, and cache - eliminates silent data corruption |
| Integrated Ethernet MAC + PHY Interface | 10/100 Mbit/s MII/RMII support with hardware timestamping and IEEE 1588v2 compatibility |
| DSADC with Oversampling Engine | Configurable digital filter chain enabling >16-bit effective resolution for motor current sensing |
| Hardware Security Module (HSM) | ARM® Cortex®-M3-based secure co-processor with AES-128/256, SHA-256, and secure boot ROM |
| QSPI Boot Interface | Direct XIP execution from external quad-SPI flash; supports encrypted firmware loading and authentication |
Applications
| Electric Powertrain Control | Brake-by-Wire Systems |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive control in 400 V/800 V EV traction inverters. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ISO 26262 ASIL-D motor control algorithms with <1 µs interrupt latency. Use Value: Dual lockstep cores ensure fault detection within 2 clock cycles; DSADC oversampling enables precise phase current measurement without external amplifiers. |
Use Scenario: Redundant hydraulic pressure modulation and wheel slip control in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Master controller managing dual independent brake channels with synchronized ERAY communication to slave ECUs. Use Value: Integrated ERAY controller guarantees deterministic <5 µs jitter for time-triggered actuator commands; TRAP_IN pin enables hardware-level emergency stop assertion. |
| ADAS Domain Controller | Vehicle Gateway Module |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for Level 2+ automated driving functions. IC Role / Device Role / Timing Role: High-bandwidth data concentrator using QSPI and Ethernet interfaces to route time-synchronized sensor frames. Use Value: 64-bit SRI crossbar enables concurrent access to PFLASH, DFLASH, and DMA buffers; hardware timestamping ensures sub-microsecond sensor event correlation. |
Use Scenario: Central vehicle network gateway bridging CAN FD, LIN, Ethernet, and ERAY domains in zonal architectures. IC Role / Device Role / Timing Role: Protocol translation engine with hardware-accelerated message filtering, routing, and security enforcement. Use Value: Integrated HSM performs TLS 1.2 handshake and CAN FD frame encryption at line rate; Ethernet MAC supports VLAN tagging for domain isolation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297T128F300SBCKXUMA1 | Same dual-core TriCore™ architecture but BGA416 package (416 balls); reduced peripheral count (no Ethernet MAC, no DSADC) | Suitable for cost-sensitive chassis modules where ASIL-D is required but Ethernet/DSADC not needed | Select when board space and BOM cost constrain require smaller package and fewer high-precision analog resources |
| TC397QP200F300SBCXUMA1 | Successor generation with tri-core (2x TC1.6P + 1x Cortex-M7), 300 MHz, 16 MB PFLASH, and enhanced HSM (AES-GCM, RNG) | Targeted for next-gen ADAS and central compute platforms requiring higher throughput and cryptographic agility | Choose for new designs needing future-proof security, larger code footprint, and multi-domain processing scalability |
Compared with TC297T128F300SBCKXUMA1, this part adds Ethernet and DSADC for sensor-rich applications; compared with TC397QP200F300SBCXUMA1, it offers proven qualification and lower system cost but lacks tri-core flexibility and post-2022 security primitives.
Availability
TC299T128F300SBCKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, brake-by-wire systems, and ADAS domain controllers requiring stable component supply, long-term automotive lifecycle support, and ASIL-D certified silicon.
Supply support for TC299T128F300SBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC2xx family - engineered specifically for ISO 26262 ASIL-D automotive safety applications including powertrain, braking, steering, and advanced driver assistance systems.
FAQ
What is the maximum junction temperature rating for TC299T128F300SBCKXUMA1?
The device is qualified for operation up to +125 °C junction temperature, validated per AEC-Q100 Grade 1 requirements. Thermal design must maintain Tj ≤ 125 °C under worst-case ambient and power dissipation conditions, with recommended PCB copper pour and thermal vias beneath the BGA516 thermal pad.
Does TC299T128F300SBCKXUMA1 support JTAG debugging in production mode?
No - JTAG is disabled after secure boot completion and permanent lock bits are set. Debug access requires DAP (Debug Access Port) with SWD interface and authenticated debug session keys provisioned via HSM during manufacturing programming.
How is flash endurance managed for EEPROM emulation in DFLASH?
The 768 KB DFLASH supports EEPROM emulation via Infineon's Flash EEPROM Emulation Library (FEEL), which implements wear leveling, atomic page writes, and background garbage collection - achieving ≥1 million emulated write cycles per logical address.
Can the DSADC operate simultaneously with the VADC on TC299T128F300SBCKXUMA1?
Yes - DSADC and VADC operate independently with separate clock domains and trigger sources. Concurrent use is supported in hardware, enabling simultaneous high-resolution motor current sensing (DSADC) and battery voltage monitoring (VADC) without resource contention.
TC299T128F300SBCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 516-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 263
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 384K x 8
- RAM Size:
- 728K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 84x12b, 10 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC299T128F300SBCKXUMA1 FAQ
1.How can I place an order for TC299T128F300SBCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC299T128F300SBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC299T128F300SBCKXUMA1 reliable?
The price and inventory of TC299T128F300SBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC299T128F300SBCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC299T128F300SBCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC299T128F300SBCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC299T128F300SBCKXUMA1?
TC299T128F300SBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC299T128F300SBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC299T128F300SBCKXUMA1?
For technical support, including TC299T128F300SBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC299T128F300SBCKXUMA1 requirements.
6.How does Aetrix verify that TC299T128F300SBCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC299T128F300SBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC299T128F300SBCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC299T128F300SBCKXUMA1?
All TC299T128F300SBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC299T128F300SBCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC299T128F300SBCKXUMA1 part is unused and in its original packaging.
Return procedure for TC299T128F300SBCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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