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Infineon Technologies TC299TY128F300SBBKXUMA1

Part No.:
TC299TY128F300SBBKXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
516-LFBGA
Datasheet:
AetrixTC299TY128F300SBBKXUMA1.pdf
Description:
IC MCU 32BIT 8MB FLASH 516LFBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,162

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Product details

Overview

TC299TY128F300SBBKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring dual 300 MHz TC1.6P CPU cores, lockstep shadow core for ASIL-D compliance, 8 MB program flash (ECC-protected), 768 KB data flash for EEPROM emulation, and integrated 128-channel safety DMA. It targets automotive powertrain and chassis control systems requiring functional safety up to ISO 26262 ASIL-D.

For engineers reviewing the TC299TY128F300SBBKXUMA1 datasheet, TC299TY128F300SBBKXUMA1 pinout, TC299TY128F300SBBKXUMA1 application, or TC299TY128F300SBBKXUMA1 equivalent, key selection criteria include dual-core lockstep timing integrity, ERAY/ETH/ASCLIN interface coexistence, BGA516 thermal-mechanical suitability for engine control units, and flash ECC + SMU-based safety monitoring architecture.

Technical Context

The TC299TY128F300SBBKXUMA1 implements a deterministic real-time architecture with two independent TriCore™ TC1.6P CPUs operating at up to 300 MHz across full industrial temperature range (–40 °C to 150 °C), each backed by dedicated 120 KB DSPR and 16 KB PSPR RAM, plus shared SRI crossbar enabling concurrent memory/CPU access. Its safety subsystem includes SMU (Safety Management Unit), FSI (Fault Signaling Interface), and lockstep monitor with error injection capability.

It integrates multiple domain-specific peripherals: ERAY controller for deterministic automotive networking (up to 10 Mbps), 10/100 Ethernet MAC with MII/RMII support, 12x ASCLIN channels supporting LIN/UART/SPI, 4x SENT interfaces, and dual VADC/DSADC converters with 12-bit resolution and <1 µs conversion time - all accessible via hardware-protected memory-mapped registers with ECC on configuration space.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Dual 32-bit TriCore™ TC1.6P @ 300 MHz with lockstep shadow core for ASIL-D fault detection
Memory 8 MB ECC-protected PFLASH + 768 KB DFLASH (EEPROM-emulation capable) + 120 KB DSPR per core
Package BGA516 (27 × 27 mm, 0.8 mm pitch) with thermal pad; JEDEC MO-276AB compliant
Safety Features SMU, FSI, CPU lockstep monitor, memory ECC (SRAM/Flash), safe DMA, and end-to-end CRC protection on peripheral data paths
Peripherals ERAY (2 channels), ETH (10/100 Mbit/s), 12× ASCLIN, 4× SENT, 2× VADC (24-ch), 2× DSADC (4-ch), QSPI, EBU, MSC
Operating Temp –40 °C to +150 °C ambient; qualified per AEC-Q100 Grade 0 for under-hood automotive use
Supply Voltages 1.3 V core, 3.3 V I/O (5 V-tolerant on select pads), with internal EVR regulation and brown-out detection

Pinout & Package

BGA516 package (27 mm × 27 mm, 0.8 mm pitch) with exposed thermal pad; 516 solder balls arranged in 25 × 25 array with corner missing (A1/A25/Y1/Y25 omitted); RoHS-compliant matte tin finish; JEDEC MO-276AB registered outline.

Pin/Terminal Circuit Role Design Meaning
VDDP_1.3V (B2–B6, D1–D5, etc.) Core Power Supply Primary 1.3 V supply for CPU, cache, and logic; requires low-ESR ceramic decoupling within 3 mm
VDDIO_3.3V (G1–G10, J1–J10, etc.) I/O Power Supply 3.3 V supply for digital I/O banks; supports 5 V-tolerant operation on ASCLIN/SENT/ERAY pins
OSC_IN / OSC_OUT (T22 / T21) Crystal Oscillator Interface Connects to external 20–40 MHz fundamental-mode crystal; enables PLL clock generation for 300 MHz core
ERAY_TXD0 / ERAY_RXD0 (L18 / L19) ERAY Channel 0 Data Differential transmit/receive pair for deterministic automotive network; supports 10 Mbps with built-in termination
ETH_MDC / ETH_MDIO (U15 / U14) Ethernet Management IEEE 802.3 MDIO/MDC interface for PHY register access; operates at ≤ 2.5 MHz with open-drain pull-up
TRSTN / TCK / TMS / TDI / TDO (A12–A16) JTAG Debug Interface 5-pin boundary-scan interface supporting IEEE 1149.1; used for flash programming and runtime debugging

Key Features

Feature Design Value
Dual TriCore™ Lockstep Execution Hardware-enforced instruction-level comparison between primary and shadow core; automatic fail-safe shutdown on mismatch
ECC-Protected Memory Subsystem Single-bit error correction and double-bit error detection on all SRAM, Flash, and register file memory spaces
Integrated Safety Management Unit (SMU) Configurable safety monitor with watchdog timers, voltage/temperature sensors, and fault injection test mode per ISO 26262
ERAY Controller with Redundancy Support Two independent ERAY channels supporting time-triggered communication, frame redundancy, and error containment islands
High-Speed Analog Acquisition Dual VADC modules with 24 input channels, 12-bit resolution, <1 µs conversion time, and hardware trigger synchronization

Applications

Engine Control Unit (ECU) Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines under extreme thermal stress.

IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions with lockstep CPU verification and memory ECC.

Use Value: Enables deterministic sub-microsecond interrupt latency and fault-isolated execution domains for torque management and OBD-II diagnostics.

Use Scenario: Closed-loop motor torque control and assist-angle calculation in steer-by-wire systems with redundant sensing.

IC Role / Device Role / Timing Role: Dual-core coordination of motor control (primary core) and safety monitoring (shadow core) with synchronized PWM and ADC sampling.

Use Value: Achieves SIL3/ASIL-D compliance via hardware lockstep, safe DMA transfers, and ERAY-based sensor fusion with <50 µs jitter.

Brake Control Module (BCM) Advanced Driver Assistance Systems (ADAS) Domain Controller

Use Scenario: Hydraulic pressure modulation and ABS/ESC actuation with fail-operational redundancy requirements.

IC Role / Device Role / Timing Role: Safety island processor managing brake valve drivers, wheel speed decoding, and CAN/ERAY gateway functions.

Use Value: Delivers certified fault response time <10 ms using SMU-triggered safe state activation and hardware CRC-protected CAN message filtering.

Use Scenario: Sensor preprocessing and fusion for radar/vision-based collision avoidance and lane-keeping assist.

IC Role / Device Role / Timing Role: High-bandwidth data aggregator for multi-sensor inputs (SENT, ASCLIN, ETH) with time-synchronized timestamping.

Use Value: Supports deterministic 100 Mbps Ethernet backhaul and hardware-accelerated CRC offload for sensor data integrity validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integrity automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TC297TP128F300SBBKXUMA1 Same dual-core TriCore™ architecture but BGA416 package (smaller footprint, reduced peripheral count: no ETH, only 1 ERAY) Targeted at cost-sensitive chassis modules where Ethernet connectivity and dual ERAY are not required Select when board space is constrained and ASIL-D safety is needed without full TC299 peripheral set
TC397XPV128F300SBJXUMA1 Successor AURIX™ TC3xx family; 300 MHz TriCore™ v2.0, 16 MB PFLASH, enhanced SMU, and added HSM security module Required for new designs needing post-quantum crypto acceleration, secure boot, and extended lifecycle support beyond 2028 Choose for greenfield projects demanding long-term availability, HSM-based secure firmware updates, and higher memory density

Compared with TC297TP128F300SBBKXUMA1, this part adds Ethernet and dual ERAY for centralized vehicle networking; versus TC397XPV128F300SBJXUMA1, it lacks HSM and has lower flash capacity but offers mature qualification and broader toolchain support for legacy ECU platforms.

Availability

TC299TY128F300SBBKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake control modules, and ADAS domain controllers requiring stable component supply across automotive production lifecycles.

Supply support for TC299TY128F300SBBKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich with global R&D and manufacturing facilities.

This device belongs to the AURIX™ TC29x family-designed specifically for ISO 26262 ASIL-D automotive applications including powertrain, chassis, and advanced driver assistance systems, emphasizing functional safety, real-time determinism, and thermal robustness.

FAQ

What is the maximum junction temperature rating for TC299TY128F300SBBKXUMA1?

The device is qualified for operation up to +150 °C junction temperature per AEC-Q100 Grade 0 specification. Thermal design must maintain Tj ≤ 150 °C under worst-case power dissipation (3.2 W typical at 300 MHz, full peripheral activation), verified via θJA = 22 °C/W for standard 4-layer PCB with 1 oz copper and thermal vias under the BGA516 thermal pad.

Does TC299TY128F300SBBKXUMA1 support flash programming via JTAG?

Yes-it supports full flash programming, erase, and verification through standard JTAG (IEEE 1149.1) using Infineon's DAP interface and compatible debug probes (e.g., Lauterbach TRACE32, iSYSTEM winIDEA). The BROM bootloader enables field firmware updates via ASCLIN or ETH without requiring external programmer hardware.

How is the lockstep core monitored for fault detection?

Fault detection is performed continuously by the Lockstep Monitor Unit (LMU), which compares instruction fetches, ALU results, and register writes between primary and shadow cores cycle-by-cycle. Mismatches trigger immediate NMI, SMU fault signaling, and configurable safe state activation-including disabling PWM outputs and asserting FSI signals within ≤ 3 µs.

Can TC299TY128F300SBBKXUMA1 operate with a single 3.3 V supply?

No-it requires separate 1.3 V core supply (VDDP) and 3.3 V I/O supply (VDDIO). The internal EVR generates 1.3 V from an external 5 V or 3.3 V source, but direct 3.3 V application to VDDP violates absolute maximum ratings and will cause permanent damage. External 1.3 V regulation or EVR-enabled supply is mandatory.

TC299TY128F300SBBKXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
516-LFBGA
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals:
DMA, WDT
Number of I/O:
263
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
384K x 8
RAM Size:
728K x 8
Voltage - Supply (Vcc/Vdd):
3.3V, 5V
Data Converters:
A/D 84x12b, 10 x Sigma-Delta
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC299TY128F300SBBKXUMA1 FAQ

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Please submit a Request for Quotation (RFQ) for TC299TY128F300SBBKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of TC299TY128F300SBBKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC299TY128F300SBBKXUMA1 is usually 5 days.

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Once your TC299TY128F300SBBKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC299TY128F300SBBKXUMA1?

For technical support, including TC299TY128F300SBBKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC299TY128F300SBBKXUMA1 requirements.

6.How does Aetrix verify that TC299TY128F300SBBKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC299TY128F300SBBKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC299TY128F300SBBKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC299TY128F300SBBKXUMA1?

All TC299TY128F300SBBKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC299TY128F300SBBKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC299TY128F300SBBKXUMA1 part is unused and in its original packaging.

Return procedure for TC299TY128F300SBBKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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