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Infineon Technologies TC337DA32F300SAAKXUMA1
- Part No.:
- TC337DA32F300SAAKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC337DA32F300SAAKXUMA1.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:999
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Product details
Overview
TC337DA32F300SAAKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring a single TC1.6.2P CPU core operating at up to 300 MHz, 2 MB program flash, 128 KB data flash (DFLASH0), and ECC-protected SRAM including 192 KB DSPR and 8 KB PSPR. It integrates dual ASCLIN with LIN support, 2 MCMCAN nodes, 4 QSPI channels, and GTM for autonomous I/O timing - deployed in automotive powertrain control units.
For engineers reviewing the TC337DA32F300SAAKXUMA1 datasheet, TC337DA32F300SAAKXUMA1 pinout, TC337DA32F300SAAKXUMA1 application, or TC337DA32F300SAAKXUMA1 equivalent, key selection criteria include ASIL-D safety certification readiness, lockstep CPU architecture, integrated HSM option, 300 MHz real-time deterministic execution, and automotive-grade temperature range (–40 °C to 125 °C).
Technical Context
The TC337DA32F300SAAKXUMA1 implements a lockstepped TriCore™ TC1.6.2P CPU with full pipeline FPU and dual MAC capability, enabling deterministic 300 MHz operation across –40 °C to +125 °C. Its memory subsystem includes 2 MB PFLASH with ECC, 128 KB DFLASH0 for EEPROM emulation, and 192 KB DSPR for real-time data buffering.
On-chip peripherals are safety-architected: 2 MCMCAN modules support CAN FD with FIFO-based message handling; GTM provides hardware-timed SENT, PWM, and capture/compare functions; E-Ray module complies with FlexRay v2.1 for time-triggered communication; SMU and MTU deliver ISO 26262 ASIL-D compliant safety monitoring and memory self-test.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single TriCore™ TC1.6.2P with lockstepped shadow core for ASIL-D compliance |
| Max Clock Frequency | 300 MHz across full industrial temperature range (–40 °C to +125 °C) |
| Flash Memory | 2 MB program flash (PFLASH) with ECC; 128 KB data flash (DFLASH0) for EEPROM emulation |
| SRAM | 192 KB data scratch-pad RAM (DSPR), 8 KB instruction scratch-pad RAM (PSPR), 8 KB DLMU |
| Peripheral Integration | 2 × MCMCAN (4 CAN nodes), 4 × QSPI (50 Mbit/s), 12 × ASCLIN (LIN v2.1), 1 × E-Ray (FlexRay v2.1), 2 × GTM clusters |
| Safety Certification | ISO 26262 SEooC qualified up to ASIL D; AEC-Q100 Grade 1 qualified (per released sales code) |
| Debug Interface | Four-wire JTAG (IEEE 1149.1) and ARM CoreSight DAP supporting OCDS Level 1 and real-time trace |
Pinout & Package
LFBGA-292 package (15 × 15 mm, 0.8 mm pitch) with 292 solder balls; thermal pad on underside for enhanced heat dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Core Power Supply | 1.3 V supply for CPU, cache, and internal logic; requires low-noise regulation and local decoupling |
| VDDA_5V0 | Analog ADC Supply | 5.0 V supply for VADC cluster; enables 0–5.5 V input range and high-precision sensor interfacing |
| ASCLIN0_TX | LIN/CAN Physical Layer Output | Drives LIN bus master output with slew-rate control; supports LIN v2.1 protocol stack in hardware |
| MCMCAN0_TX | CAN FD Transmitter Output | Differential CAN FD signal path routed to external transceiver; supports bit rates up to 5 Mbps |
| ECLK | External Crystal Input | Accepts 40 MHz crystal for system clock generation; feeds SYS_PLL for precise 300 MHz core derivation |
| TMS / TCK / TDI / TDO | JTAG Debug Interface | IEEE 1149.1 boundary-scan and debug access; enables non-intrusive multi-core debugging and flash programming |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Primary TC1.6.2P core continuously verified against shadow core to detect transient faults - foundational for ASIL-D functional safety compliance |
| Hardware Security Module (HSM) | Optional embedded cryptographic accelerator supporting AES-128/256, SHA-256, RSA-2048, and secure boot key management per EVITA Medium profile |
| GTM Timing Engine | Two independent GTM clusters running at 200 MHz provide hardware-offloaded PWM generation, SENT decoding, and time-triggered I/O without CPU intervention |
| ECC-Protected Memory Subsystem | All PFLASH, DFLASH, DSPR, PSPR, and DCACHE/ICACHE implement SEC-DED ECC - prevents silent data corruption in safety-critical storage |
| Integrated Safety Management Unit (SMU) | Monitors 30+ internal failure indicators (clock faults, voltage monitors, watchdog timeouts) and triggers safe state transitions per ISO 26262 requirements |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection sequencing, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary safety-certified controller executing ASIL-D software partitions with lockstep CPU and SMU-monitored execution. Use Value: 300 MHz deterministic execution ensures sub-microsecond response to crankshaft position interrupts; GTM handles high-frequency PWM for injector drivers without CPU load. |
Use Scenario: Torque assist calculation, motor phase current control, and fault-safe torque limitation in column-assist EPS systems. IC Role / Device Role / Timing Role: Dual MCMCAN interfaces manage communication with vehicle CAN backbone and motor driver ICs; E-Ray synchronizes with ADAS domain controllers. Use Value: Hardware SENT receivers decode wheel speed and torque sensor signals at 125 kbps; VADC achieves ±0.5 LSB INL for precise current sensing in 3-phase inverter feedback loops. |
| Brake-by-Wire Actuator | Vehicle Domain Controller |
Use Scenario: Closed-loop pressure control of hydraulic modulators during ABS, AEB, and ESC interventions. IC Role / Device Role / Timing Role: Safety island processor managing actuator diagnostics, valve driver control, and fail-operational fallback logic. Use Value: Lockstep CPU validates all critical control outputs; SMU triggers hardware reset within 10 µs upon detected clock or memory error - meeting ASIL-D fault reaction time targets. |
Use Scenario: Centralized coordination of ADAS, infotainment, and body electronics via high-speed inter-domain communication. IC Role / Device Role / Timing Role: High-bandwidth gateway node using QSPI for external flash expansion and ASCLIN for legacy LIN subnets. Use Value: 64-channel DMA enables zero-copy data movement between CAN, FlexRay, and Ethernet interfaces; 2 MB PFLASH stores multiple firmware images for OTA updates with rollback capability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC336DA32F300SAAKXUMA1 | Same TC33x family, but with reduced peripheral set: no E-Ray, only 1 MCMCAN, 128 KB total flash (64 KB PFLASH + 64 KB DFLASH) | Suitable for cost-sensitive ASIL-B applications like HVAC control or lighting modules where FlexRay or dual CAN FD is unnecessary | Select when full ASIL-D capability and 2 MB flash are not required - reduces BOM cost and PCB footprint |
| S32K344WAT0VLQY | NXP S32K3 series Arm Cortex-M7 core, 320 MHz, 4 MB flash, no TriCore architecture or GTM; uses DSPI instead of QSPI and lacks SENT hardware | Targets next-gen zonal architectures requiring Arm ecosystem compatibility and AUTOSAR Adaptive support, not legacy TriCore toolchains | Choose for new designs prioritizing Arm software portability and adaptive middleware over TriCore real-time determinism and GTM offload |
Compared with TC336DA32F300SAAKXUMA1, this part adds E-Ray, second MCMCAN, and 2× flash capacity for ASIL-D brake-by-wire; versus S32K344, it retains TriCore's deterministic timing and GTM-based sensor processing but requires Infineon-specific tooling and safety certification packages.
Availability
TC337DA32F300SAAKXUMA1 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake-by-wire actuators, and vehicle domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for TC337DA32F300SAAKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, headquartered in Munich.
This device belongs to the AURIX™ TC3xx family - engineered specifically for ISO 26262-compliant automotive safety applications including powertrain, chassis, and ADAS domains, with emphasis on real-time determinism and hardware-based fault containment.
FAQ
What is the maximum junction temperature rating for TC337DA32F300SAAKXUMA1?
The device is qualified per AEC-Q100 Grade 1, specifying an operational ambient temperature range of –40 °C to +125 °C. Its maximum junction temperature is 150 °C, validated under worst-case power dissipation and board-level thermal conditions defined in the datasheet's thermal characteristics section.
Does TC337DA32F300SAAKXUMA1 include hardware support for Secure Boot?
Yes - when configured with the optional Hardware Security Module (HSM), it supports secure boot via immutable ROM-based bootloader that verifies digital signatures of application firmware using ECDSA-P256 before execution, with keys stored in tamper-resistant HSM memory.
Can the VADC module measure signals beyond 5.0 V?
The VADC input voltage range is specified as 0 V to 5.5 V relative to its analog supply (VDDA_5V0). Direct measurement above 5.0 V requires external resistive scaling; the module does not support internal programmable gain amplifiers or overvoltage protection beyond this rail.
Is JTAG the only debug interface supported?
No - the device supports both IEEE 1149.1 four-wire JTAG and ARM CoreSight Device Access Port (DAP) interfaces. DAP enables higher-bandwidth debug sessions and is required for certain real-time trace features, while JTAG remains fully compatible with standard boundary-scan tools.
TC337DA32F300SAAKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit Single-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, LINbus, QSPI, SENT
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 1.53K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC337DA32F300SAAKXUMA1 FAQ
1.How can I place an order for TC337DA32F300SAAKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC337DA32F300SAAKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC337DA32F300SAAKXUMA1 reliable?
The price and inventory of TC337DA32F300SAAKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC337DA32F300SAAKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC337DA32F300SAAKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC337DA32F300SAAKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC337DA32F300SAAKXUMA1?
TC337DA32F300SAAKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC337DA32F300SAAKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC337DA32F300SAAKXUMA1?
For technical support, including TC337DA32F300SAAKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC337DA32F300SAAKXUMA1 requirements.
6.How does Aetrix verify that TC337DA32F300SAAKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC337DA32F300SAAKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC337DA32F300SAAKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC337DA32F300SAAKXUMA1?
All TC337DA32F300SAAKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC337DA32F300SAAKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC337DA32F300SAAKXUMA1 part is unused and in its original packaging.
Return procedure for TC337DA32F300SAAKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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