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Infineon Technologies TC299TP128F300SBCKXUMA1

Part No.:
TC299TP128F300SBCKXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
516-LFBGA
Datasheet:
AetrixTC299TP128F300SBCKXUMA1.pdf
Description:
IC MCU 32BIT 8MB FLASH 516LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,703

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Product details

Overview

TC299TP128F300SBCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P super-scalar CPUs, lockstep shadow core for ASIL-D safety compliance, 8 MB ECC-protected program flash, 768 KB data flash for EEPROM emulation, and integrated 128-channel DMA. It targets automotive powertrain and chassis control systems requiring functional safety up to ISO 26262 ASIL-D.

For engineers reviewing the TC299TP128F300SBCKXUMA1 datasheet, TC299TP128F300SBCKXUMA1 pinout, TC299TP128F300SBCKXUMA1 application, or TC299TP128F300SBCKXUMA1 equivalent, key selection criteria include dual-core lockstep timing integrity, ERAY/ETH/ASCLIN interface coexistence, BGA516 thermal-mechanical suitability for engine control units, and flash ECC coverage across PFLASH/DFLASH/LMU memory domains.

Technical Context

The TC299TP128F300SBCKXUMA1 implements a deterministic real-time architecture with two independent TC1.6P cores operating at up to 300 MHz across –40°C to 125°C, each backed by dedicated 120 KB DSPR and 16 KB PSPR SRAM, plus shared 8 KB ICACHE/DCACHE. Core 1 runs in lockstep with its shadow for fault detection.

Its on-chip memory subsystem includes 8 MB PFLASH with single-bit error correction and double-bit error detection (SECDED), 768 KB DFLASH configured for wear-leveling EEPROM emulation, and 32 KB LMU with parity protection. The 64-bit SRI crossbar enables concurrent CPU, DMA, and peripheral access without arbitration stalls.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Architecture Dual 32-bit TriCore™ TC1.6P superscalar cores + lockstepped shadow core for ASIL-D fault containment
Max Clock Frequency 300 MHz across full industrial temperature range (–40°C to +125°C), enabling deterministic <3.3 ns instruction cycle time
Flash Memory 8 MB program flash (PFLASH) with SECDED ECC; 768 KB data flash (DFLASH) supporting 100k write/erase cycles for EEPROM emulation
SRAM 120 KB per core DSPR + 16 KB PSPR + 32 KB LMU, all with ECC or parity protection for safety-critical data storage
Peripheral Interfaces ERAY high-speed automotive bus (20 Mbit/s), 10/100 Ethernet MAC (RMII/MII), 12x ASCLIN (UART/SPI), QSPI, I²C, and 2x SENT
Safety Features Lockstep core monitoring, memory ECC/parity, CPU self-tests (BIST), safe DMA with address/data checking, and emergency stop (ESTOP) signal support

Pinout & Package

TC299TP128F300SBCKXUMA1 uses a 516-ball BGA package (BGA516) with 0.8 mm ball pitch, designed for high-density automotive PCB layouts and thermal dissipation in engine control modules. Package dimensions are 27 mm × 27 mm × 1.2 mm (height).

Pin/Terminal Circuit Role Design Meaning
VDDP_1P3 1.3 V Core Power Supply Supplies CPU cores, cache, and SRI interconnect; requires low-noise regulation and local decoupling for timing stability
VDDP_3V3 3.3 V I/O and Peripheral Power Feeds ASCLIN, ETH, ERAY, and GPIO banks; supports 5 V-tolerant operation on select pins via internal clamping
OSC_IN / OSC_OUT External Crystal Oscillator Interface Accepts 10–40 MHz crystal for primary clock generation; drives internal PLLs including main system PLL and ERAY_PLL
ESTOP Emergency Stop Input Asynchronous, level-sensitive safety input that forces immediate CPU halt and peripheral freeze without software intervention
TRSTN JTAG Test Reset Active-low reset for debug interface; enables boundary scan and flash programming during development and production test

Key Features

Feature Design Value
Dual TriCore™ Lockstep Execution Core 1 and its shadow execute identical instructions synchronously; mismatch triggers ESTOP and fault flag-required for ASIL-D diagnostic coverage
ECC-Protected Memory Hierarchy All PFLASH, DFLASH, DSPR, PSPR, and LMU include hardware SECDED ECC, eliminating silent data corruption in safety-critical code and calibration data
ERAY High-Speed Automotive Bus Integrated ERAY controller supports 20 Mbit/s deterministic communication with built-in CRC, timestamping, and synchronization for X-by-Wire systems
Hardware Safety Monitor (HSM) Dedicated security co-processor handles cryptographic operations (AES-128, SHA-256) and secure boot verification, isolating critical functions from main cores
Flexible Clock Generation Four independent PLLs (main PLL, ERAY_PLL, ETH_PLL, backup PLL) enable domain-specific clock scaling and fail-safe clock source switching

Applications

Engine Control Unit (ECU) Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel engines.

IC Role / Device Role / Timing Role: Primary safety-certified controller executing AUTOSAR-compliant MCAL drivers and application SW with <100 µs interrupt latency.

Use Value: Dual lockstep cores ensure fault-free torque calculation under EMI stress; 8 MB PFLASH stores multiple calibration maps and OTA update partitions.

Use Scenario: Torque assist computation, motor phase current control, and steering angle feedback processing in column-assist EPS systems.

IC Role / Device Role / Timing Role: Real-time motor control unit running FOC algorithms at 20 kHz PWM frequency with synchronized ADC sampling.

Use Value: Integrated DSADC with 16-bit resolution and 10 MS/s sampling enables precise current sensing; ERAY interface coordinates with brake ECU for vehicle dynamics control.

Brake Control Module (BCM) Advanced Driver Assistance (ADAS) Domain Controller

Use Scenario: ABS, ESC, and AEB actuation logic requiring fail-operational behavior and redundant sensor fusion.

IC Role / Device Role / Timing Role: ASIL-D safety island managing hydraulic valve control, wheel speed decoding, and cross-domain CAN/ERAY messaging.

Use Value: ESTOP pin integration allows hardware-triggered brake pressure hold; 768 KB DFLASH stores lifetime brake pad wear logs with ECC-protected write cycles.

Use Scenario: Sensor preprocessing hub aggregating radar, camera, and ultrasonic inputs for path planning and object classification.

IC Role / Device Role / Timing Role: High-bandwidth data concentrator with QSPI-connected external Flash, ETH for camera streaming, and ASCLIN for radar SPI interfaces.

Use Value: 64-bit SRI crossbar sustains >2.5 GB/s memory bandwidth for multi-sensor buffer management; HSM secures OTA firmware updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TC297TP128F300SBCKXUMA1 BGA416 package (416 balls), reduced peripheral count: no Ethernet MAC, only 1x ERAY channel, 4 MB PFLASH Suitable for cost-sensitive chassis modules where Ethernet connectivity and dual ERAY are unnecessary Select when board space, BOM cost, and functional scope are constrained but ASIL-D lockstep execution remains mandatory
TC397XPV128F300SBDKXUMA1 Next-generation AURIX™ TC3xx family; 300 MHz TriCore™ v2.0, 16 MB PFLASH, 2 MB RAM, enhanced HSM with PKA Supports higher-complexity ADAS and zonal E/E architectures requiring larger code footprint and asymmetric crypto acceleration Choose for new designs targeting long-term roadmap alignment, extended lifecycle, and future-proof security requirements

Compared with TC297TP128F300SBCKXUMA1, this part adds Ethernet and second ERAY for distributed vehicle networks; versus TC397XPV128F300SBDKXUMA1, it offers proven BC-step qualification and lower entry cost while retaining full ASIL-D capability for established powertrain platforms.

Availability

TC299TP128F300SBCKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake control modules, and ADAS domain controllers requiring stable component supply, long-term automotive qualification, and ISO 26262-compliant traceability.

Supply support for TC299TP128F300SBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.

This device belongs to the AURIX™ TC29x family-designed specifically for ISO 26262 ASIL-D automotive applications such as powertrain, chassis, and advanced driver assistance systems, emphasizing functional safety, real-time determinism, and robust EMI resilience.

FAQ

What is the maximum junction temperature rating for TC299TP128F300SBCKXUMA1?

The device is qualified for operation up to +125°C junction temperature, validated per AEC-Q100 Grade 1 requirements. Thermal design must maintain Tj ≤ 125°C under worst-case ambient, power dissipation, and PCB copper pour conditions-verified using the Ψjt parameter (1.8°C/W) from the datasheet's thermal characteristics table.

Does TC299TP128F300SBCKXUMA1 support JTAG-based flash programming in-system?

Yes-it supports full in-system programming via JTAG using the DAP interface, including PFLASH/DFLASH erase, program, and verify operations. TRSTN, TCK, TMS, TDI, and TDO pins implement IEEE 1149.1 compliance, and the embedded bootloader enables secure field updates without external programmers.

How is the Emergency Stop (ESTOP) function implemented electrically and logically?

ESTOP is an asynchronous, active-high input that directly gates CPU clock domains and freezes all peripheral state machines within one clock cycle. It does not require software polling or interrupt handling-assertion forces immediate core halt, disables all outputs, and asserts ESTOP_ACK to downstream safety monitors, meeting ISO 26262 hardware fault tolerance requirements.

Can the 768 KB DFLASH be used for both EEPROM emulation and secure key storage simultaneously?

Yes-DFLASH sectors can be partitioned: one region configured for wear-leveling EEPROM emulation (via HAL library), another locked under HSM control for AES key storage with read/write protection enforced by the embedded security monitor. Access isolation is hardware-enforced via memory protection units (MPUs) and HSM privilege gates.

TC299TP128F300SBCKXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
516-LFBGA
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, WDT
Number of I/O:
263
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
384K x 8
RAM Size:
2.75M x 8
Voltage - Supply (Vcc/Vdd):
3.3V, 5V
Data Converters:
A/D 84x12b, 10 x Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC299TP128F300SBCKXUMA1 FAQ

1.How can I place an order for TC299TP128F300SBCKXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC299TP128F300SBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC299TP128F300SBCKXUMA1 reliable?

The price and inventory of TC299TP128F300SBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC299TP128F300SBCKXUMA1 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC299TP128F300SBCKXUMA1 transactions.

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4.How is shipping managed for TC299TP128F300SBCKXUMA1?

TC299TP128F300SBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC299TP128F300SBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC299TP128F300SBCKXUMA1?

For technical support, including TC299TP128F300SBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC299TP128F300SBCKXUMA1 requirements.

6.How does Aetrix verify that TC299TP128F300SBCKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC299TP128F300SBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC299TP128F300SBCKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC299TP128F300SBCKXUMA1?

All TC299TP128F300SBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC299TP128F300SBCKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC299TP128F300SBCKXUMA1 part is unused and in its original packaging.

Return procedure for TC299TP128F300SBCKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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