My Inquiry
My Account
Infineon Technologies TC332LP32F300FAAKXUMA1
- Part No.:
- TC332LP32F300FAAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-TQFP Exposed Pad
- Datasheet:
-
TC332LP32F300FAAKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 80TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,846
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC332LP32F300FAAKXUMA1 from Infineon is a 32-bit automotive microcontroller unit (MCU) based on the AURIX™ TC3xx family, featuring a TriCore™ CPU core running at 300 MHz, 4 MB of embedded flash memory, and ASIL-D functional safety compliance per ISO 26262. It integrates multiple CAN FD interfaces, Ethernet AVB, and hardware security modules for secure boot and cryptographic acceleration, targeting domain controller applications in ADAS and vehicle networking.
For engineers reviewing the TC332LP32F300FAAKXUMA1 datasheet, TC332LP32F300FAAKXUMA1 pinout, TC332LP32F300FAAKXUMA1 application, or TC332LP32F300FAAKXUMA1 equivalent, key selection criteria include ASIL-D certification status, dual-core lockstep configuration, flash ECC coverage, CAN FD channel count, and hardware-accelerated AES/SHA support.
Technical Context
The device implements a dual-core lockstep architecture with two TriCore™ CPUs operating at 300 MHz, each with 1.5 MB LFlash and 192 KB SRAM. It includes a Safety Management Unit (SMU) with dedicated safety monitors, memory built-in self-test (MBIST), and end-to-end data path protection via CRC and parity.
Peripheral integration includes six CAN FD controllers (with time-triggered communication support), one 100BASE-T1 Ethernet MAC with AVB stack offload, and a Hardware Security Module (HSM) supporting AES-128/256, SHA-256, RSA-2048, and ECDSA-256 for secure boot and key management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ dual-core lockstep @ 300 MHz - enables ASIL-D compliance through redundant execution and real-time comparison |
| Embedded Flash | 4 MB with ECC and read-while-write capability - supports safe over-the-air (OTA) updates without interrupting operation |
| SRAM | 1.5 MB with parity and ECC - provides fault-tolerant data storage for safety-critical variables |
| CAN FD Interfaces | 6 channels with bit rates up to 5 Mbit/s - meets high-bandwidth requirements for zonal E/E architectures |
| Ethernet Interface | 100BASE-T1 with AVB timestamping and hardware queue management - enables deterministic audio/video streaming and time-synchronized communication |
| HSM Support | AES-128/256, SHA-256, RSA-2048, ECDSA-256 - accelerates secure boot, firmware authentication, and secure key exchange |
Pinout & Package
TC332LP32F300FAAKXUMA1 is housed in a 292-pin LQFP package with 0.5 mm pitch, designed for automotive-grade thermal and mechanical reliability under extended temperature range (–40 °C to +125 °C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | Core power supply | 1.3 V ±3% supply for CPU and logic domains; requires low-noise regulation |
| VDDA | Analog reference supply | 3.3 V ±5% supply for ADC, DAC, and analog comparators |
| ETH_RXD0/1 | Ethernet receive data pair | Differential inputs for 100BASE-T1 PHY interface; require 100 Ω termination |
| CANFD0_TX/RX | CAN FD channel 0 differential I/O | High-speed transceiver interface compliant with ISO 11898-2:2013; supports 5 Mbit/s |
| HSM_SDA/SCL | HSM I²C interface | Secure I²C bus for host-to-HSM communication with hardware-enforced isolation |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Real-time instruction-level comparison ensures immediate fault detection for ASIL-D systems |
| Flash ECC with error correction | Single-bit error correction and double-bit error detection across full 4 MB flash array |
| Time-triggered communication support | Hardware-assisted scheduling for CAN FD and Ethernet AVB enables deterministic latency ≤ 10 µs |
| Hardware Security Module (HSM) | Isolated secure enclave with tamper-resistant key storage and crypto acceleration |
| Safety Management Unit (SMU) | Configurable safety monitors for clock, voltage, temperature, and memory integrity checks |
Applications
| ADAS Domain Controller | Central Gateway Module |
|---|---|
Use Scenario: Aggregating sensor data from radar, camera, and ultrasonic units while executing fusion algorithms and actuator control decisions. IC Role / Device Role / Timing Role: Primary compute node with lockstep CPU cores, hardware-accelerated sensor preprocessing, and time-synchronized CAN FD/Ethernet communication. Use Value: Enables ASIL-D compliant decision-making with <100 µs end-to-end latency for emergency braking commands. | Use Scenario: Bridging legacy CAN networks with next-gen Ethernet-based zonal architectures in software-defined vehicles. IC Role / Device Role / Timing Role: High-throughput routing engine with six CAN FD ports and 100BASE-T1 Ethernet, supporting time-aware shaping and AVB stream reservation. Use Value: Reduces gateway BOM count by consolidating protocol translation and firewall functions into a single safety-certified SoC. |
| Vehicle OTA Update Manager | Secure Bootloader Host |
Use Scenario: Managing authenticated, encrypted firmware updates across ECU clusters using UDS over CAN FD and DoIP over Ethernet. IC Role / Device Role / Timing Role: Secure update orchestrator with HSM-managed signature verification, flash programming, and rollback protection. Use Value: Guarantees zero-trust firmware integrity with hardware-enforced AES-GCM decryption and SHA-256 hash validation. | Use Scenario: Enforcing chain-of-trust during cold boot and reset sequences across all vehicle ECUs. IC Role / Device Role / Timing Role: Root-of-trust anchor implementing immutable secure boot with public-key verification and anti-rollback counters. Use Value: Prevents unauthorized firmware execution via hardware-locked HSM keys and write-protected boot ROM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC334LP32F300FAAKXUMA1 | Same die, but with 2 MB flash and reduced SRAM (768 KB); identical pinout and peripheral set | Suitable for cost-optimized ADAS sensors where full 4 MB flash is unnecessary | Select when flash density can be reduced without compromising OTA update partitioning or safety library footprint |
| S32G396A1MLT1VUCT | NXP S32G3 series; Arm Cortex-A53 + R52 cores; 8 GB eMMC support; no integrated HSM but supports external SE05x | Targeted at vehicle server gateways requiring Linux OS support and PCIe connectivity | Choose for heterogeneous compute needs involving virtualization, containerized services, or multi-OS environments |
Compared with TC334LP32F300FAAKXUMA1, this part offers higher flash density for complex safety stacks and larger OTA images; versus S32G396A1MLT1VUCT, it delivers tighter ASIL-D integration and lower power consumption in deterministic real-time control tasks.
Availability
TC332LP32F300FAAKXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, central gateway modules, and secure OTA update managers requiring stable component supply, long-term lifecycle assurance, and ASIL-D certified silicon.
Supply support for TC332LP32F300FAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D centers and automotive-grade wafer fabs.
This part belongs to the AURIX™ TC3xx product line, engineered specifically for safety-critical automotive applications including autonomous driving, electric powertrain control, and secure vehicle networking.
FAQ
What is the maximum operating temperature for TC332LP32F300FAAKXUMA1?
The device is qualified for operation from –40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements. Junction temperature limits are defined by thermal resistance (θJA = 28.5 °C/W) and power dissipation profiles in the datasheet's thermal section. Derating curves apply above 105 °C ambient.
Does TC332LP32F300FAAKXUMA1 support JTAG debugging?
Yes, it supports IEEE 1149.1 JTAG for boundary scan and debug access, plus Nexus Class 3+ interface for real-time trace and non-intrusive debugging. Debug access is configurable via DAP (Debug Access Port) and subject to security lock bits programmed in the HSM.
How many CAN FD channels does TC332LP32F300FAAKXUMA1 include?
The MCU integrates six independent CAN FD controllers, each supporting bit rates up to 5 Mbit/s, programmable data field lengths up to 64 bytes, and flexible timing configurations for both classic CAN and FD frames.
Is TC332LP32F300FAAKXUMA1 pin-compatible with other TC3xx devices?
No - it uses a unique 292-pin LQFP package layout optimized for its specific peripheral set and thermal profile. Pin compatibility exists only within the same package variant (e.g., TC332L vs. TC334L in 292-pin LQFP), but not across different flash/SRAM configurations or feature subsets.
TC332LP32F300FAAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-TQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 300MHz
- Connectivity:
- DMA, I2S, PWM, WDT
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 248K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC332LP32F300FAAKXUMA1 FAQ
1.How can I place an order for TC332LP32F300FAAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC332LP32F300FAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC332LP32F300FAAKXUMA1 reliable?
The price and inventory of TC332LP32F300FAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC332LP32F300FAAKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC332LP32F300FAAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC332LP32F300FAAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC332LP32F300FAAKXUMA1?
TC332LP32F300FAAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC332LP32F300FAAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC332LP32F300FAAKXUMA1?
For technical support, including TC332LP32F300FAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC332LP32F300FAAKXUMA1 requirements.
6.How does Aetrix verify that TC332LP32F300FAAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC332LP32F300FAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC332LP32F300FAAKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC332LP32F300FAAKXUMA1?
All TC332LP32F300FAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC332LP32F300FAAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC332LP32F300FAAKXUMA1 part is unused and in its original packaging.
Return procedure for TC332LP32F300FAAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC332LP32F300FAAKXUMA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
