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Infineon Technologies TC333LP32F200FAAKXUMA1
- Part No.:
- TC333LP32F200FAAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
TC333LP32F200FAAKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:999
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Product details
Overview
TC333LP32F200FAAKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with one TC1.6.2P CPU core, lockstepped safety monitor, 2 MB program flash, 128 KB data flash (DFLASH), and operation up to 300 MHz across -40°C to 125°C. It integrates dual VADC clusters, 2 MCMCAN modules (4 CAN nodes), E-Ray FlexRay v2.1, and GTM for autonomous I/O timing-designed for automotive powertrain and chassis control units.
For engineers reviewing the TC333LP32F200FAAKXUMA1 datasheet, TC333LP32F200FAAKXUMA1 pinout, TC333LP32F200FAAKXUMA1 application, or TC333LP32F200FAAKXUMA1 equivalent, key selection criteria include ASIL-D compliance readiness, integrated hardware security module (HSM) option, ECC-protected memory hierarchy, and deterministic real-time peripheral response via GTM and SENT interfaces.
Technical Context
The TC333LP32F200FAAKXUMA1 implements a lockstep TriCore™ TC1.6.2P architecture with full DSP capability, 2 MAC/cycle throughput, and pipelined FPU-enabling deterministic execution in safety-critical automotive firmware. Its memory subsystem includes 192 KB DSPR, 8 KB PSPR, 8 KB DLMU, 32 KB ICACHE, and 16 KB DCACHE, all ECC-protected.
Real-time I/O is managed by two GTM clusters running at 200 MHz, six SENT channels for sensor interfacing, dual MCMCAN modules supporting CAN FD, and an E-Ray FlexRay v2.1 controller with dual channels-providing time-triggered communication for distributed vehicle systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single TC1.6.2P TriCore™ with lockstepped shadow core for ASIL-D fault detection |
| Max Clock Frequency | 300 MHz across full industrial temperature range (−40 °C to +125 °C) |
| Memory | 2 MB PFLASH (ECC-protected), 128 KB DFLASH (DF0) for EEPROM emulation |
| VADC | Dual independent clusters, 16 primary + 28 secondary channels, 0–5.5 V input range |
| Communication | 2× MCMCAN (4 CAN nodes), 1× E-Ray FlexRay v2.1 (2 channels), 4× QSPI, 12× ASCLIN |
| Safety | ISO 26262 SEooC certified up to ASIL D; SMU, MTU, IOM, and optional HSM support |
| Package | LFBGA-292 (15 × 15 mm, 0.8 mm pitch), lead-free and RoHS-compliant |
Pinout & Package
LFBGA-292 package (15 mm × 15 mm, 0.8 mm ball pitch), thermally enhanced, with 292 solder balls arranged in 17 × 17 array excluding corner blanks. Pin mapping follows Infineon's LP feature package layout per DS section 2.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 | Core Power Supply | 1.25 V supply for CPU core and caches; requires low-noise regulation and local decoupling |
| VDDA_0 | Analog Supply | 5 V supply for VADC reference and analog front-end; isolated from digital domains |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Supports external 20–40 MHz crystal for system clock generation with internal PLL multiplication |
| TRSTN | JTAG Reset Input | Active-low asynchronous reset for debug interface; independent of system reset domain |
| ERAY_TXD0 / ERAY_RXD0 | FlexRay Channel 0 Data | Differential pair for time-triggered FlexRay communication; requires 120 Ω termination |
| SENT0–SENT5 | Sensor Signal Inputs | 6 dedicated SENT receivers for high-precision analog sensor digitization (e.g., pressure, temp) |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Hardware-enforced comparison between main and shadow cores ensures real-time fault detection for ASIL-D compliance |
| ECC-Protected Memory Hierarchy | All SRAM, flash, cache, and register files include single-bit error correction and double-bit error detection |
| GTM Timing Engine | Two independent GTM clusters (200 MHz) enable autonomous PWM generation, capture, and complex signal filtering without CPU load |
| MCMCAN with FIFO Buffering | Each of four CAN nodes supports configurable message RAM with hardware FIFOs for zero-latency reception in high-throughput networks |
| Hardware Security Module (HSM) | Optional on-chip HSM provides secure boot, cryptographic acceleration (AES-128/256, SHA-256), and key lifecycle management |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and knock detection in ICE powertrains. IC Role / Device Role / Timing Role: Primary controller executing ASW and BSW layers with deterministic interrupt latency under 1 µs. Use Value: Dual VADC clusters enable simultaneous sampling of 16+ analog sensors (MAP, TPS, O2); GTM manages ignition coil timing with sub-100 ns jitter. |
Use Scenario: Closed-loop torque assist, motor position sensing, and fail-safe torque limitation in steer-by-wire systems. IC Role / Device Role / Timing Role: Safety-critical host MCU coordinating motor control, CAN FD diagnostics, and ASIL-D monitoring functions. Use Value: Lockstep CPU and SMU detect transient faults; MCMCAN handles 500+ messages/sec across dual CAN FD buses for EPS and ADAS integration. |
| Brake Control Module (BCM) | Vehicle Domain Controller |
Use Scenario: ABS, ESC, and electronic parking brake actuation with functional safety enforcement. IC Role / Device Role / Timing Role: ISO 26262 SEooC-compliant controller managing hydraulic valve drivers and wheel speed acquisition. Use Value: E-Ray FlexRay v2.1 enables synchronized brake actuation across multiple ECUs with <1 µs jitter; SENT inputs directly interface with wheel speed sensors. |
Use Scenario: Centralized coordination of ADAS, infotainment, and body electronics via high-speed interconnects. IC Role / Device Role / Timing Role: High-bandwidth domain gateway with QSPI-connected external flash and ASCLIN-based LIN subnetwork bridging. Use Value: 2 MB PFLASH stores multi-application firmware images; 64-channel DMA enables concurrent data movement between GTM, CAN, and memory without CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC332LP32F200FAAKXUMA1 | Same LFBGA-292 package and TC1.6.2P core, but reduced PFLASH (1 MB) and no DFLASH | Suitable for cost-sensitive chassis modules where EEPROM emulation is not required | Select when flash footprint and BOM cost are prioritized over field-upgradeable data storage |
| TC377TP32F200FABKXUMA1 | Higher integration: dual-core TC1.6.2P, 4 MB PFLASH, 256 KB DFLASH, and extended GTM resources | Targeted at zonal controllers requiring multi-context scheduling and larger safety firmware partitions | Choose for next-gen domain controllers needing ASIL-D partitioning across two independent cores |
Compared with TC332LP32F200FAAKXUMA1, this part adds 1 MB PFLASH and 128 KB DFLASH for robust firmware versioning and EEPROM emulation-critical for OTA-capable powertrain ECUs. Versus TC377TP32F200FABKXUMA1, it trades dual-core scalability for lower thermal density and simpler qualification scope in single-domain applications.
Availability
TC333LP32F200FAAKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake control modules, and vehicle domain controllers requiring stable component supply under AEC-Q100 Grade 1 conditions.
Supply support for TC333LP32F200FAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with R&D centers across Europe, Asia, and the Americas.
This device belongs to the AURIX™ TC3xx family-designed specifically for ASIL-D automotive applications including powertrain, chassis, and advanced driver assistance systems (ADAS) with integrated safety and security features.
FAQ
What is the maximum operating temperature range for TC333LP32F200FAAKXUMA1?
The device is qualified for operation from −40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This rating applies to all core logic, memory, and peripheral blocks-including VADC, GTM, and MCMCAN-under continuous operation with specified voltage and cooling conditions.
Does TC333LP32F200FAAKXUMA1 include hardware cryptographic acceleration?
Yes-when configured with the optional Hardware Security Module (HSM), it supports AES-128/256 encryption/decryption, SHA-256 hashing, RSA-2048 signature verification, and secure key storage with tamper-resistant protection. The HSM operates independently of the main CPU and is accessible only via secure mailbox interfaces.
How many CAN FD interfaces does TC333LP32F200FAAKXUMA1 support?
The device integrates two MCMCAN modules, each supporting two CAN FD nodes-totaling four CAN FD interfaces. Each node features dedicated message RAM, hardware FIFOs, bit-rate switching, and CRC calculation, enabling concurrent high-speed communication at up to 5 Mbps on individual buses.
Is external crystal required for system clock generation?
Yes-an external crystal (20–40 MHz) is required on OSC_IN/OSC_OUT pins to drive the internal System PLL. The device does not include a factory-trimmed RC oscillator capable of meeting automotive timing accuracy requirements; crystal-based startup ensures ±50 ppm stability across temperature and voltage.
TC333LP32F200FAAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-TQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- DMA, I2S, PWM, WDT
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 248K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC333LP32F200FAAKXUMA1 FAQ
1.How can I place an order for TC333LP32F200FAAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC333LP32F200FAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC333LP32F200FAAKXUMA1 reliable?
The price and inventory of TC333LP32F200FAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC333LP32F200FAAKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC333LP32F200FAAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC333LP32F200FAAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC333LP32F200FAAKXUMA1?
TC333LP32F200FAAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC333LP32F200FAAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC333LP32F200FAAKXUMA1?
For technical support, including TC333LP32F200FAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC333LP32F200FAAKXUMA1 requirements.
6.How does Aetrix verify that TC333LP32F200FAAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC333LP32F200FAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC333LP32F200FAAKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC333LP32F200FAAKXUMA1?
All TC333LP32F200FAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC333LP32F200FAAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC333LP32F200FAAKXUMA1 part is unused and in its original packaging.
Return procedure for TC333LP32F200FAAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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