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Infineon Technologies TC334LP32F300FAAKXUMA1
- Part No.:
- TC334LP32F300FAAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
TC334LP32F300FAAKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:948
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Product details
Overview
TC334LP32F300FAAKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with one TC1.6.2P CPU core operating up to 300 MHz, 2 MB program flash, 128 KB data flash (DFLASH), ECC-protected SRAM including 192 KB DSPR and 8 KB PSPR, and integrated safety features compliant with ISO 26262 ASIL D for automotive powertrain and chassis control applications.
For engineers reviewing the TC334LP32F300FAAKXUMA1 datasheet, TC334LP32F300FAAKXUMA1 pinout, TC334LP32F300FAAKXUMA1 application, or TC334LP32F300FAAKXUMA1 equivalent, key selection considerations include its lockstepped shadow core architecture, dual VADC clusters supporting 0–5.5 V input range, 2 MCMCAN nodes with FIFO buffering, GTM-based autonomous I/O timing, and HSM-enabled secure boot capability.
Technical Context
The TC334LP32F300FAAKXUMA1 implements a safety-critical real-time architecture centered on a lockstepped TriCore™ TC1.6.2P CPU with full pipeline FPU and dual MAC units, supported by ECC-protected memory subsystems and hardware safety monitors including SMU, MTU, and IOM. Its clock system integrates independent SYS_PLL and PER_PLL for deterministic timing separation between core and peripheral domains.
It delivers deterministic I/O control via two GTM clusters running at 200 MHz, each providing TOM/ATOM timers, pattern generation, and SENT sensor interface support across six channels. Communication is handled by four QSPI interfaces (up to 50 Mbit/s), twelve ASCLIN channels with LIN v2.1 compliance, and two MCMCAN modules with four CAN nodes and dedicated message RAM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TriCore™ TC1.6.2P, super-scalar 32-bit, lockstepped with shadow core for ASIL D fault detection |
| Max Clock Frequency | 300 MHz across full industrial temperature range (−40 °C to +125 °C) |
| Memory | 2 MB PFLASH (ECC-protected), 128 KB DFLASH (DF0) for EEPROM emulation, 192 KB DSPR + 8 KB PSPR SRAM |
| Analog Peripherals | Dual VADC clusters: 16 primary + 28 secondary channels, 0–5.5 V input range, hardware oversampling support |
| Communication Interfaces | 2× MCMCAN (4 CAN nodes), 4× QSPI (master/slave, 50 Mbit/s), 12× ASCLIN (LIN v2.1), 1× FlexRay™ E-Ray v2.1 |
| Safety Features | ISO 26262 SEooC certified up to ASIL D; includes SMU, MTU, IOM, BRC, and optional HSM for secure boot & crypto |
| Package | LFBGA-292 (15 × 15 mm, 0.8 mm pitch), lead-free, RoHS-compliant, automotive-grade reflow profile |
Pinout & Package
LFBGA-292 package with 15 × 15 mm body, 0.8 mm ball pitch, and standard automotive thermal pad layout. Pin mapping aligns with TC33x LP feature package specification per section 2.1 of the AA-Step datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU, cache, and internal logic; requires low-noise regulation and local decoupling |
| VDDP_3P3 | I/O Power Supply | 3.3 V supply for GPIO, ASCLIN, QSPI, and CAN transceivers; supports 5 V-tolerant inputs |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Connects to external 20–40 MHz crystal for system clock generation; internal oscillator supports backup mode |
| TRSTN / TCK / TMS / TDI / TDO | JTAG Debug Interface | IEEE 1149.1 compliant 5-wire boundary scan and debug access; supports OCDS Level 1 tracing |
| ERAY_TXD0 / ERAY_RXD0 | FlexRay Channel 0 Data | Differential physical layer interface for time-triggered communication; requires matched impedance routing |
| ETH_MDIO / ETH_MDC | Ethernet Management Interface | Not implemented on TC334LP32F300FAAKXUMA1 - pins reserved/no function per datasheet Table 2-1 |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Primary and shadow TC1.6.2P cores execute identical instructions with cycle-accurate comparison to detect transient faults |
| ECC-Protected Memory Subsystem | All PFLASH, DFLASH, DSPR, PSPR, and DCACHE/ICACHE implement single-bit error correction and double-bit error detection |
| Hardware Safety Monitor (SMU) | Centralized alarm management for clock failure, temperature violation, voltage drop, and watchdog timeout events |
| GTM-Based Autonomous I/O Control | Two GTM clusters operate independently at 200 MHz to offload CPU from PWM generation, SENT decoding, and capture/compare tasks |
| MCMCAN with Message RAM | Integrated CAN FD controller with 4 independent nodes, configurable message RAM, and hardware FIFO for zero-CPU-load reception |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire Control Unit |
|---|---|
|
Use Scenario: Real-time torque calculation, motor phase current sensing, and fail-safe actuator command execution in steering column-mounted EPS systems. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL D software stack with lockstep CPU, dual VADC for current sensing, and GTM-driven PWM for 3-phase inverter gate drive. Use Value: Enables <10 µs interrupt latency and hardware-enforced safe state activation within 5 ms upon fault detection per ISO 26262 requirements. |
Use Scenario: Closed-loop pressure control and redundancy management in electro-hydraulic brake actuators requiring dual independent control paths. IC Role / Device Role / Timing Role: Dual-core safety controller managing two independent hydraulic circuits via MCMCAN nodes and SENT-based pressure sensor feedback. Use Value: Delivers synchronized 100 µs control loop execution across both channels using GTM timer synchronization and shared memory coherency. |
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|
Use Scenario: Fuel injection timing, ignition spark control, and exhaust gas recirculation (EGR) valve actuation in gasoline direct injection engines. IC Role / Device Role / Timing Role: High-performance real-time controller with CCU6 modules for precise 10 ns-resolution PWM generation and VADC for wideband O2 sensor signal conditioning. Use Value: Supports <500 ns jitter-free PWM edge placement and hardware oversampling for sub-12-bit effective resolution on lambda sensors. |
Use Scenario: Clutch engagement sequencing, gear shift scheduling, and torque converter lock-up control in 8-speed automatic transmissions. IC Role / Device Role / Timing Role: Deterministic timing controller using GTM TOM modules for synchronized solenoid driver timing and ASCLIN-based transmission sensor bus communication. Use Value: Achieves <2 µs inter-channel skew between 8 solenoid drivers and supports real-time diagnostics via built-in IOM digital I/O monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-integrity automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC332LP24F200FABKXUMA1 | Lower frequency (200 MHz), reduced memory (1 MB PFLASH, 64 KB DFLASH), no HSM, LFBGA-180 package | Suitable for ASIL B/C applications like HVAC control or body domain ECUs where full ASIL D certification is not required | Select when cost-sensitive designs tolerate reduced performance headroom and omit secure boot requirements |
| TC375LP64F300FABKXUMA1 | TriCore™ TC1.8.2P core, 300 MHz, 4 MB PFLASH, 256 KB DFLASH, dual HSM, LFBGA-292 but different pinout and power sequencing | Targeted for zonal controllers and ADAS domain masters requiring higher memory bandwidth and dual-security partitioning | Choose for next-gen architectures needing scalable memory, enhanced crypto acceleration, and multi-zone isolation |
Compared with TC332LP24F200FABKXUMA1, this part adds ASIL D certification, HSM, and larger memory; versus TC375LP64F300FABKXUMA1, it trades memory capacity and dual-HSM for lower BOM cost and proven qualification in powertrain production programs.
Availability
TC334LP32F300FAAKXUMA1 is available at Aetrix Electronics and suitable for electric power steering, brake-by-wire, engine control, and transmission control applications requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 Grade 1 qualification.
Supply support for TC334LP32F300FAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, security ICs, and RF solutions, headquartered in Munich with global R&D and manufacturing operations.
This device belongs to the AURIX™ TC3xx family-designed specifically for safety-critical automotive applications such as powertrain, chassis, and advanced driver assistance systems (ADAS), with architectural features aligned to ISO 26262 ASIL D requirements.
FAQ
What is the maximum operating temperature range for TC334LP32F300FAAKXUMA1?
The TC334LP32F300FAAKXUMA1 is qualified for operation from −40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This rating applies to all functional blocks including CPU, memory, VADC, and communication peripherals under specified supply voltage and load conditions per Section 3.4 of the datasheet.
Does TC334LP32F300FAAKXUMA1 include hardware cryptographic acceleration?
Yes-when configured with the optional Hardware Security Module (HSM), the device supports AES-128/256, SHA-256, RSA-2048, and ECC-256 acceleration, along with secure key storage and protected boot ROM execution. HSM presence is indicated by the "F" in the order code and must be enabled during configuration.
Can TC334LP32F300FAAKXUMA1 support CAN FD communication?
Yes-the two MCMCAN modules support CAN FD protocol up to 5 Mbit/s data phase, with programmable bit timing, flexible data length (up to 64 bytes), and hardware message filtering. Each module supports four independent CAN nodes with dedicated message RAM and FIFO structures.
Is external RAM required for typical automotive applications?
No-on-chip memory resources are sufficient for most ASIL D applications: 192 KB DSPR and 8 KB PSPR provide ample scratchpad space for real-time control algorithms, while 2 MB PFLASH and 128 KB DFLASH accommodate application code, calibration data, and EEPROM emulation without external expansion.
TC334LP32F300FAAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 300MHz
- Connectivity:
- DMA, I2S, PWM, WDT
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 248K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC334LP32F300FAAKXUMA1 FAQ
1.How can I place an order for TC334LP32F300FAAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC334LP32F300FAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC334LP32F300FAAKXUMA1 reliable?
The price and inventory of TC334LP32F300FAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC334LP32F300FAAKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC334LP32F300FAAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC334LP32F300FAAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC334LP32F300FAAKXUMA1?
TC334LP32F300FAAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC334LP32F300FAAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC334LP32F300FAAKXUMA1?
For technical support, including TC334LP32F300FAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC334LP32F300FAAKXUMA1 requirements.
6.How does Aetrix verify that TC334LP32F300FAAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC334LP32F300FAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC334LP32F300FAAKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC334LP32F300FAAKXUMA1?
All TC334LP32F300FAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC334LP32F300FAAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC334LP32F300FAAKXUMA1 part is unused and in its original packaging.
Return procedure for TC334LP32F300FAAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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