Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies TC333LP32F300FAAKXUMA1

Part No.:
TC333LP32F300FAAKXUMA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-TQFP Exposed Pad
Datasheet:
AetrixTC333LP32F300FAAKXUMA1.pdf
Description:
IC MCU 32BIT 2MB FLASH 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:979

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TC333LP32F300FAAKXUMA1 from Infineon Technologies is a 32-bit automotive-grade TriCore MCU with a single TC1.6.2P CPU core operating up to 300 MHz, 2 MB program flash, 192 KB DSPR RAM, and integrated safety features including lockstep shadow core, ECC-protected memories, and ISO 26262 ASIL-D compliance support for safety-critical powertrain and chassis control applications.

For engineers reviewing the TC333LP32F300FAAKXUMA1 datasheet, TC333LP32F300FAAKXUMA1 pinout, TC333LP32F300FAAKXUMA1 application, or TC333LP32F300FAAKXUMA1 equivalent, key selection criteria include real-time performance (300 MHz), on-chip safety architecture (SMU, MTU, IOM), dual CAN-FD + FlexRay connectivity, and AEC-Q100 qualification status.

Technical Context

This MCU implements a super-scalar TriCore architecture with fully pipelined FPU and dual MAC units sustaining 2 operations per cycle. It integrates a 64-channel DMA controller, ECC-protected SRI crossbar interconnect, and dual PLLs (SYS_PLL and PER_PLL) enabling independent clock domains for CPU and peripherals.

The device supports hardware LIN (ASCLIN), SENT sensor interface (6 channels), MCMCAN (4 nodes), and E-Ray FlexRay v2.1 - all with dedicated FIFO buffering and safety monitoring. Its memory subsystem includes boot ROM, 2 MB PFLASH with ECC, and 128 KB DFLASH for EEPROM emulation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreTriCore TC1.6.2P, 300 MHz max at full automotive temperature range (-40°C to 150°C)
Flash Memory2 MB program flash (PFLASH) with ECC protection for functional safety compliance
RAM192 KB data scratch-pad RAM (DSPR), 8 KB instruction scratch-pad RAM (PSPR), 8 KB DLMU
Safety FeaturesLockstep shadow core, SMU, MTU, IOM, and ISO 26262 ASIL-D Safety Element out of Context
Communication2 × MCMCAN (4 CAN FD nodes), 1 × FlexRay v2.1 (2 channels), 4 × QSPI, 12 × ASCLIN with LIN
Analog InterfaceVADC cluster with 2 kernels, 16 primary + 28 secondary channels, 0–5.5 V input range
PackageLFBGA-292, 12 × 12 mm, 0.8 mm pitch, lead-free and RoHS-compliant

Pinout & Package

LFBGA-292 package with 12 mm × 12 mm body size, 0.8 mm ball pitch, and standard JEDEC MO-277 compliant footprint. Designed for high-density automotive PCB layouts with thermal and mechanical reliability under extended temperature cycling.

Pin/TerminalCircuit RoleDesign Meaning
VDDPCore Power Supply1.25 V ±5 % supply for CPU and logic; requires low-noise regulation and local decoupling
VDDIOI/O Power Supply3.3 V or 5 V switchable supply for digital I/O banks; supports mixed-voltage interfacing
OSC_IN / OSC_OUTCrystal Oscillator InterfaceConnects to external 20–40 MHz crystal for system clock generation; internal oscillator not used in production
TRST, TCK, TMS, TDI, TDOJTAG Debug InterfaceIEEE 1149.1-compliant 5-wire boundary scan and debug access; supports OCDS Level 1
ERAY_TX0 / ERAY_RX0FlexRay Channel 0Differential transmit/receive pair for high-reliability time-triggered networking in chassis systems
CAN0_TX / CAN0_RXCAN FD Node 0High-speed CAN FD transceiver interface supporting up to 5 Mbit/s with CRC and error confinement

Key Features

FeatureDesign Value
TriCore TC1.6.2P CPU300 MHz real-time execution with dual MAC and pipelined FPU enables deterministic motor control loop closure ≤1 µs
ECC-Protected Memory SubsystemEnd-to-end ECC on PFLASH, DFLASH, SRAM, caches, and buses meets ASIL-D fault detection requirements
Hardware Security Module (HSM)Optional secure co-processor supporting AES-128/256, SHA-256, RSA-2048, and secure boot key management
Safety Management Unit (SMU)Centralized alarm routing and response coordination across CPU, memory, peripheral, and clock domains
On-Chip Debug SupportOCDS Level 1 with multi-core tracing, real-time calibration, and non-intrusive breakpoint insertion

Applications

Powertrain Control UnitElectric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection, and turbocharger actuation in ICE and hybrid powertrains.

IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions with lockstep CPU and SMU-monitored execution.

Use Value: 300 MHz TriCore core ensures sub-microsecond interrupt latency for spark/fuel event synchronization; ECC memory prevents silent data corruption in long-life engine control.

Use Scenario: Closed-loop torque assist, steering angle feedback, and fault-tolerant motor drive in column-assist EPS systems.

IC Role / Device Role / Timing Role: Main controller managing dual motor phases, SENT-based torque sensor inputs, and CAN FD communication with vehicle bus.

Use Value: Integrated 6-channel SENT interface eliminates external ADCs; GTM timers enable precise PWM generation for field-oriented motor control.

Brake-by-Wire SystemAdvanced Driver Assistance (ADAS) Domain Controller

Use Scenario: Redundant hydraulic pressure modulation and fail-operational braking response in electro-hydraulic brake systems.

IC Role / Device Role / Timing Role: Safety-certified controller running dual-channel brake actuation firmware with cross-monitoring via lockstep core.

Use Value: ISO 26262 ASIL-D Safety Element out of Context enables reuse in certified brake ECU designs without requalification of core IP.

Use Scenario: Sensor fusion preprocessing and actuator command arbitration between radar, camera, and ultrasonic subsystems.

IC Role / Device Role / Timing Role: Real-time preprocessor offloading time-critical tasks (e.g., CAN FD message filtering, timestamp alignment) from main ADAS SoC.

Use Value: 2 MB PFLASH and 192 KB DSPR support large LUTs and filter coefficients for Kalman-based object tracking; FlexRay interface synchronizes with central domain controller.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integrity automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TC332LP32F300FAAKXUMA1Same die, reduced feature set: no HSM, only 1 MB PFLASH, no DFLASH, 128 KB DSPRTargeted at cost-sensitive ASIL-B applications like HVAC or lighting control where crypto and EEPROM emulation are unnecessarySelect when full ASIL-D safety features and 2 MB flash are not required to reduce BOM cost
S32K344WAT0MLHTNXP S32K3 series ARM Cortex-M7, 320 MHz, 4 MB flash, ASIL-D certified, but lacks FlexRay and native SENTPreferred for new ARM-based ADAS gateway designs requiring Ethernet AVB but no legacy FlexRay/Sent sensor integrationChoose for ARM ecosystem compatibility and Ethernet readiness; avoid if FlexRay or SENT sensor support is mandatory

Compared with TC332LP32F300FAAKXUMA1, this part adds HSM, full DFLASH, and doubled DSPR for enhanced security and data logging; versus S32K344, it retains critical legacy automotive interfaces (FlexRay, SENT) while delivering comparable ASIL-D capability within TriCore toolchain continuity.

Availability

TC333LP32F300FAAKXUMA1 is available at Aetrix Electronics and suitable for powertrain control units, electric power steering modules, brake-by-wire systems, and ADAS domain controllers requiring stable component supply across automotive production lifecycles.

Supply support for TC333LP32F300FAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich with global R&D and manufacturing facilities.

This device belongs to the AURIX™ TC3xx family - engineered specifically for safety-critical automotive applications demanding ASIL-D compliance, real-time determinism, and multi-interface connectivity in powertrain, chassis, and ADAS systems.

FAQ

What is the maximum junction temperature rating for TC333LP32F300FAAKXUMA1?

The device is qualified for operation up to 150°C junction temperature per AEC-Q100 Grade 0 specification. This rating is validated across the full voltage and frequency range, enabling deployment in under-hood environments such as engine control modules without derating.

Does TC333LP32F300FAAKXUMA1 include hardware cryptographic acceleration?

Yes - an optional Hardware Security Module (HSM) is integrated and enabled in this variant. It supports AES-128/256 encryption/decryption, SHA-256 hashing, RSA-2048 signature verification, and secure key storage with tamper-resistant memory protection.

Can TC333LP32F300FAAKXUMA1 operate without an external crystal?

No - the device requires an external 20–40 MHz crystal connected to OSC_IN/OSC_OUT pins for reliable system clock generation. The internal RC oscillator is not qualified for production use and lacks the stability needed for CAN FD or FlexRay timing compliance.

How many CAN FD interfaces does TC333LP32F300FAAKXUMA1 support?

It integrates two MCMCAN modules supporting four total CAN FD nodes - each node capable of up to 5 Mbit/s data rate with flexible bit timing, CRC-17/21, and error confinement. All nodes share common message RAM and support hardware FIFOs for deterministic reception.

TC333LP32F300FAAKXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-TQFP Exposed Pad
Series:
AURIX™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
TriCore™
Core Size:
32-Bit Single-Core
Speed:
300MHz
Connectivity:
DMA, I2S, PWM, WDT
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
-
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
248K x 8
Voltage - Supply (Vcc/Vdd):
3.3V, 5V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

TC333LP32F300FAAKXUMA1 FAQ

1.How can I place an order for TC333LP32F300FAAKXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC333LP32F300FAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC333LP32F300FAAKXUMA1 reliable?

The price and inventory of TC333LP32F300FAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC333LP32F300FAAKXUMA1 is usually 5 days.

3.What payment methods are accepted for TC333LP32F300FAAKXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC333LP32F300FAAKXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC333LP32F300FAAKXUMA1?

TC333LP32F300FAAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC333LP32F300FAAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC333LP32F300FAAKXUMA1?

For technical support, including TC333LP32F300FAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC333LP32F300FAAKXUMA1 requirements.

6.How does Aetrix verify that TC333LP32F300FAAKXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC333LP32F300FAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC333LP32F300FAAKXUMA1 meets industry standards.

7.What is the process for return or replacement of TC333LP32F300FAAKXUMA1?

All TC333LP32F300FAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC333LP32F300FAAKXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC333LP32F300FAAKXUMA1 part is unused and in its original packaging.

Return procedure for TC333LP32F300FAAKXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TC333LP32F300FAAKXUMA1 Tags

  • TC333LP32F300FAAKXUMA1
  • TC333LP32F300FAAKXUMA1 PDF
  • TC333LP32F300FAAKXUMA1 Datasheet
  • TC333LP32F300FAAKXUMA1 Specifications
  • TC333LP32F300FAAKXUMA1 Images
  • Infineon Technologies
  • Infineon Technologies TC333LP32F300FAAKXUMA1
  • Buy TC333LP32F300FAAKXUMA1
  • TC333LP32F300FAAKXUMA1 Price
  • TC333LP32F300FAAKXUMA1 Distributor
  • TC333LP32F300FAAKXUMA1 Supplier
  • TC333LP32F300FAAKXUMA1 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER