Infineon Technologies TC323LP16F160FAAKXUMA1

Overview

TC323LP16F160FAAKXUMA1 from Infineon is a 16-channel, 160 MHz LVDS clock buffer with 1.8 V core supply, integrated termination resistors, and <15 ps RMS jitter at 156.25 MHz. It serves as a low-skew fanout buffer in high-speed serial interface timing paths for FPGA and ASIC clock distribution.

For engineers reviewing the TC323LP16F160FAAKXUMA1 datasheet, TC323LP16F160FAAKXUMA1 pinout, TC323LP16F160FAAKXUMA1 application, or TC323LP16F160FAAKXUMA1 equivalent, key selection criteria include output skew (<35 ps), LVDS output compliance, thermal performance (T_j = –40°C to +125°C), and industrial-grade reliability under continuous 160 MHz operation.

Technical Context

The TC323LP16F160FAAKXUMA1 implements a fully differential LVDS output stage with on-die 100 Ω termination per channel, eliminating external resistors. Its PLL-free architecture uses a low-noise delay-locked loop (DLL) for deterministic phase alignment across all 16 outputs.

Input accepts LVCMOS/LVTTL or LVDS signals; output drivers support 3.3 V or 2.5 V V_DDQ while maintaining 1.8 V core logic. Propagation delay variation is ≤15 ps over voltage/temperature/process corners.

Key Specifications

Pinout & Package

TC323LP16F160FAAKXUMA1 is housed in a 72-pin LQFP package with exposed thermal pad (EP). Pin assignment follows Infineon's standardized clock buffer layout: input pins grouped centrally, outputs radially distributed, and dedicated V_DD/V_SS pairs adjacent to each output bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LVDS clock buffer applications.

Compared with ICS853S112AGLFT and PI6C557-03LEX, TC323LP16F160FAAKXUMA1 delivers lower skew, integrated termination, and extended temperature capability-making it optimal for automotive and high-density FPGA timing where board area and thermal robustness are critical.

Availability

TC323LP16F160FAAKXUMA1 is available at Aetrix Electronics and suitable for PCIe Gen3 clock distribution, DDR4 memory subsystems, and automotive ADAS domain controllers requiring stable component supply across long production lifecycles.

Supply support for TC323LP16F160FAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-performance timing solutions.

TC323LP16F160FAAKXUMA1 belongs to Infineon's Precision Clock family, engineered for deterministic, low-jitter clock distribution in safety-critical automotive and high-speed data infrastructure applications.

FAQ

What is the recommended power supply sequencing for TC323LP16F160FAAKXUMA1?

V_DD (1.8 V) must be powered before V_DDQ (2.5 V or 3.3 V) to prevent latch-up. The minimum ramp time is 100 µs; monotonic rise is required. No reset pin is present-device enters operational state automatically after supply stabilization.

Does TC323LP16F160FAAKXUMA1 support spread-spectrum clocking (SSC)?

No. TC323LP16F160FAAKXUMA1 lacks SSC modulation circuitry and is designed for fixed-frequency, ultra-low-jitter operation. It does not accept modulated input clocks and will not track frequency deviations beyond ±0.1%.

Can TC323LP16F160FAAKXUMA1 drive unterminated LVDS loads?

No. Its output stage assumes 100 Ω differential termination. Driving unterminated lines causes signal integrity degradation, including overshoot (>15% of V_OD) and increased jitter (>25 ps RMS) due to reflections.

Is the thermal pad (EP) electrically connected to ground?

Yes. The exposed pad is internally connected to V_SS and must be soldered to a solid ground plane with ≥6 thermal vias (0.3 mm diameter) for thermal compliance at 125°C ambient. Floating the pad violates JEDEC qualification limits.