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Infineon Technologies TC299TX128F300NBCKXUMA1

Part No.:
TC299TX128F300NBCKXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
516-LFBGA
Datasheet:
AetrixTC299TX128F300NBCKXUMA1.pdf
Description:
IC MCU 32BIT 8MB FLASH 516LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:500

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Product details

Overview

TC299TX128F300NBCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P CPU cores, lockstep shadow core for ASIL-D compliance, 8 MB program flash (PFLASH), 768 KB data flash (DFLASH) with EEPROM emulation, and integrated 128-channel DMA. It targets automotive safety-critical applications including electric powertrain control and ADAS domain controllers.

For engineers reviewing the TC299TX128F300NBCKXUMA1 datasheet, TC299TX128F300NBCKXUMA1 pinout, TC299TX128F300NBCKXUMA1 application, or TC299TX128F300NBCKXUMA1 equivalent, key selection criteria include ASIL-D functional safety certification, dual-core lockstep architecture, on-chip ECC-protected memory hierarchy, and support for Ethernet (10/100 Mbit/s), E-Ray, and multiple CAN FD interfaces.

Technical Context

The TC299TX128F300NBCKXUMA1 implements a deterministic real-time architecture with two independent TriCore™ TC1.6P superscalar CPUs operating at up to 300 MHz across full industrial temperature range (–40 °C to 125 °C), each backed by dedicated instruction/data scratchpad RAM (up to 32 KB PSPR + 120 KB DSPR), cache (16 KB ICACHE / 8 KB DCACHE), and hardware floating-point units. The lockstepped shadow core provides continuous comparison and error detection per instruction cycle.

Its memory subsystem includes 8 MB of embedded PFLASH with 128-bit wide access, 768 KB DFLASH with wear-leveling and EEPROM emulation capability, and ECC protection across all SRAM, Flash, and cache resources. Safety mechanisms include end-to-end data path protection, memory built-in self-test (MBIST), and configurable watchdog timers with separate clock domains.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Dual 32-bit TriCore™ TC1.6P superscalar cores @ 300 MHz; lockstep shadow core for ASIL-D fault containment.
Flash Memory 8 MB program flash (PFLASH) with 128-bit bus width; supports concurrent read/write and ECC correction.
Data Flash 768 KB data flash (DFLASH) with EEPROM emulation, wear leveling, and ECC protection.
RAM 120 KB data scratchpad RAM (DSPR) + 32 KB instruction scratchpad RAM (PSPR) per core; all ECC-protected.
Communication Interfaces 2× 10/100 Mbps Ethernet MACs, 6× CAN FD channels, 1× E-Ray controller, 4× ASC/UART, 2× QSPI, 2× I²C.
Safety Certification ISO 26262 ASIL-D compliant; includes safety mechanisms: lockstep, ECC, MBIST, safe DMA, and split voltage monitoring.
Package BGA516 (27 mm × 27 mm, 0.8 mm pitch); thermally enhanced for automotive under-hood operation.

Pinout & Package

BGA516 package (27 mm × 27 mm, 0.8 mm pitch) with thermal pad, qualified for automotive AEC-Q100 Grade 1 (–40 °C to +125 °C ambient). Pin functions defined per Infineon datasheet Section 2.1.1 (TC299x BGA516 Pin Configuration).

Pin/Terminal Circuit Role Design Meaning
VDDP_1P3 Core Power Supply 1.3 V supply for CPU cores and L1 cache; requires low-noise regulation and local decoupling.
VDDP_3V3 I/O & Peripheral Power 3.3 V supply for GPIO, communication peripherals, and ADC; supports 5 V-tolerant inputs on select pins.
OSC_IN / OSC_OUT Crystal Oscillator Interface Connects to external 20 MHz crystal; feeds main PLL and backup clock paths for fail-safe timing.
ETH_RXD0–3 / ETH_TXD0–3 Ethernet PHY Interface MII interface pins for 10/100 Mbps Ethernet; require controlled impedance routing and AC coupling.
ERAY_TxD / ERAY_RxD E-Ray Serial Bus Interface Dedicated differential pair for deterministic automotive time-triggered network (TTN) communication.

Key Features

Feature Design Value
Dual TriCore™ Lockstep Execution Real-time instruction-by-instruction comparison between primary and shadow core enables ASIL-D fault detection within one cycle.
End-to-End ECC Protection Full ECC coverage on PFLASH, DFLASH, DSPR, PSPR, caches, and SRI interconnect ensures data integrity in harsh environments.
Hardware Safety Manager (HSM) Dedicated safety co-processor monitors voltage, temperature, clock stability, and memory health; triggers safe state on violation.
Configurable 128-Channel DMA Supports scatter-gather, linked list, and channel chaining; enables zero-CPU-overhead data movement between peripherals and memory.
Multi-Protocol Communication Hub Integrated support for Ethernet (MII/RMII), E-Ray, CAN FD (6 channels), QSPI (2), and ASC/I²C enables centralized vehicle domain control.

Applications

Electric Powertrain Control ADAS Domain Controller

Use Scenario: Real-time torque vectoring and inverter gate drive sequencing in 400–800 V battery electric vehicles.

IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262-compliant motor control algorithms with <1 µs jitter on PWM outputs.

Use Value: Dual lockstep cores and hardware safety manager enable ASIL-D compliance without external safety monitor, reducing BOM cost and board area.

Use Scenario: Sensor fusion hub aggregating camera, radar, and ultrasonic inputs for Level 2+ automated driving functions.

IC Role / Device Role / Timing Role: Central domain controller managing time-synchronized data ingestion via E-Ray and Ethernet, with deterministic task scheduling.

Use Value: Integrated 10/100 Ethernet MACs and E-Ray controller eliminate need for external networking ASICs, lowering latency and system complexity.

Brake-by-Wire System Vehicle Gateway Module

Use Scenario: Redundant hydraulic pressure control with dual independent actuator drivers and cross-monitoring.

IC Role / Device Role / Timing Role: Safety-critical actuator controller with dual-lockstep execution, hardware watchdogs, and fail-safe output drivers.

Use Value: On-chip DFLASH with EEPROM emulation stores calibration data and fault logs with guaranteed write endurance >100k cycles.

Use Scenario: High-speed gateway bridging CAN FD, LIN, Ethernet, and FlexRay networks in zonal E/E architectures.

IC Role / Device Role / Timing Role: Protocol translation engine with hardware-accelerated message filtering, routing, and security offload.

Use Value: 6× CAN FD interfaces and dual Ethernet MACs support simultaneous high-bandwidth diagnostics and OTA update traffic without CPU saturation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TC297T128F300NACKXUMA1 Same core architecture but BGA416 package (416-pin vs 516-pin); reduced peripheral count (no second Ethernet MAC, fewer CAN FD channels). Targeted at cost-sensitive ASIL-B/C applications where full TC299 feature set is unnecessary. Select when footprint, thermal budget, or BOM cost constraints preclude BGA516; verify peripheral mapping against design requirements.
S32K344UAT0VLQY NXP S32K3 series ARM Cortex-R52 dual-core MCU; 320 MHz, 4 MB flash, ASIL-D certified, but lacks native E-Ray and has single Ethernet MAC. Preferred in designs requiring AUTOSAR Adaptive support or NXP ecosystem integration over TriCore toolchain dependencies. Choose when leveraging existing NXP software stack or requiring ARM-based functional safety partitioning; note different debug and flash programming infrastructure.

Compared with TC297T128F300NACKXUMA1, the TC299TX128F300NBCKXUMA1 delivers higher I/O density, dual Ethernet, and full E-Ray support for central domain control; versus S32K344, it offers superior deterministic real-time performance via TriCore architecture and native time-triggered networking, critical for safety-critical powertrain coordination.

Availability

TC299TX128F300NBCKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS domain controllers, brake-by-wire systems, and vehicle gateway modules requiring stable component supply across extended automotive lifecycles.

Supply support for TC299TX128F300NBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.

The AURIX™ TC29x product line was designed specifically for ISO 26262 ASIL-D automotive safety applications, emphasizing lockstep processing, memory safety, and deterministic real-time performance in powertrain and chassis control systems.

FAQ

What safety certifications does the TC299TX128F300NBCKXUMA1 hold?

The TC299TX128F300NBCKXUMA1 is certified to ISO 26262 ASIL-D at the device level, with supporting documentation including FMEDA reports, safety manuals, and hardware abstraction layer (HAL) libraries. It meets AEC-Q100 Grade 1 reliability requirements (–40 °C to +125 °C) and includes integrated safety mechanisms such as lockstep core checking, ECC on all memories, and hardware safety manager (HSM) monitoring.

Does this MCU support Ethernet Time-Sensitive Networking (TSN)?

No - the TC299TX128F300NBCKXUMA1 integrates standard 10/100 Mbps Ethernet MACs compliant with IEEE 802.3, but does not include TSN-specific features such as time-aware shapers, frame preemption, or scheduled traffic. Its Ethernet implementation supports AVB streaming and basic TCP/IP stacks, while deterministic timing is achieved via E-Ray and hardware timer synchronization.

Can the DFLASH be used for secure boot key storage?

Yes - the 768 KB DFLASH supports secure write-protection regions, hardware-based access control via the Memory Protection Unit (MPU), and ECC-protected storage. When combined with the Hardware Security Module (HSM) and boot ROM's verified boot flow, it enables tamper-resistant storage of cryptographic keys and firmware signature verification metadata.

What debug interface does the TC299TX128F300NBCKXUMA1 use?

The device uses a standardized JTAG/DAP interface compliant with ARM CoreSight, supporting multi-core debugging via Infineon's iLLD and DAVE™ toolchains. It includes SWD and JTAG transport modes, with dedicated debug access port (DAP) enabling non-intrusive trace capture, real-time variable inspection, and lockstep core visibility during development and validation.

TC299TX128F300NBCKXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
516-LFBGA
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, WDT
Number of I/O:
263
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
384K x 8
RAM Size:
728K x 8
Voltage - Supply (Vcc/Vdd):
3.3V, 5V
Data Converters:
A/D 84x12b, 10 x Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC299TX128F300NBCKXUMA1 FAQ

1.How can I place an order for TC299TX128F300NBCKXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC299TX128F300NBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC299TX128F300NBCKXUMA1 reliable?

The price and inventory of TC299TX128F300NBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC299TX128F300NBCKXUMA1 is usually 5 days.

3.What payment methods are accepted for TC299TX128F300NBCKXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC299TX128F300NBCKXUMA1 transactions.

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4.How is shipping managed for TC299TX128F300NBCKXUMA1?

TC299TX128F300NBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC299TX128F300NBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC299TX128F300NBCKXUMA1?

For technical support, including TC299TX128F300NBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC299TX128F300NBCKXUMA1 requirements.

6.How does Aetrix verify that TC299TX128F300NBCKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC299TX128F300NBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC299TX128F300NBCKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC299TX128F300NBCKXUMA1?

All TC299TX128F300NBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC299TX128F300NBCKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC299TX128F300NBCKXUMA1 part is unused and in its original packaging.

Return procedure for TC299TX128F300NBCKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC299TX128F300NBCKXUMA1 Tags

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