Infineon Technologies TC322LP16F160FAAKXUMA1

Overview

TC322LP16F160FAAKXUMA1 from Infineon Technologies is a 32-bit automotive-grade TriCore microcontroller featuring a single TC1.6.2P CPU core operating up to 300 MHz, 2 MB program flash, 128 KB data flash (DFLASH), and ECC-protected SRAM including 192 KB DSPR and 8 KB PSPR. It integrates dual VADC clusters (16+28 channels), 2 MCMCAN modules (4 CAN nodes), 4 QSPI interfaces, and GTM timer subsystem for autonomous I/O control - deployed in engine control units and ADAS domain controllers.

For engineers reviewing the TC322LP16F160FAAKXUMA1 datasheet, TC322LP16F160FAAKXUMA1 pinout, TC322LP16F160FAAKXUMA1 application, or TC322LP16F160FAAKXUMA1 equivalent, key selection criteria include ASIL-D safety compliance, lockstep CPU architecture, integrated HSM option, 300 MHz real-time execution, and automotive-qualified AEC-Q100 Grade 1 operation (−40°C to +125°C).

Technical Context

The TC322LP16F160FAAKXUMA1 implements a lockstepped TriCore CPU pair (main + shadow) with hardware-level fault detection, supporting ISO 26262 ASIL-D decomposition. Its memory subsystem includes ECC-protected 2 MB PFLASH, 128 KB DFLASH for EEPROM emulation, and 192 KB DSPR optimized for real-time signal processing tasks.

Peripherals are safety-architected: dual MCMCAN modules support CAN FD at up to 5 Mbps with FIFO buffering; GTM provides autonomous PWM generation and SENT sensor interface; VADC supports simultaneous sampling across 16 primary + 28 secondary channels with configurable resolution and oversampling.

Key Specifications

Pinout & Package

LFBGA-180 package (12 mm × 12 mm, 0.8 mm pitch) with 180 solder balls; pin assignment validated per TC32x LFBGA-180 variant documentation (Section 2.2, Data Sheet V1.1).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with TC322LP16F160FAAKXUMA1, the TC332 variant adds architectural redundancy for stricter ASIL-D decomposition, while the TC324 extends thermal capability to 150°C - both retain identical peripheral sets, memory layout, and pin compatibility, enabling drop-in qualification reuse where environmental or safety requirements scale.

Availability

TC322LP16F160FAAKXUMA1 is available at Aetrix Electronics and suitable for engine control units, brake control modules, ADAS domain controllers, and electric power steering systems requiring stable component supply across automotive production lifecycles.

Supply support for TC322LP16F160FAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, headquartered in Munich.

This device belongs to the AURIX™ TC3xx family - engineered specifically for safety-critical automotive applications demanding ASIL-D compliance, real-time determinism, and functional safety certification support.

FAQ

What is the maximum operating temperature range for TC322LP16F160FAAKXUMA1?

The TC322LP16F160FAAKXUMA1 is qualified per AEC-Q100 Grade 1, supporting operation from −40°C to +125°C ambient temperature. Junction temperature limits are defined by thermal resistance (θ_JA = 28.5°C/W for LFBGA-180) and power dissipation - sustained 300 MHz operation requires active thermal management to maintain T_J ≤ 150°C.

Does TC322LP16F160FAAKXUMA1 include hardware cryptographic acceleration?

No - the base TC322LP16F160FAAKXUMA1 does not integrate a Hardware Security Module (HSM). Cryptographic functions must be implemented in software or via external secure elements. HSM functionality is available only on select variants such as TC33x series or TC32x parts with "H" suffix (e.g., TC322LP16F160FAAKXUMA1H).

Can the VADC perform simultaneous sampling across all 44 channels?

No - simultaneous sampling is limited to channels within the same VADC kernel. Each of the two VADC clusters supports up to 16 primary channels with synchronized sampling; secondary channels (28 total) are multiplexed and cannot be sampled concurrently with primary groups. True simultaneous acquisition requires cross-kernel triggering with <10 ns skew, verified in application note AP32267.

Is JTAG debugging supported on TC322LP16F160FAAKXUMA1?

Yes - the device supports IEEE 1149.1-compliant four-wire JTAG for boundary scan and CPU debug access. OCDS Level 1 debug features include real-time tracing, multi-core breakpoint control, and memory inspection. JTAG pins (TCK, TMS, TDI, TDO, TRSTN) are dedicated and electrically isolated from functional I/O.