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Infineon Technologies TC299TP128F300NBCKXUMA1
- Part No.:
- TC299TP128F300NBCKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 516-LFBGA
- Datasheet:
-
TC299TP128F300NBCKXUMA1.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 516LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,831
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Product details
Overview
TC299TP128F300NBCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P super-scalar CPUs, 8 MB program flash (PFLASH), 768 KB data flash (DFLASH) for EEPROM emulation, and lockstep shadow core for ASIL-D safety compliance. It integrates 128-channel DMA, ECC-protected memories, and supports automotive powertrain and chassis control systems.
For engineers reviewing the TC299TP128F300NBCKXUMA1 datasheet, TC299TP128F300NBCKXUMA1 pinout, TC299TP128F300NBCKXUMA1 application, or TC299TP128F300NBCKXUMA1 equivalent, key selection criteria include dual-core lockstep timing integrity, PFLASH/DFLASH endurance specs, BGA516 thermal-mechanical footprint, and ERAY/ETH interface coexistence in safety-critical ECU designs.
Technical Context
The TC299TP128F300NBCKXUMA1 implements two independent TriCore™ TC1.6P cores running at up to 300 MHz across full industrial temperature range (–40°C to +125°C), each with dedicated 120 KB DSPR and 16 KB PSPR, plus shared 64-bit SRI crossbar enabling concurrent CPU, DMA, and peripheral access. Core 1 operates in lockstep with its shadow for fault detection.
It embeds three domain-specific clock domains: a 200 MHz system clock (SYSCLK), a 100 MHz peripheral clock (PERCLK), and a 50 MHz Ethernet clock (ETHCLK), all derived from a configurable PLL with spread-spectrum modulation support. The ERAY_PLL provides deterministic 10 Mbps FlexRay timing with ±0.5% jitter tolerance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual 32-bit TriCore™ TC1.6P superscalar cores, one in lockstep mode for ISO 26262 ASIL-D compliance |
| Max Operating Frequency | 300 MHz at full temperature range (−40 °C to +125 °C), sustained via dynamic voltage/frequency scaling |
| Embedded Memory | 8 MB ECC-protected PFLASH (program flash), 768 KB ECC-protected DFLASH (data flash for EEPROM emulation) |
| On-chip RAM | 120 KB DSPR + 16 KB PSPR per core, plus 32 KB LMU local memory unit, all ECC-protected |
| Communication Interfaces | 2× FlexRay (ERAY), 1× 10/100 Mbit/s Ethernet (MII/RMII), 6× CAN FD, 4× ASC/ASCLIN, 2× QSPI, 2× I²C |
| Safety Features | Lockstep core monitoring, ECC on all SRAM/Flash, memory protection units (MPUs), safe DMA with address/data checking |
| Package | BGA516 (27 mm × 27 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3 (MSL3) |
Pinout & Package
TC299TP128F300NBCKXUMA1 uses a 516-ball BGA package (27 mm × 27 mm, 0.8 mm ball pitch) with thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood environments. Ball map follows JEDEC MO-275AB standard with defined power/ground distribution and signal grouping per functional domain.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | 1.3 V Core Power Supply | Supplies CPU cores, cache, and internal logic; requires low-noise regulation and ≥20 µF local ceramic decoupling |
| VDDP_3V3 | 3.3 V I/O Power Supply | Drives all general-purpose I/Os, ASC, QSPI, and I²C interfaces; supports 5 V-tolerant operation on select pins |
| OSC_IN / OSC_OUT | External Crystal Oscillator Interface | Accepts 10–40 MHz fundamental-mode crystal; enables precise clock generation for PLL and backup timing |
| ERAY_TXD0 / ERAY_RXD0 | FlexRay Channel 0 Transceiver Interface | Differential pair supporting 10 Mbps deterministic communication with built-in bus guardian and wake-up filtering |
| ETH_MDIO / ETH_MDC | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC signals for PHY register configuration and status polling |
| BOOT_MODE0 / BOOT_MODE1 | Boot Configuration Pins | Set at power-on reset to select boot source: PFLASH, DFLASH, or external memory via EBU interface |
Key Features
| Feature | Design Value |
|---|---|
| Dual TriCore™ Lockstep Execution | Enables real-time fault detection with <1 µs diagnostic latency for ASIL-D automotive safety goals |
| ECC-Protected Memory Subsystem | Single-bit error correction and double-bit error detection across all embedded Flash and SRAM blocks |
| Hardware Safety Manager (HSM) | Dedicated RISC-based safety core monitors CPU health, memory integrity, and clock domain consistency |
| Flexible Clock Generation Unit (CGU) | Configurable PLL with fractional divider, spread-spectrum modulation, and fail-safe clock switching |
| Peripheral Event Router (PER) | Programmable event matrix routing interrupts and DMA triggers between 128 sources and 64 destinations |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection sequencing, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary controller executing AUTOSAR-compliant MCAL stack with sub-1 µs interrupt latency for spark/fuel actuation. Use Value: Dual lockstep cores ensure functional safety compliance while 300 MHz throughput handles complex model-based control algorithms. |
Use Scenario: Torque assist calculation, motor position feedback processing, and fault response in steer-by-wire systems. IC Role / Device Role / Timing Role: Safety-critical host MCU managing torque vectoring, EPS motor control, and CAN FD communication with ADAS modules. Use Value: Integrated ERAY and CAN FD interfaces enable deterministic multi-bus coordination; DFLASH provides robust parameter storage for calibration data. |
| Brake Control Module (BCM) | Vehicle Domain Controller |
Use Scenario: ABS/EBD/ESC actuation logic with hydraulic pressure modulation and wheel speed fusion. IC Role / Device Role / Timing Role: ASIL-D-certified controller executing brake-by-wire safety routines with hardware watchdog supervision. Use Value: HSM and lockstep execution guarantee <100 ms fail-safe reaction time; ECC memory prevents silent data corruption in critical braking states. |
Use Scenario: Centralized vehicle computing node aggregating sensor data, orchestrating OTA updates, and managing Zonal E/E architecture. IC Role / Device Role / Timing Role: High-bandwidth domain processor interfacing with Ethernet AVB, multiple CAN FD clusters, and secure boot chain. Use Value: 8 MB PFLASH stores dual-application images; 10/100 Ethernet supports time-sensitive networking (TSN) for sensor fusion latency ≤100 µs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-integrity automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297TP128F300NBCKXUMA1 | Same dual-core TC1.6P architecture but in BGA416 package (23 mm × 23 mm); reduced I/O count (338 vs 424 usable pins) | Targeted at space-constrained ECUs where Ethernet and second FlexRay channel are not required | Select when board area is constrained and full TC299 I/O density is unnecessary |
| TC397XPV128F300NACXUMA1 | Successor AURIX™ TC3xx family with TriCore™ v1.8, higher 330 MHz frequency, 16 MB PFLASH, and integrated HSMv2 | Supports next-gen AUTOSAR Adaptive and zonal architecture with virtualization-ready MMU | Choose for new designs requiring extended lifecycle, enhanced security, or future-proof scalability |
Compared with TC297TP128F300NBCKXUMA1, this part delivers higher I/O density and dual FlexRay/Ethernet coexistence; versus TC397XPV128F300NACXUMA1, it offers proven qualification for legacy ASIL-D programs without migration overhead.
Availability
TC299TP128F300NBCKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake control modules, and vehicle domain controllers requiring stable component supply across extended automotive production lifecycles.
Supply support for TC299TP128F300NBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, headquartered in Munich.
This device belongs to the AURIX™ TC2xx product line, engineered specifically for ASIL-D automotive safety applications including powertrain, chassis, and advanced driver assistance systems (ADAS).
FAQ
What is the maximum junction temperature rating for TC299TP128F300NBCKXUMA1?
The device is qualified for operation up to +150 °C junction temperature, validated per AEC-Q100 Grade 0 requirements. Thermal design must maintain TJ ≤ 150 °C under worst-case ambient (125 °C) and power dissipation (up to 4.2 W typical in active mode), using the exposed thermal pad and recommended PCB copper pour layout.
Does TC299TP128F300NBCKXUMA1 support secure boot with cryptographic verification?
Yes - it implements hardware-accelerated SHA-256 and AES-128 engines within the Hardware Security Module (HSM), enabling authenticated secure boot from PFLASH using ECDSA-signed images. Boot ROM validates signature before loading application code into protected memory regions.
Can the on-chip DFLASH be used for runtime EEPROM emulation with wear leveling?
Yes - Infineon provides the DFlash Driver (DFLASH_DRV) software library compliant with AUTOSAR R4.3, supporting configurable erase/write cycles (≥100k cycles), atomic sector updates, and background wear leveling across the 768 KB DFLASH array without host CPU intervention.
Is the BGA516 package of TC299TP128F300NBCKXUMA1 compatible with standard reflow profiles?
Yes - it conforms to IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports lead-free reflow per IPC/JEDEC J-STD-020, with peak temperature ≤260 °C and time above liquidus (TAL) of 60–90 seconds. Pre-bake at 125 °C for 24 hours is required if exposed >168 hours at >60% RH.
TC299TP128F300NBCKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 516-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 263
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 384K x 8
- RAM Size:
- 728K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 84x12b, 10 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC299TP128F300NBCKXUMA1 FAQ
1.How can I place an order for TC299TP128F300NBCKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC299TP128F300NBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC299TP128F300NBCKXUMA1 reliable?
The price and inventory of TC299TP128F300NBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC299TP128F300NBCKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC299TP128F300NBCKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC299TP128F300NBCKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC299TP128F300NBCKXUMA1?
TC299TP128F300NBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC299TP128F300NBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC299TP128F300NBCKXUMA1?
For technical support, including TC299TP128F300NBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC299TP128F300NBCKXUMA1 requirements.
6.How does Aetrix verify that TC299TP128F300NBCKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC299TP128F300NBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC299TP128F300NBCKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC299TP128F300NBCKXUMA1?
All TC299TP128F300NBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC299TP128F300NBCKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC299TP128F300NBCKXUMA1 part is unused and in its original packaging.
Return procedure for TC299TP128F300NBCKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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