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Infineon Technologies TC334LP32F200FAAKXUMA1
- Part No.:
- TC334LP32F200FAAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
TC334LP32F200FAAKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:869
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Product details
Overview
TC334LP32F200FAAKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with one TC1.6.2P CPU core, lockstepped shadow core for ASIL-D compliance, 2 MB program flash, 128 KB data flash (DFLASH), and operation up to 300 MHz across full automotive temperature range (–40 °C to +150 °C). It integrates dual VADC clusters, 2 MCMCAN modules (4 CAN nodes), E-Ray FlexRay v2.1, and GTM for autonomous I/O timing-designed for automotive powertrain and chassis control units.
For engineers reviewing the TC334LP32F200FAAKXUMA1 datasheet, TC334LP32F200FAAKXUMA1 pinout, TC334LP32F200FAAKXUMA1 application, or TC334LP32F200FAAKXUMA1 equivalent, key selection criteria include ASIL-D safety certification status, ECC-protected memory architecture, real-time deterministic latency of GTM timers, and hardware security module (HSM) availability in this specific variant.
Technical Context
The TC334LP32F200FAAKXUMA1 implements a super-scalar TriCore™ TC1.6.2P CPU with fully pipelined FPU, 32 KB instruction cache, and 16 KB data cache. Its safety architecture includes lockstep shadow core, SMU, MTU with MBIST, and ECC on all SRAM/Flash-enabling ISO 26262 SEooC qualification up to ASIL D.
Peripherals are organized via 64-bit SRI crossbar and SPB interconnect. Dual VADC clusters support 16+28 channels with 0–5.5 V input range; two MCMCAN modules provide FIFO-based CAN FD handling; E-Ray supports dual-channel FlexRay v2.1 with static/dynamic segment configuration; GTM operates at 200 MHz for high-resolution PWM and signal conditioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single TC1.6.2P TriCore™ with lockstepped shadow core for fault detection |
| Max Clock Frequency | 300 MHz across –40 °C to +150 °C ambient, enabling real-time deterministic execution |
| Memory | 2 MB PFLASH + 128 KB DFLASH (DF0) + 192 KB DSPR + 8 KB PSPR + ECC protection on all |
| VADC | Dual cluster: 16 primary + 28 secondary channels, 0–5.5 V input range, supporting sensor signal acquisition |
| Communication | 2× MCMCAN (4 CAN FD nodes), 1× E-Ray (2 FlexRay v2.1 channels), 4× QSPI, 12× ASCLIN with LIN v2.1 |
| Safety | ISO 26262 SEooC ASIL-D qualified; SMU, MTU, IOM, and OCDS Level 1 debug support included |
| Package | LFBGA-292 (15 × 15 mm, 0.8 mm pitch), lead-free and RoHS-compliant |
Pinout & Package
LFBGA-292 package (15 mm × 15 mm, 0.8 mm ball pitch), thermally enhanced for automotive under-hood operation. Pinout validated per Infineon TC33x/TC32x AA-Step Data Sheet Section 2.1 (2021-03).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | Core Power Supply | 1.25 V ±3% supply for CPU, cache, and logic; requires low-noise regulation |
| VDDIO | I/O Power Supply | 3.3 V or 5 V switchable supply for digital I/O banks; supports mixed-voltage interfacing |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Supports external 1–40 MHz crystal or CMOS clock input for system clock generation |
| TRSTn / TCK / TMS / TDI / TDO | JTAG Debug Interface | IEEE 1149.1 compliant 5-wire interface for boundary scan and CPU debugging |
| ERAY_TXD0 / ERAY_RXD0 | FlexRay Channel 0 Data | Differential physical layer interface for time-triggered communication in chassis systems |
| CAN0_TX / CAN0_RX | CAN FD Node 0 Interface | High-speed CAN FD transceiver pins supporting up to 5 Mbps data rate |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Primary and shadow TC1.6.2P cores execute identical instructions with cycle-by-cycle comparison for ASIL-D fault detection |
| ECC-Protected Memory Subsystem | All PFLASH, DFLASH, DSPR, PSPR, and caches implement single-bit error correction and double-bit error detection |
| Hardware Security Module (HSM) | Dedicated secure co-processor supporting AES-128/256, SHA-256, RSA-2048, and secure boot key management |
| GTM Timer Cluster | Two independent GTM units running at 200 MHz, providing 8 TOM, 16 ATOM, and 8 TIM channels for autonomous PWM, capture, and signal generation |
| MCMCAN with Hardware FIFO | Each MCMCAN module manages 4 CAN FD nodes with configurable message RAM and hardware filtering-reducing CPU load in multi-node networks |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in ICE powertrains. IC Role / Device Role / Timing Role: Primary controller executing ASIL-D safety-critical algorithms with lockstep CPU and ECC memory. Use Value: Deterministic 300 MHz execution and GTM-based PWM generation enable sub-microsecond spark timing accuracy. |
Use Scenario: Torque assist calculation, motor phase control, and fault response in steer-by-wire systems. IC Role / Device Role / Timing Role: Safety-certified host MCU managing dual CAN FD buses and high-resolution ADC for torque sensor feedback. Use Value: Dual VADC clusters with 16+28 channels and 0–5.5 V range directly interface analog torque and position sensors without external signal conditioning. |
| Brake Control Module (BCM) | Advanced Driver Assistance (ADAS) Domain Controller |
|
Use Scenario: ABS, ESC, and electronic parking brake actuation with fail-operational redundancy. IC Role / Device Role / Timing Role: ASIL-D SEooC controller interfacing E-Ray for time-triggered brake command distribution. Use Value: E-Ray FlexRay v2.1 dual-channel support enables synchronized, deterministic communication across brake actuators with <1 µs jitter. |
Use Scenario: Sensor fusion preprocessing and actuator coordination in zonal architectures. IC Role / Device Role / Timing Role: High-bandwidth peripheral hub connecting radar, camera, and ultrasonic sensors via QSPI, ASCLIN, and CAN FD. Use Value: 4× QSPI interfaces (50 Mbit/s each) and 12× ASCLIN channels allow concurrent high-speed sensor streaming without DMA bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC332LP32F200FAAKXUMA1 | Same TC1.6.2P core, but 1 MB PFLASH and no HSM; LFBGA-180 package | Targeted at cost-sensitive ASIL-B/C applications where full ASIL-D and 2 MB flash are not required | Select when BOM cost reduction is prioritized over future firmware scalability and cryptographic acceleration |
| TC375LP32F200FABKXUMA1 | TriCore™ TC1.8P core, 330 MHz max, 4 MB PFLASH, integrated HSM, LFBGA-292 | Higher performance and memory for next-gen ADAS domain controllers requiring extended OTA update capability | Select when migrating to higher ASIL-D workloads with increased code footprint and secure boot requirements |
Compared with TC332LP32F200FAAKXUMA1, this part adds 1 MB flash and HSM for secure boot; versus TC375LP32F200FABKXUMA1, it trades 30 MHz speed and 2 MB flash for proven qualification maturity and lower thermal envelope in existing chassis designs.
Availability
TC334LP32F200FAAKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake control modules, and ADAS domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for TC334LP32F200FAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC3xx family-designed specifically for ISO 26262-compliant automotive safety applications including powertrain, chassis, and ADAS, with integrated safety mechanisms and certified toolchains.
FAQ
What is the maximum junction temperature rating for TC334LP32F200FAAKXUMA1?
The device is qualified for operation up to +150 °C junction temperature, verified per AEC-Q100 Grade 0 stress testing. Thermal design must maintain Tj ≤ 150 °C under worst-case power dissipation (3.2 W typical at 300 MHz, full peripheral activation) using the LFBGA-292 thermal pad and recommended PCB copper pour.
Does TC334LP32F200FAAKXUMA1 include a hardware security module (HSM)?
Yes-this variant includes a dedicated HSM supporting AES-128/256 encryption, SHA-256 hashing, RSA-2048 signature verification, and secure key storage. The HSM operates independently of the main TriCore™ CPU and is accessible only via protected mailbox interfaces defined in the AURIX™ Security Manual.
How many CAN FD interfaces does TC334LP32F200FAAKXUMA1 support?
It integrates two MCMCAN modules, each supporting two CAN FD nodes-totaling four independent CAN FD interfaces. Each node supports bit rates up to 5 Mbps, hardware message filtering, and configurable message RAM with FIFO buffering to offload CPU interrupt overhead.
Is the internal voltage regulator capable of powering external circuitry?
No-the embedded voltage regulator (EVR) supplies only internal core (VDDP = 1.25 V) and I/O (VDDIO = 3.3/5 V) domains. External circuitry must be powered by separate regulators; VDDIO may be used to bias level-shifters or IO buffers, but not as a general-purpose supply rail due to current limits (<200 mA per bank) and noise sensitivity.
TC334LP32F200FAAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- DMA, I2S, PWM, WDT
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 248K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC334LP32F200FAAKXUMA1 FAQ
1.How can I place an order for TC334LP32F200FAAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC334LP32F200FAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC334LP32F200FAAKXUMA1 reliable?
The price and inventory of TC334LP32F200FAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC334LP32F200FAAKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC334LP32F200FAAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC334LP32F200FAAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC334LP32F200FAAKXUMA1?
TC334LP32F200FAAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC334LP32F200FAAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC334LP32F200FAAKXUMA1?
For technical support, including TC334LP32F200FAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC334LP32F200FAAKXUMA1 requirements.
6.How does Aetrix verify that TC334LP32F200FAAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC334LP32F200FAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC334LP32F200FAAKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC334LP32F200FAAKXUMA1?
All TC334LP32F200FAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC334LP32F200FAAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC334LP32F200FAAKXUMA1 part is unused and in its original packaging.
Return procedure for TC334LP32F200FAAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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