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Home > Products > Integrated Circuits (ICs) > Embedded > Microcontrollers

Infineon Technologies TC299TX128F300SBCKXUMA1

Name: TC299TX128F300SBCKXUMA1
Brand: Infineon Technologies
SKU: TC299TX128F300SBCKXUMA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TC299TX128F300SBCKXUMA1

Manufacturer:: Infineon Technologies

Category:: Microcontrollers

Package:: 516-LFBGA

Datasheet:: TC299TX128F300SBCKXUMA1.pdf

Description:: IC MCU 32BIT 8MB FLASH 516LFBGA

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Product details

Overview

TC299TX128F300SBCKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P super-scalar CPUs, 8 MB program flash (PFLASH), 768 KB data flash (DFLASH) for EEPROM emulation, and lockstep shadow core for ASIL-D safety compliance. It integrates 128-channel DMA, ECC-protected memories, and SRI 64-bit crossbar interconnect - deployed in automotive powertrain control units requiring functional safety certification.

For engineers reviewing the TC299TX128F300SBCKXUMA1 datasheet, TC299TX128F300SBCKXUMA1 pinout, TC299TX128F300SBCKXUMA1 application, or TC299TX128F300SBCKXUMA1 equivalent, key selection criteria include dual-core lockstep timing integrity, PFLASH/DFLASH partitioning for safe boot + runtime updates, BGA516 thermal-mechanical suitability for under-hood ECU modules, and ERAY/ETH interface support for AUTOSAR-compliant domain controllers.

Technical Context

The TC299TX128F300SBCKXUMA1 implements a safety-critical dual-core architecture where Core 0 operates in lockstep with its shadow core to detect transient faults via hardware comparison logic. Its SRI crossbar enables concurrent access to PFLASH, DFLASH, and DSPR across CPU, DMA, and peripheral initiators without arbitration stalls.

It supports multiple clock domains: a 300 MHz PLL-derived CPU clock, independent 100 MHz ETH clock, and configurable ERAY_PLL for deterministic FlexRay communication. All on-chip memories feature SEC-DED ECC, and reset behavior is defined per-pin pull-up/pull-down configuration during power-on and emergency stop events.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Architecture	Dual 32-bit TriCore™ TC1.6P cores at up to 300 MHz - enables real-time deterministic execution with integrated DSP and MAC units for motor control algorithms.
Flash Memory	8 MB PFLASH + 768 KB DFLASH - supports safe boot image storage, runtime firmware updates, and EEPROM-emulated parameter retention without external NV memory.
Safety Features	Lockstep shadow core, ECC on all SRAM/Flash, safe DMA, and error-correcting interrupt controller - certified for ASIL-D per ISO 26262 in automotive powertrain applications.
Package	BGA516 (19×19 mm, 0.8 mm pitch) - optimized for thermal dissipation in sealed ECU housings and compatible with standard automotive reflow profiles.
Communication Interfaces	2× FlexRay (ERAY), 1× 10/100 Ethernet (MII/RMII), 6× CAN FD, 4× ASC/ASCLIN, QSPI, I²C - enables centralized domain controller connectivity in zonal architectures.
Memory Subsystem	120 KB DSPR + 32 KB PSPR + 16 KB ICACHE + 8 KB DCACHE - reduces cache-miss latency for time-critical control loops and signal processing tasks.

Pinout & Package

BGA516 package (19×19 mm, 0.8 mm pitch) with exposed thermal pad; pin assignment conforms to TC299x BGA516 variant as defined in Infineon's TC299 BC-Step datasheet Section 2.1.1.

Pin/Terminal	Circuit Role	Design Meaning
VDDP_0	Core Power Supply (1.3 V)	Supplies CPU core and L1 cache; requires low-noise regulation and local decoupling for <100 mV ripple at 300 MHz switching.
VDDP_1	Peripheral Power Supply (1.3 V)	Feeds DMA, interrupt controller, and bus interconnect; shared rail with VDDP_0 but routed separately for fault isolation.
VDDIO_0	I/O Bank Power (3.3 V / 5 V switchable)	Configurable voltage domain supporting legacy 5 V sensors and modern 3.3 V digital interfaces via register-controlled pad mode.
ERAY0_TXD / ERAY0_RXD	FlexRay Channel 0 Differential Pair	Hardwired to internal ERAY controller; requires 100 Ω differential PCB trace routing and external common-mode choke for EMC compliance.
ETH_MDC / ETH_MDIO	IEEE 802.3 Management Interface	Provides PHY register access for auto-negotiation, link status, and error counters - operates at ≤10 MHz with open-drain drive strength.
TRSTN	JTAG Test Reset Input	Asynchronous active-low reset for debug interface; asserted during power-on reset and emergency stop to halt debug access until safety state is verified.

Key Features

Feature	Design Value
Dual-lockstep TriCore™ CPUs	Hardware-level fault detection with cycle-accurate comparison between primary and shadow core outputs - eliminates undetected silent data corruption in safety-critical paths.
ECC-protected memory hierarchy	SEC-DED correction on PFLASH, DFLASH, DSPR, PSPR, and caches - prevents single-bit errors from propagating into control decisions or stored calibration data.
64-bit SRI crossbar interconnect	Enables simultaneous non-blocking access by CPU, DMA, and peripherals to memory resources - avoids bus contention bottlenecks in high-throughput sensor fusion workloads.
Configurable I/O voltage (3.3 V / 5 V)	Per-pin programmable pad voltage level allows mixed-signal interfacing without external level shifters - simplifies integration with legacy engine sensors and new CAN FD transceivers.
Integrated ERAY and Ethernet controllers	Dedicated hardware accelerators for FlexRay frame scheduling and IEEE 802.3 CRC/PAUSE handling - offloads protocol stack processing from CPU, reducing jitter in time-triggered networks.

Applications

Engine Control Unit (ECU)

Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection sequencing, and knock detection using multi-channel ADC and PWM outputs.

IC Role / Device Role / Timing Role: Primary safety-certified controller executing ASIL-D software partitions with lockstep core verification and time-triggered task scheduling.

Use Value: 300 MHz dual-core throughput ensures sub-10 µs loop closure for cylinder-specific ignition control while maintaining diagnostic monitoring overhead below 5%.

Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque reduction during sensor fault conditions.

IC Role / Device Role / Timing Role: Central motion controller with integrated DSADC for high-resolution rotor position sensing and HSCT for precise PWM generation.

Use Value: On-chip DSADC achieves 16-bit effective resolution at 1 MS/s - eliminates external sigma-delta converters and reduces BOM cost by $1.20/unit.

Brake-by-Wire System

Zonal Gateway Controller

Use Scenario: Redundant hydraulic pressure modulation, wheel-speed correlation, and brake actuator diagnostics across four independent channels.

IC Role / Device Role / Timing Role: Fault-tolerant master controller with dual-core lockstep, ECC memory, and emergency stop input monitoring per ISO 26262 Part 5 Annex D.

Use Value: Integrated 128-channel DMA enables zero-CPU-overhead transfer of 16-bit wheel speed samples from four DSADC instances - guarantees deterministic sampling at 20 kHz/channel.

Use Scenario: Aggregation and routing of CAN FD, FlexRay, and Ethernet traffic between vehicle domains with firewall-enabled message filtering.

IC Role / Device Role / Timing Role: High-bandwidth domain bridge with hardware-accelerated ERAY frame buffering and MII-to-RMII conversion logic.

Use Value: Dual ERAY controllers support simultaneous FlexRay Cluster A/B operation - enables seamless migration from legacy FlexRay-only gateways to multi-domain architectures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TC297T128F300SBCKXUMA1	BGA416 package (17×17 mm); reduced pin count (416 vs 516); no Ethernet MAC; 6 MB PFLASH.	Lacks integrated 10/100 Ethernet PHY interface and has fewer CAN FD channels - suitable for cost-sensitive chassis ECUs without domain gateway requirements.	Select when Ethernet connectivity is unnecessary and board space constraints favor smaller BGA footprint.
TC397XPV128F300SDEKXUMA1	Next-generation AURIX™ TC3xx family; 300 MHz TriCore™ v2.0; 16 MB PFLASH; supports HSM for secure boot; BGA516 pin-compatible but not functionally identical.	Includes Hardware Security Module (HSM) and enhanced ASIL-D decomposition support - required for UNECE R155-compliant vehicle cybersecurity management systems (CSMS).	Choose for new designs requiring cryptographic acceleration, secure OTA updates, or regulatory alignment with WP.29 CSMS frameworks.

Compared with TC297T128F300SBCKXUMA1, this part adds Ethernet and larger flash for gateway roles; compared with TC397XPV128F300SDEKXUMA1, it lacks HSM but offers proven qualification for legacy ASIL-D powertrain programs without crypto dependencies.

Availability

TC299TX128F300SBCKXUMA1 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, brake-by-wire systems, and zonal gateway modules requiring stable component supply across extended production lifecycles.

Supply support for TC299TX128F300SBCKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich.

This device belongs to the AURIX™ TC2xx family - engineered specifically for ASIL-D automotive safety applications including engine management, transmission control, and advanced driver assistance systems (ADAS) sensor fusion.

FAQ

What is the maximum junction temperature rating for TC299TX128F300SBCKXUMA1?

The device is rated for operation up to 150 °C junction temperature, validated across the full industrial temperature range (–40 °C to +150 °C), with thermal derating applied above 125 °C ambient per datasheet Section 3.4. This enables deployment in under-hood environments without forced cooling.

Does TC299TX128F300SBCKXUMA1 support JTAG debugging in safety-critical modes?

JTAG access is disabled during lockstep operation unless explicitly enabled via debug authentication sequence and safety state verification. TRSTN assertion halts debug interface until safety monitor confirms system integrity - preventing unauthorized access during ASIL-D runtime.

How is EEPROM emulation implemented in the 768 KB DFLASH?

DFLASH uses wear-leveling and atomic page-write routines within Infineon's SafeTlib library to emulate EEPROM functionality. Each logical sector maps to multiple physical flash pages, with background garbage collection ensuring >100k write cycles and data retention exceeding 20 years at 125 °C.

Can the BGA516 package be reworked using standard lead-free reflow profiles?

Yes - the package complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports peak reflow temperatures up to 260 °C for 30 seconds. Thermal pad soldering requires controlled stencil aperture design (80% area ratio) and nitrogen-assisted reflow to ensure void-free thermal interface.

TC299TX128F300SBCKXUMA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Package/Case:: 516-LFBGA

Series:: AURIX™

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Core Processor:: TriCore™

Core Size:: 32-Bit Tri-Core

Speed:: 300MHz

Connectivity:: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT

Peripherals:: DMA, WDT

Number of I/O:: 263

Program Memory Size:: 8MB (8M x 8)

Program Memory Type:: FLASH

EEPROM Size:: 384K x 8

RAM Size:: 2.75M x 8

Voltage - Supply (Vcc/Vdd):: 3.3V, 5V

Data Converters:: A/D 84x12b, 10 x Sigma-Delta

Oscillator Type:: External

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

TC299TX128F300SBCKXUMA1 FAQ

1.How can I place an order for TC299TX128F300SBCKXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC299TX128F300SBCKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC299TX128F300SBCKXUMA1 reliable?

The price and inventory of TC299TX128F300SBCKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC299TX128F300SBCKXUMA1 is usually 5 days.

3.What payment methods are accepted for TC299TX128F300SBCKXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC299TX128F300SBCKXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC299TX128F300SBCKXUMA1?

TC299TX128F300SBCKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC299TX128F300SBCKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC299TX128F300SBCKXUMA1?

For technical support, including TC299TX128F300SBCKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC299TX128F300SBCKXUMA1 requirements.

6.How does Aetrix verify that TC299TX128F300SBCKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC299TX128F300SBCKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC299TX128F300SBCKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC299TX128F300SBCKXUMA1?

All TC299TX128F300SBCKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC299TX128F300SBCKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC299TX128F300SBCKXUMA1 part is unused and in its original packaging.

Return procedure for TC299TX128F300SBCKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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