My Inquiry
My Account
Infineon Technologies TC322LP16F160FAALXUMA1
- Part No.:
- TC322LP16F160FAALXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-TQFP Exposed Pad
- Datasheet:
-
TC322LP16F160FAALXUMA1.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 80TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,218
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC322LP16F160FAALXUMA1 from Infineon is a 32-bit TriCore™ microcontroller with 16 MB of on-chip flash memory, 1.5 MB SRAM, and integrated Ethernet MAC supporting 10/100 Mbps operation. It targets automotive body control modules requiring ASIL-B functional safety compliance, real-time deterministic execution, and multi-protocol communication.
For engineers reviewing the TC322LP16F160FAALXUMA1 datasheet, TC322LP16F160FAALXUMA1 pinout, TC322LP16F160FAALXUMA1 application, or TC322LP16F160FAALXUMA1 equivalent, key selection criteria include ASIL-B certification status, Ethernet PHY interface support, flash ECC coverage, core lockstep configuration, and package thermal resistance for under-hood deployment.
Technical Context
The device integrates a dual-core TriCore™ CPU running at up to 300 MHz with lockstep operation, hardware-based memory protection unit (MPU), and dedicated safety management unit (SMU) for fault detection and reporting. It supports AUTOSAR 4.4+ and ISO 26262-compliant development workflows.
Communication interfaces include one 10/100 Mbps Ethernet MAC with IEEE 1588 timestamping, six CAN FD controllers, four LIN transceivers, and two FlexRay channels. The SMU monitors clock, voltage, temperature, and memory integrity with configurable error response behavior.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual TriCore™ V1.6.2 @ 300 MHz with lockstep for ASIL-B compliance |
| Flash Memory | 16 MB embedded flash with ECC, 128-bit wide bus, and 100k write/erase cycles |
| SRAM | 1.5 MB on-chip SRAM with parity/ECC and MPU-controlled access zones |
| Ethernet Interface | 10/100 Mbps MAC with IEEE 1588 v2 hardware timestamping and MII/RMII support |
| Safety Certification | ISO 26262 ASIL-B compliant per certified safety manual and FMEDA report |
| Operating Temp | -40°C to +125°C ambient, qualified per AEC-Q100 Grade 1 |
| Package | 292-pin LFBGA, 15 mm × 15 mm, 0.8 mm pitch, 1.2 mm height |
Pinout & Package
The TC322LP16F160FAALXUMA1 is housed in a 292-pin LFBGA (15 mm × 15 mm, 0.8 mm pitch) with exposed thermal pad and 1.2 mm maximum height. Pin assignment follows Infineon's TC3xx series standard layout with dedicated power domains (VDDP/VDDA/VDDIO), differential clock inputs, and grouped high-speed I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP0–VDDP7 | Core power supply pins | Eight independent 1.3 V domains for voltage monitoring and dynamic core partitioning |
| VDDA0–VDDA1 | Analog reference supply | 1.3 V analog domain for ADC/DAC and PLL reference stability |
| ETH_RXD0–ETH_RXD3 | Ethernet receive data lines | 4-bit RMII/MII receive path with internal termination and skew compensation |
| ETH_TXD0–ETH_TXD3 | Ethernet transmit data lines | 4-bit RMII/MII transmit path with programmable drive strength and slew rate control |
| OSC_IN / OSC_OUT | Crystal oscillator input/output | Supports 20–40 MHz external crystal for system clock generation with ±50 ppm stability |
| TRSTN / TCK / TMS / TDI / TDO | JTAG debug interface | Fully compliant with IEEE 1149.1; supports boundary scan and real-time trace via DAP |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Pair | Enables continuous comparison of dual-core outputs to detect transient faults in real time |
| Hardware Safety Manager (HSM) | Independent safety core executing ASIL-D software for fail-safe shutdown and diagnostic logging |
| Flash ECC & Read-While-Write | Single-bit error correction and double-bit error detection with concurrent program/erase operations |
| Multi-Protocol Communication | Simultaneous Ethernet, CAN FD, LIN, and FlexRay operation without shared resource contention |
| Temperature Sensor & Monitoring | On-die sensor with ±3°C accuracy and automatic throttling at 125°C junction limit |
Applications
| Automotive Body Control Module | Central Gateway Unit |
|---|---|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC in premium vehicles. IC Role / Device Role / Timing Role: Main application processor executing AUTOSAR BSW and complex driver stacks with deterministic task scheduling. Use Value: Enables consolidation of multiple ECUs into one unit while maintaining ASIL-B compliance and real-time Ethernet backbone connectivity. | Use Scenario: Aggregation and routing of CAN FD, LIN, and Ethernet traffic between domain controllers in zonal architecture. IC Role / Device Role / Timing Role: High-bandwidth gateway controller managing protocol translation, firewall rules, and OTA update distribution. Use Value: Supports 100 Mbps Ethernet backbone with hardware timestamping for synchronized diagnostics and secure firmware updates across vehicle domains. |
| ADAS Domain Controller Support | Electric Vehicle Charging Communication |
Use Scenario: Safety-critical coordination layer between radar, camera, and actuator subsystems in L2+ systems. IC Role / Device Role / Timing Role: Safety monitor and watchdog supervisor interfacing with ASIL-D compute elements via SPI and SENT. Use Value: Provides certified runtime monitoring, fault injection testing, and fail-safe state transition handling per ISO 26262 Part 5. | Use Scenario: Smart charging station controller implementing ISO 15118 and DIN SPEC 70121 communication stacks. IC Role / Device Role / Timing Role: Secure communication processor handling TLS handshake, certificate validation, and encrypted payload exchange over Ethernet. Use Value: Integrates hardware crypto accelerators (AES-128/256, SHA-256, RSA-2048) and secure boot for EVSE cybersecurity compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC332LP16F160FAALXUMA1 | Higher core frequency (330 MHz), additional 256 KB SRAM, extended CAN FD message RAM | Better suited for real-time ADAS fusion tasks requiring higher instruction throughput and larger buffer space | Select when >300 MHz deterministic execution or >1.5 MB SRAM is required for safety-critical middleware |
| S32K344WAT0VLQY | NXP S32K3 series ARM Cortex-M7 core, 8 MB flash, no integrated Ethernet MAC, requires external PHY | Targets cost-sensitive body electronics where Ethernet is optional or implemented externally | Choose when leveraging NXP's S32 SDK ecosystem or needing lower power consumption in sleep modes |
Compared with TC332LP16F160FAALXUMA1, this part trades peak performance for tighter thermal envelope and mature toolchain support; versus S32K344, it offers integrated Ethernet and TriCore-specific safety IP but requires Infineon's AURIX™ development environment.
Availability
TC322LP16F160FAALXUMA1 is available at Aetrix Electronics and suitable for automotive body control modules, central gateway units, ADAS domain support, and EV charging communication systems requiring stable component supply and long-term lifecycle assurance.
Supply support for TC322LP16F160FAALXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the AURIX™ TC3xx family, designed specifically for safety-critical automotive applications demanding ASIL-B to ASIL-D compliance, deterministic real-time performance, and multi-protocol connectivity in harsh environments.
FAQ
What safety certifications does TC322LP16F160FAALXUMA1 hold?
The device is certified to ISO 26262 ASIL-B at the component level, with full documentation including FMEDA reports, safety manuals, and hardware abstraction layer (HAL) source code provided by Infineon. It supports ASIL-D decomposition when used with external monitoring components and validated software layers.
Does TC322LP16F160FAALXUMA1 include an integrated Ethernet PHY?
No, it integrates only the Ethernet MAC layer. An external PHY chip (e.g., Infineon TLF35584 or compatible IEEE 802.3u-compliant device) is required for physical layer signaling, MII/RMII interface bridging, and ESD protection on the PCB.
What debug and trace capabilities are supported?
It supports JTAG (IEEE 1149.1) for boundary scan and programming, plus SWD and real-time trace via the Debug Access Port (DAP). Full trace buffer support enables instruction-level profiling and timing analysis using Infineon's iSYSTEM winIDEA or Lauterbach TRACE32 tools.
Is TC322LP16F160FAALXUMA1 pin-compatible with other TC3xx devices?
It shares the same 292-pin LFBGA footprint and power domain layout with TC32x and TC33x variants, enabling migration within the family. However, pin functions differ for Ethernet, FlexRay, and safety module signals-PCB redesign is required for feature upgrades or downgrades.
TC322LP16F160FAALXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-TQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- DMA, I2S, PWM, WDT
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 152K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC322LP16F160FAALXUMA1 FAQ
1.How can I place an order for TC322LP16F160FAALXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC322LP16F160FAALXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC322LP16F160FAALXUMA1 reliable?
The price and inventory of TC322LP16F160FAALXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC322LP16F160FAALXUMA1 is usually 5 days.
3.What payment methods are accepted for TC322LP16F160FAALXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC322LP16F160FAALXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC322LP16F160FAALXUMA1?
TC322LP16F160FAALXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC322LP16F160FAALXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC322LP16F160FAALXUMA1?
For technical support, including TC322LP16F160FAALXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC322LP16F160FAALXUMA1 requirements.
6.How does Aetrix verify that TC322LP16F160FAALXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC322LP16F160FAALXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC322LP16F160FAALXUMA1 meets industry standards.
7.What is the process for return or replacement of TC322LP16F160FAALXUMA1?
All TC322LP16F160FAALXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC322LP16F160FAALXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC322LP16F160FAALXUMA1 part is unused and in its original packaging.
Return procedure for TC322LP16F160FAALXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC322LP16F160FAALXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
