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Infineon Technologies TC299TX128F300SBBKXUMA1
- Part No.:
- TC299TX128F300SBBKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 516-LFBGA
- Datasheet:
-
TC299TX128F300SBBKXUMA1.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 516LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,713
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Product details
Overview
TC299TX128F300SBBKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P CPU cores, lockstep shadow core for ASIL-D compliance, 8 MB program flash (ECC-protected), 768 KB data flash for EEPROM emulation, and integrated 128-channel DMA. It targets automotive safety-critical applications including electric powertrain control and ADAS domain controllers.
For engineers reviewing the TC299TX128F300SBBKXUMA1 datasheet, TC299TX128F300SBBKXUMA1 pinout, TC299TX128F300SBBKXUMA1 application, or TC299TX128F300SBBKXUMA1 equivalent, key selection criteria include dual-core lockstep timing integrity, ASIL-D-certified safety mechanisms, BGA516 package thermal performance, and integrated Ethernet/ERAY/DSADC peripheral support for real-time vehicle networking and motor sensing.
Technical Context
The TC299TX128F300SBBKXUMA1 implements a deterministic dual-core TriCore architecture with one master and one lockstepped shadow core operating synchronously at up to 300 MHz across -40°C to 125°C ambient. Its SRI crossbar interconnect enables concurrent access to ECC-protected PFLASH, DFLASH, and SRAM resources by CPUs, DMA, and peripherals without arbitration delay.
It integrates safety-critical subsystems including SafeTcore™ lockstep monitoring, end-to-end CRC protection on DMA transfers, and hardware-assisted memory test (MBIST) for RAM and Flash. Peripheral sets include dual Ethernet MACs (10/100 Mbit/s), ERAY controller for deterministic automotive bus communication, and dual DSADC modules with 16-bit resolution and 2.5 MSPS sampling rate for motor current sensing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual 32-bit TriCore TC1.6P @ 300 MHz with lockstep shadow core for ASIL-D functional safety compliance |
| Flash Memory | 8 MB ECC-protected Program Flash (PFLASH) + 768 KB Data Flash (DFLASH) for EEPROM emulation |
| RAM | 32 KB LMU, up to 120 KB DSPR + 32 KB PSPR per core, all ECC-protected |
| Peripherals | Dual 10/100 Ethernet MACs, ERAY controller, 2× DSADC (16-bit, 2.5 MSPS), 128-channel DMA, QSPI, ASCLIN, I²C |
| Safety Features | SafeTcore™ lockstep monitoring, ECC on all memories, MBIST, end-to-end CRC on DMA, ISO 26262 ASIL-D ready |
| Package | BGA516 (27 mm × 27 mm, 0.8 mm pitch) with thermal pad for automotive under-hood thermal management |
| Operating Temp | -40°C to +125°C ambient, qualified per AEC-Q100 Grade 1 with extended life test coverage |
Pinout & Package
TC299TX128F300SBBKXUMA1 uses a 516-ball BGA package (27 mm × 27 mm, 0.8 mm pitch) with exposed thermal pad for high-power automotive operation. Pin functions are defined per Infineon's TC299x BGA516 pin configuration (Datasheet Section 2.1.1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU cores and L1 cache; requires low-noise regulation and local decoupling |
| VDDP_3V3 | I/O Power Supply | 3.3 V supply for general-purpose I/O banks; supports 5 V-tolerant pins via internal level shifters |
| ETH_RXD[3:0] | Ethernet Receive Data | MII/RMII interface pins for 10/100 Mbps Ethernet reception; require controlled impedance routing |
| ERAY_TX / ERAY_RX | ERAY Bus Interface | Differential transmit/receive pair for deterministic automotive E-Ray network communication (up to 20 Mbit/s) |
| DSADC0_AIN[7:0] | Digital Sigma-Delta ADC Input | Eight analog inputs for high-precision motor phase current sensing with 16-bit resolution and 2.5 MSPS aggregate rate |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core Architecture | Real-time fault detection via cycle-accurate comparison between master and shadow TC1.6P cores |
| ECC-Protected Memory Subsystem | Single-bit error correction and double-bit error detection on all embedded Flash and SRAM blocks |
| Integrated Safety Monitor (SafeTcore) | Hardware-based clock, reset, and memory integrity checking compliant with ISO 26262 Part 5 ASIL-D requirements |
| High-Speed DSADC with Over-Sampling | 2× DSADC modules supporting 16-bit effective resolution at 2.5 MSPS for precise motor current feedback |
| Automotive Network Integration | On-chip dual Ethernet MACs + ERAY controller enabling time-triggered communication in zonal E/E architectures |
Applications
| Electric Powertrain Inverter Control | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time torque vectoring and field-oriented control (FOC) of dual-motor EV inverters. IC Role / Device Role / Timing Role: Primary safety controller executing FOC algorithms, PWM generation, and fault response within ≤10 µs latency budget. Use Value: Lockstep dual-core execution ensures ASIL-D-compliant torque command validation while DSADC provides 16-bit current measurement for <±0.5% torque accuracy. |
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for Level 2+ automated driving. IC Role / Device Role / Timing Role: Central deterministic scheduler managing time-triggered Ethernet and ERAY message deadlines across multiple ECUs. Use Value: Dual Ethernet MACs enable synchronized sensor data streaming; ERAY guarantees sub-5 µs jitter for actuator command distribution. |
| Brake-by-Wire Actuator | Charging Onboard Unit (OBC) |
|
Use Scenario: Redundant electro-hydraulic brake pressure modulation with fail-operational capability. IC Role / Device Role / Timing Role: Safety-critical actuator controller performing dual-channel pressure loop control and diagnostic self-checks every 1 ms. Use Value: SafeTcore monitoring detects transient faults in <100 ns; ECC-protected DFLASH stores calibrated brake maps with EEPROM-like endurance. |
Use Scenario: Bidirectional AC/DC conversion control in 11 kW OBC systems with grid synchronization and isolation monitoring. IC Role / Device Role / Timing Role: High-precision digital controller managing PFC, DC-DC stages, and ISO 15118-compliant communication stack. Use Value: 300 MHz TriCore cores execute complex PLL-based grid sync algorithms; QSPI interfaces external secure boot flash for firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC297T128F300SBBKXUMA1 | Same dual-core TriCore architecture but BGA416 package (416 balls, 23 mm × 23 mm); reduced peripheral count (no second Ethernet MAC) | Targeted at cost-sensitive ADAS cameras or gateway ECUs where single Ethernet suffices and board space is constrained | Select when footprint reduction and lower I/O count are prioritized over dual-network redundancy |
| TC397XPV128F300SBJXUMA1 | Successor AURIX™ TC3xx family with tri-core (2× TC1.6P + 1× Cortex-M7), 300 MHz, 16 MB PFLASH, enhanced safety library certification | Required for next-gen zonal controllers needing higher compute density, AI acceleration, and ISO 21434 cybersecurity features | Select for new designs requiring extended lifecycle support beyond 2028 and certified security primitives |
Compared with TC297T128F300SBBKXUMA1, this part delivers dual Ethernet and larger memory for redundant powertrain control; versus TC397XPV128F300SBJXUMA1, it offers proven qualification for legacy platforms with lower software migration effort but lacks post-2025 cybersecurity certifications.
Availability
TC299TX128F300SBBKXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS domain controllers, brake-by-wire actuators, and onboard charging systems requiring stable component supply across extended automotive production lifecycles.
Supply support for TC299TX128F300SBBKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.
This device belongs to the AURIX™ TC29x family-designed specifically for ASIL-D automotive safety applications including electric drivetrain control, chassis systems, and autonomous driving domain controllers.
FAQ
What is the maximum junction temperature rating for TC299TX128F300SBBKXUMA1?
The device is rated for maximum junction temperature of +150°C, validated per AEC-Q100 Grade 1 stress testing. Thermal design must maintain Tj ≤ 150°C under worst-case ambient (125°C) and full CPU/peripheral load using the specified BGA516 thermal pad layout and PCB copper pour guidelines in Infineon's AN2017-07.
Does TC299TX128F300SBBKXUMA1 support JTAG debugging in production environments?
Yes-it supports full JTAG debug via dedicated TCK/TMS/TDI/TDO pins with boundary-scan capability and secure debug authentication. Production units can be debugged using standard TriCore-compatible tools (e.g., Lauterbach TRACE32), though debug access may be disabled via fuse programming after final firmware burn.
How is EEPROM emulation implemented in the 768 KB DFLASH?
Infineon's DFLASH implements EEPROM emulation using wear-leveling and atomic page-write algorithms stored in BootROM. Each DFLASH sector supports ≥100,000 write/erase cycles; data retention exceeds 10 years at 125°C. Application code accesses emulated EEPROM via standardized API calls (e.g., IfxFlash_Eeprom_write).
Can the DSADC modules operate simultaneously with full 16-bit resolution?
Yes-both DSADC modules can sample concurrently at 2.5 MSPS aggregate rate (1.25 MSPS each) while maintaining 16-bit effective resolution. This is achieved through independent sigma-delta modulators and decimation filters, with results accessible via DMA without CPU intervention.
TC299TX128F300SBBKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 516-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
- Peripherals:
- DMA, WDT
- Number of I/O:
- 263
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 384K x 8
- RAM Size:
- 728K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 84x12b, 10 x Sigma-Delta
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC299TX128F300SBBKXUMA1 FAQ
1.How can I place an order for TC299TX128F300SBBKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC299TX128F300SBBKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC299TX128F300SBBKXUMA1 reliable?
The price and inventory of TC299TX128F300SBBKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC299TX128F300SBBKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC299TX128F300SBBKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC299TX128F300SBBKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC299TX128F300SBBKXUMA1?
TC299TX128F300SBBKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC299TX128F300SBBKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC299TX128F300SBBKXUMA1?
For technical support, including TC299TX128F300SBBKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC299TX128F300SBBKXUMA1 requirements.
6.How does Aetrix verify that TC299TX128F300SBBKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC299TX128F300SBBKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC299TX128F300SBBKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC299TX128F300SBBKXUMA1?
All TC299TX128F300SBBKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC299TX128F300SBBKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC299TX128F300SBBKXUMA1 part is unused and in its original packaging.
Return procedure for TC299TX128F300SBBKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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